Abstract

In this chapter, thin film MEMS is reviewed in relation to the PZT-based high-performance ferroelectric thin films. MEMS devices comprise a variety of functional thin film devices for sensors and actuators. The micro-fluid chemical MEMS device, for example, comprises functional thin film devices including thin films micro-heaters, thin film temperature sensors, and/or thin film pumps. These thin film functional devices are carefully integrated on Si wafer by the Si-IC based micro-fabrication technology. Sputtering technology is useful for making thin film MEMS. The functional thin film devices are fabricated by a complex compound and/or alloy. Sputtering makes these complex functional thin film devices for MEMS. The basic data of the thin film functional devices are described in foregoing chapters. Among the functional thin film materials for MEMS, piezoelectric thin films are key functional materials at present and in the future. This chapter first describes piezoelectric thin film materials for MEMS. Second, high-performance piezoelectric thin film materials for MEMS are described. The sputtering process described in this chapter is useful for creation of the functional MEMS and/or related devices. The other functional materials are also fabricated in a similar way to the thin film piezoelectric materials. The sputtering processing for functional MEMS is not the same as the sputtering processing established for Si-ICs. A special design is necessary for the sputtering system for the fabrication of high-quality MEMS. The present text describes the author’s experimental data for small-scale sputtering processing. However, the small-scale processing data can be applied to large-scale production processing if the readers of this text understand the fundamentals of sputtering deposition.

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