Abstract
In this chapter, basic processes of sputtering deposition are reviewed. Firstly, fundamentals of the controlling film quality are discussed. The epitaxial growth by sputtering is essential for the growth of single-crystal thin films of compound materials. Influenced deposition parameters are discussed in detail for a better control of fine film quality including crystal structure, crystal phase surface roughness, and adhesion. The selections of substrates and sputtering targets are also described for the better quality of sputtered thin films. The reactive sputtering is important for a fabrication of compound thin films in production. Secondly, the fundamentals of the reactive sputtering are reviewed by the expert in this field in relation to the applications for the deposition of functional thin films including high rate sputtering process.
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