Abstract
This paper describes an analysis method of thermal stress generated in the module of SOFC. The module is constructed from variously sized components. For example, cell's thickness is about 2mm, and module's external size is about 500mm. Therefore, the analysis of SOFC module expends very large computational resources and analysis time. To solve this problem, we tried to apply the technique of zooming analysis. We proposed the method to substitute homogeneous material model for the bundle at the overall module analysis and to use the results of overall module's analysis for the boundary condition at the bundle's detail analysis. By the way, the homogeneous material model should simulate the bundle's mechanical properties. And then we verified the precision of this method by comparing homogeneous material model with original material model. At last, we give examples of reliability-evaluation of SOFC module using this method.
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