Abstract
5091. Effects of argon pressure and substrate temperature on the structure and properties of sputtered copper films: S Craig and L HardingJ Vac Sci Technol,19 (2), 1981, 205–215
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
