407 シリコンウェハ MCP 用砥粒の加工特性比較

Abstract

Usefulness of BaCO_3,CaCO_3,ZnO and Mica abrasive is found for super-smooth mechanochemical polishing of large size silicon wafers. Machining characteristics of these abrasives depend on material quality of the polishing plates and polishing conditions. This paper describes comparison of polishing performances of these 4 mechanochemical abrasives. These results would be very useful as the fundamental data for determining optimum polishing conditions required for machining needs like improvement of flatness, smoothness and machining efficiency.