3D-Wiz: A novel high bandwidth, optically interfaced 3D DRAM architecture with reduced random access time

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This paper introduces 3D-Wiz, which is a high bandwidth, low latency, optically interfaced 3D DRAM architecture with fine grained data organization and activation. 3D-Wiz integrates sub-bank level 3D partitioning of the data array to enable fine-grained activation and greater memory parallelism. A novel method of routing the internal memory bus using TSVs and fan-out buffers enables 3D-Wiz to use smaller dimension subarrays without significant area overhead. This in turn reduces the random access latency and activation-precharge energy. 3D-Wiz demonstrates access latency of 19.5ns and row cycle time of 25ns. It yields per access activation energy and precharge energy of 0.78nJ and 0.62nJ respectively with 42.5% area efficiency. 3D-Wiz yields the best latency and energy consumption values per access among other well-known 3D DRAM architectures. Experimental results with PARSEC benchmarks indicate that 3D-Wiz achieves 38.8% improvement in performance, 81.1% reduction in power consumption, and 77.1% reduction in energy-delay product (EDP) on average over 3D DRAM architectures from prior work.