3559 はんだ材のラチェット・クリープ変形特性とシミュレーション(S23-2 弾性・塑性・粘塑性特性,S23 電子実装用はんだの強度特性評価)

Abstract

This paper conducts both experiments and numerical simulations of viscoplastic deformation such as creep and uniaxial ratcheting deformation of solder alloys. The correlation between creep and uniaxial ratcheting deformation is firstly discussed to establish the differences in the time-dependent deformation of lead-free and lead-containing solder alloys. The experiments show that the ratcheting deformation of lead-free solder alloy is much smaller than the lead-containing solder alloy. Especially, there is much difference in the effect of the uniaxial ratcheting on the creep deformation between the two solder alloys. Then numerical simulations are also carried out using the dislocation based constitutive model. There is amoderate agreement between experiment and simulation.