Abstract
AbstractIn this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24–30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in ± 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.
Highlights
The rapid increase in the wireless data demand requires the shift from sub-6 GHz to the millimeter-wave bands
We present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications
At sub-6 GHz bands, antennas are usually designed on a PCB due to longer wavelengths and the application-specific integrated circuit front-end systems are integrated with these antennas with the help of radio frequency (RF) cables and connectors
Summary
The rapid increase in the wireless data demand requires the shift from sub-6 GHz to the millimeter-wave (mm-wave) bands. We present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications.
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