Abstract
ABSTRACTInterest in PVDF-TrFE copolymers as ferroelectric material for Memory application is driven by the prospect of having low cost, low operating voltage and fully organic device. Some previous studies reported FET designs using copolymers [refs 1,2] but none of these structures were fully integrated on silicon wafers and using a MOSFET fabrication process. We present for the first time the integration of a PVDF-TrFE (70%-30%) layer into a standard n-MOS transistor through a quasi-standard semiconductor technology. This allows us to achieve a Non Volatile Memory cell and at the same time to compact capacitor-transistor ferroelectric cell into a one-transistor memory cell.
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