Abstract
Achieving and maintaining high yield during microLED display production requires integration of in‐process EL functional test into the mass‐transfer assembly process flow. Known Good Die (KGD) data from EL emission efficiency and color test of the source carrier substrate is key to directing mass‐transfer assembly of functionally good and matched microLED devices. Mass‐transfer approaches have varying compatibility with in‐process functional test data that can limit yield and throughput. This paper will analyze the issues and challenges of current microLED mass‐transfer technologies in production and compatibility with in‐process test. An optimized process flow utilizing KGD in‐process test and compatible mass‐transfer assembly methods is proposed.
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