Abstract
Sacrificial Metal Wafer Level Burn-In KGD (Known Good Die) is a strategic enabling technology that allows Motorola to maintain its competitive edge in the electronic personal communications, computer and automotive market place. This paper will focus on the development and implementation of 127 mm and 200 mm Sacrificial Metal Wafer Level Burn-In KGD at Motorola Inc. This joint effort between teams at Motorola Austin-TSG (Transportation Systems Group), Motorola Chandler-SMD (Strategic Manufacturing Deployment) and MOS12 at Chandler is currently the only effective WLBI technology in production in the world. The current multi-port system is capable of testing up to twenty-eight 200 mm wafers or forty-eight 127 mm wafers simultaneously. We will discuss the test system design, contact technology and wafer fixture design which enables this low cost solution to KGD. We will also examine the thermal and electrical performance of the system on a port to port basis. We will also examine the thermal and electrical performance across test chamber boundaries.
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