Abstract
Implantation-free mesa-etched ultra-high-voltage (0.08 mm2) 4H-SiC bipolar junction transistors (BJTs) with record current gain of 139 are fabricated, measured, and analyzed by device simulation. High current gain is achieved by optimized surface passivation and optimal cell geometries. The area-optimized junction termination extension is utilized to obtain a high and stable breakdown voltage without ion implantation. The open-base blocking voltage of 15.8 kV at a leakage current density of 0.1 mA/cm2 is achieved. Different cell geometries (single finger, square, and hexagon cell geometries) are also compared.
Published Version
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