14 - CVD in Electronic Applications: Conductors, Insulators, and Diffusion Barriers

Abstract

This chapter discusses the role of chemical vapor deposition (CVD) in electronic applications. It plays an important part in the design and processing of advanced electronic conductors and insulators as well as related structures, such as diffusion barriers and high thermal conductivity substrates (heat-sinks). Materials such as titanium nitride, silicon nitride, silicon oxide, diamond, and aluminum nitride are very useful and are all produced by CVD. The step coverage and conformity of electrical conductors requires the ability to coat a surface with a smooth film of constant thickness, and to fill a contact opening (interconnection) evenly. These are the major considerations for a given conductor material and the deposition process. The thin films of electrical insulators are essential elements in the designing and fabrication of electronic components. The most widely used insulator materials—silicon oxide and silicon nitride—are produced by CVD.