Abstract
This chapter presents the growth and development of the present day x-ray lithography printing methods, mostly from a process and user viewpoint. The x-ray printing method is defined and described as a system in terms of source, mask, aligner, and resist. The important component design error budget factors are detailed to provide both insight and clarity regarding the x-ray system complexity. The strengths and weaknesses of the major x-ray printing system sources and aligners are cited. Some emphasis is then given to mask technology in terms of fabrication, membrane and absorber materials, and absorber patterning. The extent of IC device damage from x-ray lithography process steps is also presented.
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