Abstract
Surface mount technology (SMT) is a revolutionary change in the electronics industries. It enables the electronic industry to progress toward the trends of becoming smaller, lighter, denser, faster, and cheaper. Competing with wave soldering, reflow soldering has become the main stream interconnect technology because of higher yield, throughput, and reliability. Area array packages alleviate pressure on peripheral packages toward finer pitch and provide higher I/O density together with easier manufacturability, smaller package size, and higher speed. The chapter also explains surface mount components (SMC). SMCs are available for almost any type of application, such as capacitors, resistors, transistors, diodes, inductors, ICs, and connectors. However, because of the physical size restriction imposed by the surface mounting process, most SMCs are designed for power dissipation no higher than 1 to 2 W. SMCs can be assembled onto PCBs with the use of solder paste reflow, wave soldering, or conductive adhesive curing processes. The use of conductive adhesive is not common but it can be found in some flexible circuit boards or boards with heat-sensitive components.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
