Abstract
In the classical X-ray lithography, the X-ray beam is perpendicular to both the mask and the resist layer; the beam starts to create microstructure along its path without transverse modulation. With the advanced technique of tilting and rotating the mask/resist layer and due account of properties of X-ray resist, multiple exposure enables creation of real 3D shape with submicrometer accuracy. This paper presents a technique of creation of real 3D microstructures with application of multi-beam X-ray lithography. This technique enables creation of a large number of 3D structures.
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