In this study, the incipient plasticity and voids nucleation of nanocrystalline gold were investigated using a molecular dynamics simulation. The effects of mean grain size and temperature were evaluated in terms of the material's stress-strain diagram, Young's modulus, yield strength, common-neighbor analysis, slip vectors, and deformation behaviors. From the stress-strain diagram, at 300 K, the maximum stress value corresponding to a grain size of 3.2 nm was much lower and the stress curve was clearly different from those corresponding to other grain sizes. Young's modulus increased with increasing mean grain size. The inverse Hall–Petch relation was observed. The slip was the main deformation behavior at a mean grain size of 3.2 nm. Moreover, the internal stress was more pronounced with increasing temperature. At 700 K, the main deformation area range was concentrated in the lattice at the middle of the samples, resulting in an almost force–induced structural transformation phenomenon in the middle. Void damage occurred at the junction of three–grain boundaries during the tensile process. With decreasing mean grain size, the less internal differential slip was generated under the same temperature and strain conditions.