AbstractPolyamides containing double bonds or epoxy groups were synthesized and evaluated as electron beam (EB) resists, in order to find the relationship between electron beam sensitivity and chemical structure of the polyamides. It was found that polyamides containing double bonds, which have good solubility, are easily crosslinked by the electron beam exposure. The sensitivity of a polyamide with 70 mol% of the repeat units containing double bonds was equivalent to that of a 100% unsaturated polyamide which contained double bonds of 100% molar ratios, and thus it is not necessary that the polyamide be a homopolymer of unsaturated repeating units. The polyamides have good physical properties, and are adaptable to dry etching processes.
Read full abstract