Ultrahigh Thermal Conductivity Research Articles

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves-Branches Structure.

In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement approach for fabricating oriented thermal conductivity composites is introduced. Utilizing carbon fibers (CFs), known for their ultra-high thermal conductivity, as branches, this design ensures robust thermal conduction channels. Concurrently, boron nitride (BN) platelets, characterized by their substantial in-plane thermal conductivity, act as leaves. These components not only support the branches but also serve as junctions in the thermal conduction network. Remarkably, the composite achieves a thermal conductivity of 11.08 W/(m·K) with just an 11.1 wt% CF content and a 1.86 g/cm3 density. This study expands the methodologies for achieving highly oriented configurations of fibrous and flake materials, which provides a new design idea for preparing high-thermal conductivity and low-density thermal interface materials.

Enhanced thermal conductivity of CS/BN/Ti3O5 coatings to promote electron transport for ultra-sensitive fire sensing

Intelligent fire warning system is a crucial protective equipment reduce fire hazards. A recent increasing concern is the development of sensitive fire warning materials that can be integrated with combustible materials to provide real-time alarms in the fire. However, current research on improving the sensitivity of fire warning sensors based on temperature-resistance response focuses on constructing continuous conductive networks. The effect of the heat transfer process is ignored, which limits the further improvement of alarm sensitivity. Here, we developed a strategy to improve thermal conductivity. Based on the chitosan (CS) conductive network in Ti3O5-based fire sensing system, aminated 2D h-BN nanosheets with high temperature resistance and ultrahigh in-plane thermal conductivity were further introduced. The h-BN improves the thermal conductivity of the fire warning coating from 1.43 W/m·K to 2.29 W/m·K. Intelligent fire warning sensors with ultra-sensitivity (1.16 s), low response temperature (170 °C), duration time (12 min) and durability (100 cycles) were successfully prepared by improving thermal conductivity to rapidly transfer heat to Ti3O5, which leads to a rapid decrease in resistance as the core mechanism. This work proposed an ingenious strategy for the construction of high fire safety and thermal conduction fireproof coatings, which revealed enticing prospects in the field of intelligent coatings.

Flash soldering of boron nitride nanosheets for all-ceramic films

The assembly of boron nitride nanosheets (BNNSs) into strong, flexible thin films capable of withstanding extreme conditions, such as high/low working temperatures and corrosive environments, holds immense promise for numerous applications. However, BNNSs are difficult to assemble and sinter to achieve the dense thin film structure observed in graphene thin films. We report the rapid fabrication of dense BNNS all-ceramic films (BACFs) in 30 s by combining the fabrication strategies for 2D and ceramic materials. In this process, densely arranged and highly oriented BNNSs are flash soldered into a monolith achieved by precisely controlled ultrafast sintering. This fusion of BNNS leads to an ultrahigh in-plane thermal conductivity of 134.5 W·m−1·K−1, which was among the highest values for BNNS films (mostly ≤ 70 W·m−1·K−1). The as-prepared BACF exhibits the combined advantages of sintered ceramics (durability, stability, acid-alkali resistance) and 2D material films such as flexibility and shock resistance, which is important for practical uses but rarely found in existing ceramics. It also has excellent cooling performance, dielectric properties, and good thermal stability, which is promising for demanding thermal management applications in emerging technologies.

Preparation processes and thermal conductivities of magnetic field- and torsional vibration-induced superoriented carbon fiber composites

With the advancement of semiconductor technology, advanced electronic devices have become increasingly efficient, highly integrated and multifunctional, producing a large amount of heat during operation, thus decreasing the device efficiency and increasing the requirements for thermal interface materials. The use of a magnetic field to prepare pitch-based carbon fibers (CFs) with ultrahigh axial thermal conductivities and aspect ratios is a promising method for preparing thermal interface materials. However, past methods are not adequately simple or effective. Herein, we propose a simple, efficient method for preparing a novel thermally conductive CF interface material with a superoriented and closely arranged structure. The thermal conductivity of the vertical plane can reach 82.026 W m-1 K-1, which is higher than that of many other alloys. During the experiment, we prove that the torsional vibration of the vibrating plate can greatly resolve the issue of powder bridging generated during preparation. In addition, we discover and explain the heat return conduction phenomenon through numerical simulation. Our innovative preparation process and our analysis of thermal conduction can provide a new method and unique view for the design of thermal interface materials.

An Innovative Concept of Membrane-Free Redox Flow Batteries with Near-Zero Contact Distance Between Electrodes.

Given that the ion-exchange membrane takes up more than 30% of redox flow battery (RFB) cost, considerable cost reduction is anticipated with the membrane-free design. However, eliminating the membrane/separator would expose the membrane-free RFBs to a higher risk of short-circuits, and the dendrite growth may aggravate this issue. The current strategy based on expanding distances between electrodes is proposed to address short-circuit issues. Nevertheless, this approach would decrease the energy efficiency (EE) and could not restrain dendrite growth fundamentally. Herein, an inexpensive and electron-insulating boron nitride nanosheets (BNNSs)-Nylon hybrid interlayer (BN/Nylon) is developed for general membrane-free RFBs to achieve "near-zero distance" contact between electrodes. And the Lewis acid sites (B atoms) in BNNS can interact with the Lewis base anions in electrolytes, enabling a reduced Pb2+concentration gradient. Additionally, the ultrahigh thermal conductivity and mechanical strength of BNNSs promote the uniform plating/stripping process of Pb and PbO2. Compared with conventional soluble lead RFBs, introducing BN/Nylon interlayers boosts EE by ≈38.2% at 25mAcm-2, and extends the cycle life to 100 cycles. This innovative strategy premieres the application of the BN/Nylon interlayer concept, offering a novel perspective for the development of general membrane-free RFBs.

Deep-potential enabled multiscale simulation of gallium nitride devices on boron arsenide cooling substrates

High-efficient heat dissipation plays critical role for high-power-density electronics. Experimental synthesis of ultrahigh thermal conductivity boron arsenide (BAs, 1300 W m−1K−1) cooling substrates into the wide-bandgap semiconductor of gallium nitride (GaN) devices has been realized. However, the lack of systematic analysis on the heat transfer across the GaN-BAs interface hampers the practical applications. In this study, by constructing the accurate and high-efficient machine learning interatomic potentials, we perform multiscale simulations of the GaN-BAs heterostructures. Ultrahigh interfacial thermal conductance of 260 MW m−2K−1 is achieved, which lies in the well-matched lattice vibrations of BAs and GaN. The strong temperature dependence of interfacial thermal conductance is found between 300 to 450 K. Moreover, the competition between grain size and boundary resistance is revealed with size increasing from 1 nm to 1000 μm. Such deep-potential equipped multiscale simulations not only promote the practical applications of BAs cooling substrates in electronics, but also offer approach for designing advanced thermal management systems.

Boron nitride nanosheets from high shear exfoliation for high-performance thermal conductivity films

Boron nitride nanosheets (BNNSs) with intrinsically ultra-high thermal conductivity have attracted more and more attention and various methods have been proposed to prepare BNNSs-based thermally conductive adhesives. In this work, a liquid phase shear exfoliation process was proposed to prepare BNNSs. BNNSs can be directly prepared by exfoliating h-BN particles dispersed in isopropanol at a controlled rotational speed range of 16,000–22,000 rpm and the maximum yield of BNNSs is up to 32.1%. After the BNNSs were modified with polydopamine (M-BNNSs), the dispersion performance of BNNSs in water was significantly improved. BNNSs were incorporated into a cellulose nanofiber-based adhesive, and the highly thermally conductive films were prepared by a flow-delay process. A tested in-plane thermal conductivity of up to 23.23 W·m−1·K−1 and excellent mechanical properties are demonstrated and thermal infrared images provide a more visual representation of the high thermal conductivity and heat dissipation properties of the film, indicating the promising application of the film in the field of thermal conductivity.

Phase change composites with ultra-high through-plane thermal conductivity achieved by vertically-aligned graphite film and double-shelled microcapsules

The heat dissipation in electronic devices has become bottleneck problem. One of the best solutions is to develop high performance materials which can not only dissipate the heat away, but also absorb heat energy. This kind of double function materials can be obtained by simultaneously using high thermal conductivity (TC) materials and phase change materials. The formation of continuous network of thermally conductive fillers is demonstrated as one of the most effective methods for fabricating highly thermally conductive composites. Here, graphite films (GF) are stacked and vertically cut to endow the composites with high through-plane TC. The obtained composites exhibit a through-plane TC of 51.55 W m−1 K−1 and a low thermal resistance of 0.398 °C cm2 W−1. Besides, double-shelled PDA@SiO2@paraffin (Pa) microcapsules are embedded into the composite to give its good heat-absorption capacity. Via a CPU thermal stress test, the composites demonstrate satisfactory temperature controlling performance.

Towards zero-carbon solar heating in severe cold and cold regions of China by building integrated heat pipes

As a climate-responsive building, the building integrated heat pipes (BIHP) can greatly improve the indoor thermal environment during the local heating season, utilizing the thermal diode characteristic and ultrahigh equivalent thermal conductivity of the L-shaped flat gravity heat pipe. The thermophysical properties of the internal envelope greatly influence the heating effect, and the utilization potentiality of BIHP varies in locations with diverse climate resources. In this paper, the utilization effects of BIHP at 61 locations in severe cold and cold regions of China are investigated. Improved backtracking search and particle swarm optimization are used to obtain the optimal heating effect and the corresponding thermophysical properties of the internal envelope at zero-carbon heating locations and non-zero-carbon heating locations, respectively. The relationship between the improvement degree of thermal discomfort and the solar radiation over temperature difference is studied, and the utilization potentiality map and zoning of BIHP are obtained. This study is of great significance for promoting the application of climate-responsive BIHP to effectively and efficiently utilize solar energy to reach zero-carbon heating.

All-ceramics with ultrahigh thermal conductivity and superior dielectric properties created at ultralow temperatures

All-ceramics with ultrahigh thermal conductivity and superior dielectric properties created at ultralow temperatures

Facile Synthesis of a Graphene Film with Ultrahigh Thermal Conductivity via a Novel Pressure-Swing Hot-Pressing Method

Facile Synthesis of a Graphene Film with Ultrahigh Thermal Conductivity via a Novel Pressure-Swing Hot-Pressing Method

Multilayered silver nanowires and graphene fluoride-based aramid nanofibers for excellent thermoconductive electromagnetic interference shielding materials with low-reflection

Multilayered films composed of alternating layers of graphene fluoride (GF) and silver nanowires (AgNWs) in an aramid nanofiber (ANF) matrix were fabricated. The films were prepared by sequential vacuum filtration of GF@ANF and AgNWs@ANF suspensions to obtain multilayered composite architectures. The multilayered GF@ANF/AgNWs@ANF films exhibited exceptional mechanical flexibility and strength, with tensile strength up to 130 MPa and 5000 bending cycles with negligible performance deterioration. The films displayed remarkably high electromagnetic interference (EMI) shielding effectiveness up to 54 dB in X-band frequencies, attributed to the multiple internal reflections in the multilayered structure. EMI shielding was dominated by absorption rather than reflection, enabling attenuation of incident microwaves without secondary pollution. The multilayered films also exhibited ultrahigh in-plane thermal conductivity of up to 45 W/mK, owing to the thermally conductive GF and AgNWs networks. The EMI shielding effectiveness and thermal conductivity were retained after temperature and bending cycling. The composite films also demonstrated excellent flame retardancy. This study provides an effective route toward concurrent enhancement of multi-functional properties through architectural engineering at the nanoscale. The combination of robust EMI shielding, mechanical flexibility, thermal management, and fire safety highlights the potential of rationally designed multilayered composites for practical applications in 5 G wearable electronics devices, communications systems, and radar technologies.

The Microstructure and Thermal Conductive Behavior of Three-Dimensional Carbon/Carbon Composites with Ultrahigh Thermal Conductivity.

Carbon-based composite materials, denoted as C/C composites and possessing high thermal conductivity, were synthesized utilizing a three-dimensional (3D) preform methodology. This involved the orthogonal weaving of mesophase pitch-based fibers in an X (Y) direction derived from low-temperature carbonization, and commercial PAN-based carbon fibers in a Z direction. The 3D preforms were saturated with mesophase pitch in their raw state through a hot-pressing process, which was executed under relatively low pressure at a predetermined temperature. Further densification was achieved by successive stages of mesophase pitch impregnation (MPI), followed by impregnation with coal pitch under high pressure (IPI). The microstructure and thermal conductivity of the C/C composites were systematically examined using a suite of analytical techniques, including Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), and PLM, amongst others. The findings suggest that the volumetric fraction of fibers and the directional alignment of the mesophase pitch molecules can be enhanced via hot pressing. The high graphitization degree of the mesophase pitch matrix results in an increased microcrystalline size and thus improved thermal conductivity of the C/C composite. Conversely, the orientation of the medium-temperature coal pitch matrix is relatively low, which compensates for the structural inadequacies of the composite material, albeit contributing minimally to the thermal conductivity of the resultant C/C composites. Following several stages of impregnation with mesophase pitch and subsequent impregnation with medium-temperature coal pitch, the 3D C/C composites yielded a density of 1.83 and 2.02 g/cm3. The thermal conductivity in the X (Y) direction was found to be 358 and 400 W/(m·K), respectively.

Strain-Driven High Thermal Conductivity in Hexagonal Boron Phosphide Monolayer.

Two-dimensional graphenelike material, hexagonal boron phosphide (h-BP), is a promising candidate for electronic and optoelectronic devices because of its suitable band gap and high carrier mobility. Especially from the ultrahigh lattice thermal conductivity (κl), it exhibits great potential to solve the challenges of future thermal management applications. Here, the excellent lattice thermal transport properties of the h-BP monolayer are systematically analyzed at the atomic level based on the first-principles method. The results show that the ultrahigh κl value of the h-BP monolayer is attributed to its high phonon group velocity and long phonon lifetime and the strong phonon hydrodynamic effect. We further explore the influence of the tensile strain on the thermal transport properties of the h-BP monolayer. As the strain increases from 0 to 8%, the κl value shows a trend of first increasing and then decreasing due to the coeffect of strain-driven changes for phonon harmonicity and anharmonicity. Under a strain of 6%, the κl value of the h-BP monolayer is as high as 795 W/mK at 300 K, which is about 2.22 times larger than that of 357 W/mK without strain. Such a significant increase in the κl value is mainly due to the increased phonon group velocity and decreased Grüneisen parameter caused by strain. This work is helpful to understand the critical role of tensile strain in lattice thermal transport of two-dimensional graphenelike materials. It is conducive to promoting the thermal management application of the h-BP monolayer.

Composite of carbon dots and TiNiSn thermoelectric materials: Initial investigation on the electrical and thermal transport properties.

TiNiCu0.025Sn0.99Sb0.01 is prepared using microwaves. However, an ultra-high electrical conductivity and electronic thermal conductivity are obtained by interstitial Cu and Sb doping, which could not effectively improve the ZT value. We introduce carbon dots (CDs) as a nano-second phase by ball milling to simultaneously optimize the thermoelectric properties. To our best knowledge, this is the first report on half-Heusler/CDs composites. Experimental results show that the introduction of nano-CDs optimizes the carrier concentration and mobility and dramatically improves the Seebeck coefficient through the energy filtering effect. The nano-CDs introduce more point defects, inhibit the grains growth, and form a specific carbon solid solution second phase in the matrix. The lattice thermal conductivity is reduced to the same level as TiNiSn at 1.96Wm-1K-1 through the synergistic effect of point defects and phase and grain boundaries scattering, and the ZT value reaches a maximum of 0.63 at 873K.

Bidirectionally promoting assembly order for ultrastiff and highly thermally conductive graphene fibres

Macroscopic fibres assembled from two-dimensional (2D) nanosheets are new and impressing type of fibre materials besides those from one-dimensional (1D) polymers, such as graphene fibres. However, the preparation and property-enhancing technologies of these fibres follow those from 1D polymers by improving the orientation along the fibre axis, leading to non-optimized microstructures and low integrated performances. Here, we show a concept of bidirectionally promoting the assembly order, making graphene fibres achieve synergistically improved mechanical and thermal properties. Concentric arrangement of graphene oxide sheets in the cross-section and alignment along fibre axis are realized by multiple shear-flow fields, which bidirectionally promotes the sheet-order of graphene sheets in solid fibres, generates densified and crystalline graphitic structures, and produces graphene fibres with ultrahigh modulus (901 GPa) and thermal conductivity (1660 W m−1 K−1). We believe that the concept would enhance both scientific and technological cognition of the assembly process of 2D nanosheets.

High Dk and ultra-high thermal conductivity ST/μBN/polyolefin composites for microwave applications

In this work, we examined the structure, microwave dielectric, thermal and mechanical characteristics of composites containing SrTiO3/xμBN/polyolefin (with x at 0, 6, 8, 10 and 12 weight percent). SrTiO3 (ST) and micro boron nitride (μBN) powders were fabricated with 1,2-PB/EPDM/SBS (1,2-PB, EPDM and SBS are abbreviations of 1,2-polybutadienes, ethylene-propylene-dicyclopentadiene and styrene-butadiene-styrene triblock copolymer, respectively) by hot-press process after modified by Vinyltrimethoxysilane (VTMS) and 3-aminopropyltriethoxysilane (KH550), respectively. The ball mill and surface modification procedure enhanced the dispersion of the boron nitride in the solution and promoted compatibility between ceramic particles and polyolefin matrix. The incorporation of BN created more effective boron transfer pathways with ST particles, significantly improving the thermal conductivity of the composite. However, as μBN content increased, more ceramic agglomerates and pores were introduced, deteriorating dielectric, thermal and mechanical properties of the samples. The particle size test and XPS were conducted to determine the effect of surface modification on the dispersion and surface properties of ceramics. Cross-plane thermal conductivity, TGA and stress-strain curves were used to evaluate the thermal and mechanical properties of the composites. In all, a composite with high-Dk and high thermal conductivity was obtained when x = 10 wt.%: Dk = 17.4, Df = 0.0071 and λ = 1.784 W/(m*k), which is promising for microwave applications.

Interface Thermal Conductance and Phonon Thermal Transport Characteristics of Diamond/Carbon Nanotube Interface

As an ultra-wide band gap semiconductor material, diamond is an ideal material for high-power, high-frequency, high-temperature, and low-power loss electronic devices. However, high-frequency and high-power working environment leads to ultra-high local hot spots. Thermal interface material (TIM) is urgently needed to improve interface heat dissipation. Carbon nanotube (CNT), a brand-new generation of TIM, has ultra-high thermal conductivity (6000 W/(m·K)) and is expected to solve the heat dissipation problem of diamond semiconductor. Based on this, we first propose to combine diamond and CNT together so as to improve the performance and stability of semiconductor device and reduce packaging size to achieve miniaturized device design. Here we use reverse non-equilibrium molecular dynamics (RNEMD) method to study the thermal transport characteristics and interface thermal conductance (ITC) at the diamond/CNT interface. Results reveal that increasing CNT layers enhances the overall vibration density of states (VDOS) of CNT and shifts the peak value to the low frequency band, which is more conducive to interface heat transfer. Alternatively, the enhancement of the phonon overlap energy strengthens the coupling vibration of phonon and thus improves the efficiency of the interfacial heat transfer. Moreover, in a certain range, the increase of system temperature and CNT length-to-diameter ratio can raise the cutoff frequency of the VDOS of diamond and CNT near the interface and the peak value of the low frequency band. This further improves the coupling vibration of phonon on both sides. Finally, by orthogonal test simulation, the optimal value of ITC was determined, which is 2.65 GW/(m<sup>2</sup>·K) when the temperature, chirality, layers and length are 900 K, (6, 6), 6 layers and 5 nm respectively. This result significantly surpasses the current ITC of general semiconductors/metal. Compared to general composite materials, diamond/CNT composite material has great potential to enhance heat dissipation. Furthermore, according to P value test, the influence of the number of layers on interfacial thermal transport is extremely significant, while the influence of length, temperature and diameter decreases in turn.

Surface structure design of boron nitride nanotubes and mechanism of their regulation on properties of epoxy composite dielectric

Adding nanofillers into epoxy resin matrices is a common method to achieve their multi-function. Boron nitride nanotubes (BNNTs) with one-dimensional nanostructures have attracted much attention because of their ultra-high thermal conductivity, wide energy level band gap, high aspect ratio and mechanical strength. Yet, the strong π-π non-covalent bonding and lip-lip interactions make BNNTs prone to agglomeration in the epoxy resin matrix. Moreover, the different physicochemical properties of BNNTs and epoxy resins as well as the chemical inertness of BNNTs surface lead to the lack of effective interfacial interaction between BNNTs and epoxy resin matrix. Therefore, the performance of the epoxy composite dielectric is not enhanced by simple blending solely, but will even have the opposite effect. To address the problems of BNNTs, in this study, the surface structure of BNNTs is constructed from the perspective of interface modulation by using sol-gel method to coat mesoporous silica (mSiO<sub>2</sub>) on BNNTs’ surface and further introducing silane coupling agent (KH560). The results indicate that the surface structure of BNNTs can optimize the level of interfacial interaction between BNNTs and epoxy resin matrix, which leads to stronger interfacial connection and elimination of internal pore phenomenon. The dielectric constant and loss of the composite dielectric prepared in this way are further reduced, reaching 4.1 and 0.005 respectively at power frequency, which is significantly lower than that of pure epoxy resin. At the same time, the mechanical toughness (3.01 MJ/m<sup>3</sup>) and thermal conductivity (0.34 W/(m⋅K)) are greatly improved compared with the counterparts of pure epoxy resin. In addition, the unique nano-mesoporous structure of mSiO<sub>2</sub> endows the composite dielectric with a large number of deep traps, which effectively hinders the migration of electrons, thereby improving the electrical strength of the composite dielectric, and the breakdown field strength reaches 95.42 kV/mm. Furthermore, the interfacial mechanism of BNNTs’ surface structure on dielectric relaxation and trap distribution of composite dielectrics is systematically studied by Tanaka multinuclear model. The above results indicate that the good interfacial interaction between BNNTs and epoxy resin matrix is crucial in establishing the micro-interface structure and improving the macroscopic properties of composite dielectrics. This study presents a novel idea for the multifunctionalities of epoxy resin, and also provides some experimental data support for revealing the correlation among surface properties of nano-fillers, microstructure and macroscopic properties of composite dielectric.

High-quality fabrication of diamond straight microchannels heat sink with large aspect ratio microchannels using UV nanosecond laser based on multi-feed method

The high heat flux density of modern chips presents a major challenge to their development. Single-phase or two-phase flow heat dissipation techniques using high thermal conductivity materials are seen as a potential solution. However, creating microfluidic channels from ultra-high thermal conductivity diamond materials is a significant challenge. In this paper, we present an experimental study on the fabrication of diamond heat sinks with high aspect ratio microchannels using a UV-nanosecond laser processing system, along with two multi-feed processing techniques for the collecting grooves and microchannels. We used a 1 μm spacing grid path combined with a polished multi-feed process to fabricate a 1600 μm deep collecting groove with a smooth bottom morphology. We also proposed a multi-area multi-feed fabrication technique for microchannels with an aspect ratio of 8:1 and a depth of 1600 μm. Finally, we have successfully fabricated a diamond straight microchannels heat sink, featuring a high aspect ratio and low phase change damage.