Microsystems face challenges such as high heat flux density and localized hot spots in the temperature field, significantly impacting their thermal reliability. Accurately and comprehensively characterizing the temperature field is a challenging problem in current research. We present a general high-order finite difference (GHOFD) algorithm for the high-accuracy numerical solution of the two-dimensional transient heat conduction equations (THCEs). The 10th-order GHOFD algorithm is accurate up to 10−7 °C. Secondly, we present a viable approach for characterizing microsystems' steady-state and transient heat conduction mechanisms. We introduce two new characterization parameters: the gradient modulus and the heat flux direction factor (HFDF). The gradient modulus can more clearly characterize the magnitude of the gradient vector and quantitatively analyze the spatial position of the temperature field change in the microsystem. The HFDF can dynamically display the heat conduction process in the temperature field. Finally, using temperature field simulation and microsystem characterization, we have validated the effectiveness of the proposed method and new parameters.
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