Triazine Resin Research Articles

Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range

With the application of wide bandgap devices, the packaging technology of power modules is faced with elevated challenges. This paper proposes a new packaging concept for silicon carbide power modules. The main objective is to improve the lifetime and temperature range, while the proposed packaging also has the potential to reduce stray inductance and simplify the fabrication process. In the proposed concept, sintered nano-silver is selected as the die bonding. The conventional direct-bonded-copper substrate is replaced by a molybdenum layer and a bismaleimide triazine resin layer which has a low thermal expansion coefficient. A steady-state thermal-mechanical analysis is conducted to verify the material selection. Furthermore, a transient thermal-mechanical analysis based on JEDEC temperature cycling methods is carried out, whose results are applied in the Coffin-Manson lifetime model to evaluate the advantages of the proposed Silver-Sintered Molybdenum Packaging. The results demonstrated that the proposed packaging technology could improve the lifetime by over 1000 times and increase the maximum operating temperature by nearly 3 times. Finally, a feasible process of sintering SiC chips on molybdenum substrates is proposed, which achieves a uniform and low porosity bonding.

A novel approach to obtain low-dielectric materials: changing curing mechanism of bismaleimide–triazine resin with ZIF-8

A novel approach to obtain low-dielectric materials: changing curing mechanism of bismaleimide–triazine resin with ZIF-8

Synthesis and properties of acetylene-containing cross-linkable triazine resin

Synthesis and properties of acetylene-containing cross-linkable triazine resin

Thermally stabilized bismaleimide–triazine resin composites for 10-GHz level high-frequency application

A hybrid cured resin with excellent dielectric and thermal properties was prepared with bismaleimide–triazine (BT) resin modified with 2,2′-diallylbisphenol A (DBA). The thermal and dielectric properties of the resin were investigated, and the effect of DBA concentration on the curing reaction was determined. Results indicated that DBA significantly influenced the curing reaction and the properties of the cured product. The modified BT resins exhibited outstanding thermal stability (initial decomposition temperature was over 400°C), although the stability was slightly lower than that of pure BT resins. The dielectric constant and dielectric loss of the cured resin decreased when DBA was introduced into the BT resins. Moreover, the fabricated resins showed dielectric constant of 2.91–3.07 and dielectric loss lower than 0.0057 under the testing high-frequency range of 1 GHz to 15 GHz. Overall, the BT resins modified by DBA display great potential to be applied in high frequency field.

Tuning the mechanical properties of glass fiber-reinforced bismaleimide–triazine resin composites by constructing a flexible bridge at the interface

We demonstrate a new method that can simultaneously improve the strength and toughness of the glass fiber-reinforced bismaleimide–triazine (BT) resin composites by using polyethylene glycol (PEG) to construct a flexible bridge at the interface. The mechanical properties, including the elongation, ultimate tensile stress, Young’s modulus, toughness and dynamical mechanical properties were studied as a function of the length of PEG molecular chain. It was found that the PEG molecule acts as a bridge to link BT resin and glass fiber through covalent and non-covalent bondings, respectively, resulting in improved interfacial bonding. The incorporation of PEG produces an increase in elongation, ultimate tensile stress and toughness. The Young’s modulus and Tg were slightly reduced when the length of the PEG molecular chain was high. The elongation of the PEG-modified glass fiber-reinforced composites containing 5 wt% PEG-8000 increased by 67.1%, the ultimate tensile stress by 17.9% and the toughness by 78.2% compared to the unmodified one. This approach provides an efficient way to develop substrate material with improved strength and toughness for integrated circuit packaging applications.

Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films

Electrically conducting adhesive films containing silver nanosized particles (AgNPs) were prepared using siloxane polyimide resin (SPI), and their physical properties were investigated. AgNPs with diameters of ca. 6 nm were prepared using oleylamine as a stabilizer. A mixture of the AgNPs and SPI was vigorously stirred, and cast on a polyethylene terephthalate support. Films were then fabricated using a doctor blade method. The heat resistance of the SPI film containing 60 wt% AgNPs was 35 °C higher than that of the SPI film without AgNPs. In addition, epoxy composite SPIAg (Epo-SPIAg) films containing a mixture of AgNPs and micro-sized silver flakes were prepared. Inclusion of AgNPs in these films strengthened their adhesion to silicon or bismaleimide triazine resin substrates. The glass transition temperature of the Epo-SPIAg films containing AgNPs was slightly higher than that of the film containing only micro-sized silver flakes.

Novel modification of bismaleimide–triazine resin by reactive hyperbranched polysiloxane

A novel kind of modified bismaleimide–triazine (CE/BD) resins by copolymerizing with reactive hyperbranched polysiloxane (HPSiE) was first reported, and the effect of HPSiE content on key properties was systemically investigated. Results show that the addition of HPSiE into CE/BD resin effectively improves the toughness and water resistance, moreover, the positive effect enhances with the increase of HPSiE loading. CE/BD/HPSiE resin with desirable HPSiE content also remains the good thermal and dielectric properties of CE/BD resin, suggesting that the toughening route by copolymerizing a thermosetting resin with reactive hyperbranched polymers provides a promising approach for developing high performance resins. These changes of properties are explained by an inherent feature of HPSiE, and the alteration of chemistry in network.

Thermal behavior and properties of naphthalene containing bismaleimide-triazine resins

A series of bismaleimid·triazine (BT) resins were prepared from various dicyanate esters and 2,7-bis(4-maleimidophenoxy)naphthalene (BMPN), which contains a naphthalene group and an aryl ether linkage in the backbone. Their curing behaviors were characterized by differential scanning calorimetry. The exotherm temperature and polymerization reactivity were strongly affected by the chemical structure of the various dicyanate ester monomer. Thermal behaviors were investigated by thermogravimetric analyses and dynamic mechanical analyses. The glass transition temperatures (Tg) of these cured resins with bismaleimide/dicyanate ester at the 1/2 molar ratio were in the range of 250–322°C, and exhibited excellent thermal stability up to 400°C in nitrogen. These results provided a structure–properties relationship for the cured bismaleimid·triazine resins. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1199–1207, 1998

Comparison of the thermal stabilities of some resin matrices for composites

AbstractThe thermal stabilities of eleven different epoxy resin formulations, ten different polyimide resin formulations, a triazine resin formulation and two aromatic thermoplastic matrices have been compared by isothermal gravimetry in air. The overall activation energies for degradation as a function of percentage weight loss have been determined by regression analysis of the isothermal data. The values obtained indicate a very complex breakdown mechanism in the majority of cases.

Characterization of a bis-maleimide triazine resin for multilayer printed circuit boards

The thermosetting resin investigated in this study was a mixture of bis-maleimide and bis-cyanate, frequently referred to as BT (bis-maleimide triazine). For printed circuit board applications, a brominated epoxy resin was blended with BT to impart flame resistance. Resin curing was extensively investigated using a combination of thermoanalytical techniques (thermal analysis, heated-cell infrared spectroscopy, dynamic mechanical analysis, and microdielectrometry). Differential scanning calorimetry indicated a minimum of two separate reactions. Fourier-transform infrared spectroscopy provided more detailed information on the cross-linking reactions during the curing. The onset of cyclotrimerization was found to appear at 150°C, correlating with one of the peaks observed in the differential scanning calorimetry measurements. Dynamic mechanical methods were used to investigate the viscosity profile during simulated lamination temperature profiles. Microdielectrometry performed simultaneously with parallel-plate rheometry provided further insight into the physical changes that occur during lamination.

Surface property modification of aromatic polyamides by microwave plasmas

AbstractVarious microwave plasma treatments were applied to Kevlar in the form of multifilament fabric and single fiber. Plasma‐modified fabrics were used to construct two‐ply laminates using a triazine resin adhesive. Very significant increases in the bond strength of laminates may be attributed to the plasma treatments; the effectiveness of plasma treatment is best utilized by reducing to a minimum the time interval between plasma exposure and contact of treated substrate with impregnating (adhesive) fluid. Mechanical properties of single Kevlar fibers seem to deteriorate somewhat on plasma exposure, but the cohesive strength of multifilament cloth is enhanced by the same treatments.

アミノ-σf;-トリアジン化合物および塗料用トリアジン樹脂

アミノ-σf;-トリアジン化合物および塗料用トリアジン樹脂