Trends In Packaging Technologies Research Articles

Integrating the EBM Model and LTS(A,A,A) Model to Evaluate the Efficiency in the Supply Chain of Packaging Industry in Vietnam

In recent decades, Vietnamese labeling and packaging has been widely recognized as being one of the fastest developing industries in Vietnam, supported by the tremendous demand of domestic production and the exportation of its packaged goods. The emerging packaging technology trends and the participation of foreign direct investment (FDI) companies have led to fierce competition between all packaging enterprises in Vietnam. This paper aims to calculate the productivity performance of 10 packaging companies in Vietnam from the past to the future by combining the additive Holt-Winters (LTS(A,A,A)) model to predict key variables in the financial statement for the next 4 years (2020–2023) and an epsilon-based measure of efficiency (EBM) model of data envelopment analysis (DEA) to define the developing trend, efficiency, and ranking of packaging operations. The empirical results will assist packaging enterprises to identify their positions, suggest feasible solutions to overcome shortcomings and catch up with the global trends, and propose superior partnerships for manufacturers, which have packaging service demands and support investment decisions for investors. Overall, all the enterprises in the packaging industry have high productivity. In particular, SIVICO JSC is identified as the most efficient packaging company in Vietnam, as it continuously maintains the first ranking over the observation time, followed by Agriculture Printing & Packing JSC and Bien Hoa Packaging Company. In the past, Tan Dai Hung Plastic JSC was identified as the most unproductive unit, while in the future term, the inefficient decision-making units (DMUs) are Tan Tien Plastic Packaging JSC, Sai Gon Packaging JSC, Dong A JSC, and PetroVietnam Packaging JSC. The suggestion for incompetent enterprises is changing the value of inputs proportionally to optimize for better performance.

Vaccines, inspiring innovation in health

This report covers the topics of pandemics, epidemics and partnerships, including regulatory convergence initiatives, new technologies and novel vaccines, discussed by leading public and private sector stakeholders at the 18th Annual General Meeting (AGM) of the Developing Countries Vaccine Manufacturers’ Network (DCVMN). Contributions of Gavi and the vaccine industry from emerging countries to the growing global vaccine market, by improving the supply base from manufacturers in developing countries and contributing to 58% of doses, were highlighted. The Coalition for Epidemic Preparedness Innovations (CEPI), the International Vaccine Institute (IVI) and others reported on new strategies to ensure speedy progress in preclinical and clinical development of innovative vaccines for future MERS, Zika or other outbreak response. Priorities for vaccine stockpiling, to assure readiness during emergencies and to prevent outbreaks due to re-emerging diseases such as yellow fever, cholera and poliomyelitis, were outlined. The role of partnerships in improving global vaccine access, procurement and immunization coverage, and shared concerns were reviewed. The World Health Organization (WHO) and other international collaborating partners provided updates on the Product, Price and Procurement database, the prequalification of vaccines, the control of neglected tropical diseases, particularly the new rabies elimination initiative, and regulatory convergence proposals to accelerate vaccine registration in developing countries. Updates on supply chain innovations and novel vaccine platforms were presented. The discussions enabled members and partners to reflect on efficiency of research & development, supply chain tools and trends in packaging technologies improving delivery of existing vaccines, and allowing a deeper understanding of the current public-health objectives, industry financing, and global policies, required to ensure optimal investments, alignment and stability of vaccine supply in developing countries.

The True Cost of Hermeticity in Microelectronic Packaging

Abstract Reliability in microelectronic packaging has been, and will continue to be, a major concern that must be taken into account early in the design of a package. Decisions made relative to packaging materials and the methods for achieving environmental protection drive many other aspects of the design, such as component selection and next higher assembly interfaces. A better understanding of current methods for achieving reliability allows the design community to determine the most appropriate packaging solution for use in a given application. Environmental protection in microelectronic packaging may be achieved both with and without hermeticity. Hermetic solutions require a means of sealing the package via laser or seam weld type processes in order to provide environmental protection to the components within the package. These packages are typically in the form of either a metal box assembly or a ceramic substrate with a soldered lead frame. Non-hermetic packaging solutions can be accomplished on a wide variety of material sets but require environmentally protective coatings to prevent damage to the packaged components. Hermetic and non-hermetic packaging solutions, in addition to various types of each, have unique advantages and disadvantages depending upon the application. Characteristics such as electrical performance, producibility, structural integrity and cost must be considered when choosing a packaging solution for an application. This paper will review current microelectronic packaging technology trends and present a trade study on the materials and methods used to achieve environmental protection.

New Trend of Packaging Technology

New Trend of Packaging Technology

Production of active PET films: evaluation of scavenging activity

AbstractThe current trends in packaging technology are focusing on the development of functional materials that interact with the environment and with the food, playing an effective role in the preservation of quality. In particular, the so‐called active packaging technologies were developed as a response to the market needs for minimally treated foodstuffs, in order to preserve their freshness and flavours by regulating the gas composition of the packaging headspace through active scavengers. One of the most promising approaches for this technology is the incorporation of active scavengers into a polymeric matrix. Nevertheless, the design and the production of a functional and efficient active flexible package can be difficult to realize because of the complexity of the system. This work was thus focused on the production and the analysis of monolayer polyester films containing an oxygen scavenger. The active film was obtained by adding the active phase into a polyethylene terephthalate matrix during the extrusion process. The barrier properties of the films were investigated by means of conventional permeability measurement, to assess their activity with respect to oxygen. Additionally, the oxygen absorption of the active samples was analysed by an innovative oxygen meter system, in order to determine their scavenging capacity and reaction kinetics. The analysis of colour was carried out on packaged fresh apple slices, to verify if the active films produced were able to limit the oxidation processes on a sensitive food. Finally, the optical properties of the samples were investigated through haze measurements. Copyright © 2007 John Wiley & Sons, Ltd.

The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints

In recent years, package downsizing has become one of biggest trends in packaging technologies because of miniaturization and the high integration of electronic devices. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. But, the reliability of thermal fatigue life may be lowered by the dispersion of design factors such as the dimensions, shapes, and material properties of package systems. Also, the fracture modes (fatigue fracture, brittle destruction in the interface, and compound destruction, and so on) will be affected by these dispersion factors. Although this dispersion should be reduced in order to improve the reliability, reducing all dispersion is inefficient and time-consuming. So, the factors that greatly contribute to thermal fatigue life have to be reduced. In this study, evaluations of the influence of various design factors on the reliability of soldered joints of a BGA (Ball Grid Array) were carried out, and got each influence. With the results, design engineers can rate each factor’s effect on reliability and assess the reliability of their design beginning at the concept design stage. Consequently, it will be possible to avoid almost all reliability problems from the beginning. Also, by rating the factors, the design period can be shortened

Electronics Packaging Technology Trend for the 2002—Look for Electronics Packaging Technology

Electronics Packaging Technology Trend for the 2002—Look for Electronics Packaging Technology

Electronics Packaging Technology Trend for the 2001-Look for Electronics Packaging Technology

Electronics Packaging Technology Trend for the 2001-Look for Electronics Packaging Technology

Electronics Packaging Technology Trend for the 2000

Electronics Packaging Technology Trend for the 2000

Electronics Packaging Technology Trend for the 1999

Electronics Packaging Technology Trend for the 1999