In this study, the relationship of three different media, (air, epoxy fluid, and chloroform solution) on the electrical, mechanical, and thermal properties of 5 vol.% copper nanoparticle (CuNP)-filled epoxy nanocomposite was investigated. Microscopic observation revealed that the CuNP ultrasonicated with chloroform solution exhibited the best filler distribution in the epoxy matrix. It showed high electrical conductivity of 7.65 × 10−3 S cm−1 and flexural properties, and low coefficient of thermal expansion (CTE) compared with the other two nanocomposites. However, CuNP prepared by chloroform medium showed inferior thermal property compared with the other two nanocomposites according to thermogravimetric analysis (TGA).
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