With the continuous advancement of electronic devices, the amounts of heat as well as electromagnetic (EM) waves generated have increased. Materials with high thermal conductivity and excellent EM interference shielding effectiveness (EMI SE) can be utilized to address this issue. In this work, we synthesized hollow anatase TiO2 microspheres. Through a reaction, MgO nanoparticles were incorporated into the interior of TiO2 microspheres. (H-TiO2/MgO). The heterostructure of the fillers contributed to performance enhancement. TiO2 and MgO particles formed a dual thermal-conduction pathway. H-TiO2/MgO effectively weakened the energy of EM waves upon contact. Additionally, TiO2, MgO, and epoxy all exhibited hydrophilicity. Consequently, the interfacial compatibility between H-TiO2/MgO and epoxy was excellent. They formed strong interfacial interactions by hydrogen bonding. Because of the excellent electrical insulation properties of H-TiO2 and MgO, the composites exhibited superior insulation performance (over 1010 Ω·cm). Our H-TiO2/MgO/Epoxy composites exhibited a maximum thermal conductivity of 7.52 W/m·K, an EMI SE of 64.92 dB, and a tensile strength of 79.10 MPa. Our composites are expected to effectively manage heat and EM waves generated by electronic devices
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