Three-dimensional Interconnect Research Articles

3D-Networks Based Polymer Composites for Multifunctional Thermal Management and Electromagnetic Protection: A Mini Review

The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites.

Full-Combinatorial Concentration Gradient Array with 3D Micro/Nanofluidics for Antibiotic Susceptibility Testing.

Recent advancements in micro/nanofluidics have facilitated on-chip microscopy of cellular responses in a high-throughput and controlled microenvironment with the desired physicochemical properties. Despite its potential benefits to combination drug discovery, generating a complete combinatorial set of concentration gradients for multiple reagents in an array format remains challenging. The main reason is limited layouts of conventional micro/nanofluidic systems based on two-dimensional channel networks. In this paper, we present a device with three-dimensional (3D) interconnection of micro/nanochannels capable of generating a complete combinatorial set of concentration gradients for two reagents. The device was readily fabricated by laminating a pair of multilayered monolithic films containing a Christmas tree-like mixer, a cell culture chamber array, and through-holes, all within each single film. We assessed the reliable generation of a full-combinatorial concentration gradient array and validated it by using numerical analysis. We applied the proposed device to test the antibiotic susceptibility of bacterial cells in a convenient one-step manner. Furthermore, we explored the potential of the device to accommodate the arrayed complete combinatorial set for two or more drugs, while extending the capabilities of our laminated object manufacturing method for realizing 3D micro/nanofluidic systems.

Performance evaluation of carbon-negative syngas production via chemical looping reforming of methane from biomass pyrolysis volatiles

To realize the clean and efficient directional conversion of biomass, chemical looping reforming of biomass volatile CH4 based on a decoupling strategy is expected to carry out carbon-negative production of hydrogen-rich syngas. In this paper, a multi-functional oxygen carrier (NiFe2O4@SBA-16) for encapsulating the active metal oxide component NiFe2O4 with a three-dimensional interconnecting pore molecular sieve SBA-16 was designed. The experimental results showed that the modification strategy of composite metal oxide encapsulation improved syngas selectivity and CH4 conversion based on the fixed-bed reactor. 20 %NiFe2O4@SBA-16 showed 22.1 % CH4 conversion and 92.6 % CO selectivity under 750 °C, and it maintained good cycle stability after 15 cycles. The H2/CO ratio was effectively improved by adding part of CO2 into the feed gas, and the CH4 conversion reached over 35 %. This study provides essential data for the clean preparation of hydrogen-rich syngas from biomass and the development and design of multifunctional oxygen carriers.

Fabrication of novel Hydrogel/Epoxy resin composites with Soft-Hard combined Bi-Continuous aqueous load-bearing electrolytes and application in structural energy storage devices

Structural electrolytes with both mechanical and electrochemical properties are of great significance in structural energy storage devices. In this paper, we succeeded to synthesize a novel epoxy resin/hydrogel bicontinuous phase structure electrolyte for the first time by the ingenious design of the hydrophobic curing agent and the substitution of hydrogel for water, and filled the application of bicontinuous electrolyte in aqueous electrochemical energy storage system. The fine structure composition of electrolyte was divided and analyzed in detail by X-ray micro-CT technology. The epoxy resin phase is composed of a reasonable distribution of skeleton structures of various sizes, the largest of which is able to support heavy weights. And a large number of tiny skeletons are distributed to connect the skeletons of different sizes, which improves the three-dimensional interconnection of the epoxy resin phase and makes it excellent mechanical properties (Tensile strength 11.91 Mpa). The large size PVA gel phase constitutes the main pathway for conducting ions. Furthermore, the large-diameter gel phases are coupled in three dimensions with a huge number of micro-diameter gel phases, increasing the number of micro-ion transport channels and decreasing the distance of ion transport with good ionic conductivity (0.15 mS cm−1). Using carbon cloth coated in slurry as the electrode, an integrated structural energy storage bearing device was created in situ using layer brush technology, which exhibited exceptional electrochemical performance during in-situ variable load tests. We have successfully solved the construction of aqueous bicontinuous phase structure electrolyte, which made the application of various water chemistry systems in structural energy storage possible.

The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch Interconnects

Integration issues for a three-dimensional (3D) interconnect in a Face-to-Face (F2F) configuration are discussed. In particular, the effect of AI and organic dielectrics under the bump and their effect in chip-package-interaction (CPI) stresses as well as AI contact resistance issues that arise as the interconnection pitch is decreased. This paper will present a finite-element model created to study the stresses in advanced 3D microelectronic package. To assess the reliability of the 3D packages a submodeling approach is used to capture the CPI stresses. The modeling study presented indicates that it is beneficial to continue using AI pads as it has significatly lower stresses compared to copper pads/vias. In the second portion of the paper, the effect of PBO developer on AI corrosion is presented. Reactive ion etching (RIE) chemistries and wet chemistries were optimized using contact resistance as the success metric. Process robustness was achieved by decoupling the hard dielectric opening from the PBO via opening. Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS), Scanning Electron Microscopy (SEM), X-ray Photoelectron Spectroscopy (XPS) analysis were used to add clarity to the bump contact resistance values.

Fully printed minimum port flexible interdigital electrode sensor arrays.

Screen-printed interdigital electrode-based flexible pressure sensor arrays play a crucial role in human-computer interaction and health monitoring due to their simplicity of fabrication. However, the long-standing challenge of how to reduce the number of electrical output ports of interdigital electrodes to facilitate integration with back-end circuits is still commonly ignored. Here, we propose a screen-printing strategy to avoid wire cross-planes for rapid fabrication of flexible pressure sensor arrays. By innovatively introducing an insulating ink to realize electrical insulation and three-dimensional interconnection of wire crossings, the improved sensor array (4 × 4) successfully reduces the number of output ports from 17 to 8. In addition, we further constructed microstructures on the laser-etched electrode surfaces and the sensitive layer, which enabled the sensor to achieve a sensitivity as high as 17 567.5 kPa-1 in the range of 0-50 kPa. Moreover, we integrated the sensors with back-end circuits for the precise detection of tactile and physiological information. This provides a reliable method for preparing high-performance flexible sensor arrays and large-scale integration of microsensors.

Laser Processing of Polyimide and Molybdenum Substrates for Extreme Environment Electronics

A desire in today’s electronic packaging technologies is to create more dense electronic packaging schemes. One method to achieve more dense electronic package integration is to use three-dimensional interconnects to minimize interconnect physical dimensions. Three-dimensional interconnect technologies, such as interposers, require a method of connecting electronics to electronic packages vertically. Thru silicon vias are a widely studied and explored vertical interconnect technology used in a variety of electronic packaging applications. Though silicon has high material hardness, the brittle nature of silicon substrates is a concern for robustness and reliability. These concerns only increase when the desired interconnect application is in extreme environments, such as cryogenic temperatures. A potential alternative to silicon in thru-via applications in extreme environments is molybdenum. Molybdenum is a commonly used material in many applications, such as automotive and aerospace, and has high material strength. Molybdenum is also a low coefficient of thermal expansion material, comparable to silicon, which in combination with high material strength lends to high reliability at extreme temperatures. A challenge of working with refractory metals such as molybdenum is that conventional CNC machining techniques require the use of machining coolants that may not be compatible with fabricated electronics and/or processes can become costly due to tool wear and the need for specialized equipment. Additionally, using molybdenum as a thru-via substrate requires the need for an electrically insulated layer, such as polyimide, within drilled molybdenum thru-holes to prevent the molybdenum substrate from shorting via connections. One potential solution to the above challenges is developing laser processing techniques to cut and drill molybdenum and polyimide. Laser processing is becoming a preferred method for inexpensive prototyping with high resolution and design versatility. This work seeks to meet the challenges described by developing laser cutting and drilling techniques for both molybdenum and polyimide for the use in cryogenic applications. This work will describe two laser processing configurations utilizing two different lasers to laser machine molybdenum and polyimide. This work will first describe the process strategies of laser cutting and drilling molybdenum as a stand-alone substrate. Aspects of laser processing on molybdenum, such as pattern repetitions and scanning speeds, will be described. Process parameter variations will be compared directly and evaluated. Additionally, post-laser processing steps, such as abrasive blasting, will be described and discussed. Next, the fabrication steps to achieve an insulating layer of polyimide in laser drilled holes as well as on each surface of the molybdenum will be detailed. Once polyimide has been cured, laser processing parameters to realize thru-holes in the polyimide-filled molybdenum drills will be presented. Adhesion of polyimide on the molybdenum substrate will be verified and demonstrated through the use of confocal scanning acoustic microscopy before and after polyimide laser processing. Cryogenic performance will be verified by completing confocal scanning acoustic microscopy after submersion in liquid nitrogen (~77 K) and compared with the pre-submersion microscopy images. Processes detailed in this work will open opportunities for future development of molybdenum-based interconnect structures for use in cryogenic applications. Acknowledgement We thank the Alabama Micro/Nano Science and Technology Center (AMNSTC) for providing access to fabrication and characterization facilities used in this work.

Design and preparation of hierarchical porous carbon-based materials with bionic “ant nest” structure for high performance asymmetric supercapacitors

Rational design of electrodes to broaden the working potential window is an attractive approach to improve the energy density of asymmetric supercapacitors. Herein, a simple non-solvent-induced phase separation method was used to construct a bionic "ant nest" three-dimensional hierarchical porous carbon (HPC) without any template, realizing a three-dimensional interlaced interconnection network structure similar to that of a natural ant nest, which adsorbs more ions through a larger accessible area and facilitates the bi-continuous transport of ions and electrons. Further, the aqueous asymmetric supercapacitor assembled with MnO2-modified HPC (HPC/MnO2) as the positive electrode and nitrogen-doped HPC (NHPC) as the negative electrode has an energy density as high as 21 Wh kg−1 at a power density of 410 W kg−1, and as high as 17 Wh kg−1 even at a power density of 13 kW kg−1. The device exhibits an excellent electrochemical performance over a potential window of 0–1.6 V.

High-precision moiré alignment method using centrosymmetric grating for 3D interlayer interconnect

The fabrication of integrated circuits in the future will rely heavily on high-precision three-dimensional interlayer interconnect alignment technology. In this study, we explore a controllable and clear-cut alignment method based on moiré centrosymmetric grating marks that can achieve fine alignment in the X-Y-θ direction simultaneously with only a single alignment mark without additional coarse alignment mark. Compared with the traditional peak-intensity-based detection method, circumferential alignment of the order of 10−4 deg and radial alignment of less than 10 nm can be achieved, and its fine alignment accuracy is improved by nearly two orders of magnitude by using the proposed local moiré phase alignment method. With further optimization of the parameters, sub-nanometer alignment is expected to be achieved. Moreover, our measurement system is simpler and more stable. Both simulation and experimental results verify the feasibility of the proposed method. The uncertainty analysis of the results is also reported.

THE WAY PATIENTS SEE FLOATERS: Widefield Dynamic Scanning Laser Ophthalmoscopy Imaging of Vitreous Abnormalities.

To investigate the use of dynamic widefield scanning laser ophthalmoscopy (SLO) and B-scan ultrasonography in imaging vitreous abnormalities in patients with complaints of floaters. Twenty-one patients underwent both dynamic SLO and B-scan ultrasonography to image their vitreous abnormalities. After reviewing these videos, patients graded each imaging technique on a scale of 1 to 10, based on how closely it represented their visual perception of floaters. The mean age of the patients (12 women and nine men) was 47.7 ± 18.5 years. The patients graded a median score of nine for SLO imaging (mean = 8.43) compared with a median score of 5 (mean = 4.95) for ultrasound ( P = 0.001). Widefield SLO imaging demonstrated three-dimensional interconnectivity within the condensations of the formed vitreous that exhibited translational and rotational movements with eye saccades. Floaters are a common complaint, but it is difficult to know whether imaging findings of the vitreous correlate to what patients perceive. Widefield SLO seems to image vitreous abnormalities related to how patients perceive their own floaters better than B-scan ultrasonography. Despite the term "floaters", the vitreous abnormalities in the videos seemed to be manifestations of a complex three-dimensional degeneration of the vitreous framework.

THE INTERCONNECTIONS BETWEEN ECONOMIC, SOCIAL AND ENVIRONMENT RELATED INDIDCATORS AND THEIR RELATIONSHIP WITH ECONOMIC GROWTH

This study examines the principal components that are characteristic to a varied number of indicators specific to the economic, social and environmental interconnectivity. The data are drawn primarily from the World Bank’s WDI, the UNDP’s HDI and Our World in Data’s Indicators. Using cross-section panel data from 2000 to 2021, for a number of 32 European countries, a considerable number of factors are generated by conducting the principal component analysis. The results of the analysis depict an image where the three-dimensional interconnectivity is described to a greater extent by components such as: the agricultural sector’s value added as a percentage of the GDP, the total quantity of primary energy consumed per capita, the percentage of the population that has access to internet, the percentage of individuals that are unemployed, the population density, the total dependency ratio, the industrial sector’s value added as a percentage of the GDP and the percentage of the female population that has attained at least secondary education. Together with the GDP, the obtained factors are statistically analysed in order to observe the existing correlations between economic growth and the economic, social and environmental interconnectivity. According to the results of the Pearson correlation, both positive and negative relationships of moderate intensities exist between economic growth and the factors that address the three-dimensional interconnectivity. Furthermore, recommendations are made for future research regarding the creation of an index based on the components that form the factors previously obtained.

Porous structure of fixed sulfur and networked electronic channels in three-dimensional skeletal structure of polyaniline and MOF-derived materials

Lithium-sulfur batteries (LSBs) are favored for their high specific capacity and energy density, but they have problems, such as electrode volume expansion and poor electrical conductivity, that need to be solved. In this work, a three-dimensional (3D) interconnection network structure (3CPC) material was designed and synthesized from the composite of polyaniline (PANI) and metal–organic-skeleton-derived nitrogen carbon (NC). PANI conductive fiber acts as a bridge between NC and insulating sulfur to promote electron transfer. A large number of mesopores and micropores in the 3D spatial network structure effectively fixed sulfur. Results show that the 3CPC@S cathode materials have excellent electrochemical properties. The initial discharge-specific capacity of the 3CPC@S cathode material reached 1220.1 mAh g−1 at a current density of 0.1 C. Its reversible capacity was 1018.7 mAh g−1 after 100 cycles, corresponding to a capacity retention rate of 83.5%. The material frame was used to provide electronic channels, and the physical structure was combined to carry out sulfur fixation to improve the electrochemical performance of the cathode material. This method provides a new idea for improving the volume expansion and conductivity of LSB electrode.

Hierarchical Pt/NiCo2O4 nanosheets decorated carbon nanofibers for room-temperature catalytic formaldehyde oxidation

Room-temperature catalytic formaldehyde (HCHO) oxidation is regarded as the most promising way for constant and oxidative removal of indoor HCHO. Herein, carbon nanofibers (CNF) with three-dimensional (3D) interconnection network structure decorated with Pt/NiCo2O4 alloy nanosheets (Pt/NiCo2O4/CNF) were fabricated in-situ to catalyze the oxidation of HCHO at ambient temperature. The presence of CNF helps to inhibit the aggregation of NiCo2O4 nanosheets, expose more active sites and form a hierarchically porous structure, which is conducive to the dispersion of platinum nanoparticles (NPs) and the diffusion of reactants. Besides, oxygen vacancies from Pt-loading process ensure abundant active oxygen species, which are beneficial to HCHO oxidation. Moreover, CNF with microporous structure can strongly adsorb HCHO, rapidly reduce the concentration of HCHO in air and increase its concentration near Pt/NiCo2O4, thus accelerating the formaldehyde oxidation reaction. At Pt content as low as 0.5 wt%, Pt/NiCo2O4/CNF exhibits superior HCHO oxidation activity, and conversion of 92.4% can be achieved within 60 min due to the combination of adsorption and oxidation. This work may shed light on fabricating CNF-based 3D catalysts for the practical application of indoor HCHO elimination.

First Application of Nitrogen-Doped Carbon Nanosheets Derived from Lotus Leaves as the Electrode Catalyst for Li-CO2/O2 Battery

The development of Li-CO2/O2 battery with high energy density and long-term stability is urgently needed to fulfill the carbon neutralization and pollution-free environment targets. The biomass-derived heteroatom-doped carbon catalyst with the combination of high-efficiency catalytic activity and sustainable supply is a promising cathode catalyst in Li-CO2/O2 battery. Specifically, the unique morphology and mesopore structure can promote the transfer of CO2, O2, and Li+. Abundant channel pores can provide discharge products accommodation to the largest extent. Nitrogen dopant, the commonly recognized active sites in carbon, can improve the electron conductivity and accelerate the sluggish kinetic reaction. Therefore, utilizing the louts leaves as the precursor, we successfully prepare the cellular-like nitrogen-doped activated carbon nanosheets (N-CNs) through the appropriate pyrolysis carbonization method. The as-synthesized carbon nanosheets display a three-dimensional interconnecting pore structure and abundant N-dopant actives, which dramatically improve the electrochemical catalytic activity of N-CNs. The Li-CO2/O2 battery with the N-CNs cathode delivers a high discharge capacity of 9825 mAh g−1, low overpotential of 1.21 V, and stable cycling performance of 95 cycles. Thus, we carry out a facile method for N-doped carbon nanosheets preparation derived from the cheap natural biomass, which can be the effective cathode catalyst for environmental-friendly Li-CO2/O2 battery.

High-efficiency and CMOS compatible out-of-plane light emission based on a silicon coupler.

Photonic antennas are critical in applications such as spectroscopy, photovoltaics, optical communications, holography, and sensors. Metal antennas are widely used because of their small size, but they are difficult to be compatible with a CMOS. All-dielectric antennas are easier to integrate with Si waveguides, but are generally larger in size. In this paper, we propose the design of a small-sized, high-efficiency semicircular dielectric grating antenna. The antenna's key size is only 2.37µm×4.74µm, and the emission efficiency reaches over 64% in the wavelength range from 1.16 to 1.61µm. The antenna provides a new, to the best of our knowledge, approach for three-dimensional optical interconnections between different decks of integrated photonic circuits.

Isotropic conductive paste for bioresorbable electronics.

Bioresorbable implantable medical devices can be employed in versatile clinical scenarios that burden patients with complications and surgical removal of conventional devices. However, a shortage of suitable electricalinterconnection materials limits the development of bioresorbable electronic systems. Therefore, this study highlights a highly conductive, naturally resorbable paste exhibiting enhanced electrical conductivity and mechanical stability that can solve the existing problems of bioresorbable interconnections. Multifaceted experiments on electrical and physical properties were used to optimize the composition of pastes containing beeswax, submicron tungstenparticles, and glycofurol. These pastes embody isotropic conductive paths for three-dimensional interconnects and function as antennas, sensors, and contact pads for bioresorbable electronic devices. The degradation behavior in aqueous solutions was used to assess its stability and ability to retain electrical conductance (∼7​kS/m) and structural form over the requisite dissolution period. In vitro and in vivo biocompatibility tests clarified the safety of the paste as an implantable material.

Three-Dimensional Interconnection With Magnetically Coupled Transition for W-Band Integration Applications

In this article, a new class of 3-D interconnection with the magnetically coupled transition is proposed at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$W$ </tex-math></inline-formula> -band. In contrast to planar approaches, it can connect different components or modules in a complex package with wideband and low-loss performance, even if in separate circuit boards. To overcome the radiation loss, the micromachined rectangular microcoaxial line ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{R}\mu $ </tex-math></inline-formula> CL) is chosen to be the 3-D signal line, owing to its low-weight robust structure and low-crosstalk transmission. The substrate integrated waveguide (SIW) is chosen to act as the common signal line around the components and modules. The soldering process will introduce the unpredictable parasitic reactance, which can deteriorate the transmission performance. To construct a nonsoldering field transformation structure from the TEM mode to the TE10 mode, the U-shaped magnetic slot is etched on the SIW through the direction orthogonal to the current field vector, and the tail of the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{R}\mu $ </tex-math></inline-formula> CL is directly open. Meanwhile, the transmission characteristics is studied by analyzing the physics-based equivalent-circuit model of this interconnection. The extraction methods of the key parameters, such as turn ratios in the equivalent circuit, are studied for simplifying the synthesis approach. A back-to-back interconnection prototype is designed by the synthesis guideline. The prototypes are fabricated and measured to validate the correctness of this design. The measured results show that the proposed transition achieves a bandwidth from 85 to 100 GHz with the return loss better than 13 dB and the insertion loss around 1.5 dB, which make it promising for high-density interconnection applications at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$W$ </tex-math></inline-formula> -band.

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection.

Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Nevertheless, the performance and reliability of the device will be impacted by the thermal stress brought on by the mismatch of the coefficient of thermal expansion among multi-material structures and the complicated structure of TGV. This paper focuses on thermal stress evolution in different geometric and material parameters and the development of a controlled method for filling polymers in TGV interconnected structures. In addition, a numerical study based on the finite element (FE) model has been conducted to analyze the stress distribution of the different thicknesses of TGV-Cu. Additionally, a TGV interconnected structure model with a polymer buffer layer is given to solve the crack problem appearing at the edge of RDL. Meanwhile, after practical verification, in comparison to the experimental results, the FE model was shown to be highly effective and accurate for predicting the evolution of stress, and several recommendations were made to alleviate stress-related reliability concerns. An improved manufacturing process flow for the TGV interconnected structure was proposed and verified as feasible to address the RDL crack issue based on the aforementioned research. It provides helpful information for the creation of highly reliable TGV connection structures.

(Digital Presentation) A Low-Modulus, Soft and Stretchable Wearable Electrocardiography Sensor-System Patch

Electrocardiography (ECG) is a primary tool for diagnosis of various types of disease and disorders such as arrhythmias, coronary heart disease, heart attack, mental disorders, etc. Reliable wearable ECG devices can be a valuable tool in early diagnosis and effective treatment of such disease and disorders. Convention wearable ECG sensor-systems are rigid, bulky, expensive, and the recorded ECG signals using these wearable devices lack required accuracy for medical diagnosis mainly due to motion artifacts that is originated from slippage of sensors on skin and/or instable interface between the soft sensor and the rigid electronic circuits.Here, we report a low-modulus, soft and stretchable wearable electrocardiography (ECG) sensor-system patch which enables continuous and long-term recording of ECG signals with minimal motion artifacts. This system consists of two reusable, detachable-attachable patches: sensor patch and circuit patch, as shown in Figure 1a. The reusable multi-wall carbon nanotube (MWCNT) based sensor patch is fabricated on stretchable elastomer substrate by our developed cost and time-effective method. Reusable, front-end and wireless circuit patch is made by integration of the off-the-shelf integrated circuit components with three-dimensional (3D) stretchable-deformable interconnects (SDI). SDIs are 3D springs of liquid metal (EGaIn). Unlike other reported liquid metal based interconnects, SDI has been designed in 3D form to increase the stretchability and make it low-modulus and robust to deformations in all directions. The stretchability of SDI structure is beyond 500% (the limit of our measurement system) without any negligible change in electrical resistivity of the interconnects. With less than 1% change in the resistance of SDIs after 50,000 cycles of applied tensile strain of 200%, the SDI structure ensures reliable stretchability and durability of the circuit patch for long-term electrocardiography.The sensor patch is soft, stretchable and it is fabricated using a low-cost scalable method. This soft and stretchable ECG sensor-system shows comparable performance with respect to medical grade Ag/AgCl wet gel electrodes. Our CNT-PDMS sensors shows low electrode-skin interface impedance and low susceptibility to motion artifact which similar of it in medical grade Ag/AgCl wet gel sensors (Fig. 1b). Further, it is waterproof, reusable and comfortable to wear.The circuit patch includes a rechargeable battery and ECG signals is wirelessly sent to a personal device such as cellphone, tablet and laptop through Bluetooth low energy (BLE) and it is displayed in real-time (Fig. 1c) Our developed sensor-system is a multi-use platform which can be applied for the detection of EMG, EEG or EOG signals. Figure 1

(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems

This article describes opportunities and challenges towards heterogeneous systems integration by the so-called fan-out wafer-level packaging (FOWLP) technology. An introduction on the technology is given, before we describe specific developments built up at CEA-Leti. Recent assessments of a multi-chip SiP for 5G applications and scalable three-dimensional interconnects are presented.