The authors describe for the first time the fabrication and characterisation of an HF Radio Frequency Identification (RFID) transponder (tag) deposited on paper substrate using thermal evaporation. This technique is well adapted to the depositing of thin layers with good electrical properties directly on paper. This process helps to reduce the required amount of metal and the number of manufacturing stages in the realisation of RFID labels. The coil antenna consists of a thin aluminium layer evaporated through a masking system. The low thickness of metal that grows during thermal evaporation presents a good metal conductivity. After the RFID chip bonding, the tags are perfectly operational. We have developed the theoretical aspect related to the parameter thickness of the layer deposited as well as the simulation of the transponder. Technological processes implemented to carry out the transponder are then described. The electrical characterisations of the tags are presented and their good performance is illustrated.