Thin Al0 Research Articles

Enhancing sputtered GaN/Si film quality by adding AlGaN buffer layer in a continuous deposition process

In this work we demonstrate the achievement of significative improvements in the structural and morphological quality of wurtzite GaN films (approximately 250 nm thick) by introducing an initial growth step involving an AlGaN buffer layer on p-type Si (100) substrates through a continuous reactive sputtering process. We investigated the influence of using single and multiple AlxGa1-xN buffer layers with varying Al content (x ranging from 0.07 to 0.37) and different thicknesses (from 166 nm to 1 µm). The obtained samples underwent characterization through X-ray diffraction and scanning electron microscopy. The results reveal a slight increase in the c-axis preferred growth direction and grain sizes even with a single and thin (250 nm) Al0.07Ga0.93N buffer layer. Conversely, the use of a single Al0.37Ga0.63N buffer layer led to significant morphological changes and a remarkable improvement in the c-axis preferred orientation. The most favorable outcomes were observed with the implementation of a triple AlGaN buffer layer, featuring decreasing Al content from the substrate, indicating the attainment of a high-quality GaN top layer comparable to epitaxial GaN.

S-band acoustoelectric amplifier in an InGaAs-AlScN-SiC architecture

Here, we report on an acoustoelectric slab waveguide heterostructure for phonon amplification using a thin Al0.58Sc0.42N film grown directly on a 4H-SiC substrate with an ultra-thin In0.53Ga0.47As epitaxial film heterogeneously integrated onto the surface of the Al0.58Sc0.42N. The aluminum scandium nitride film grown directly on silicon carbide enables a thin (∼850 nm thick) piezoelectric film to be deposited on a thermally conductive bulk substrate (370 W/m K for 4H-SiC); the high thermal conductivity of the substrate, large mobility of the semiconductor (∼7000 cm2/V s), and low carrier concentration (∼5 × 1015 cm−3) yield low self-heating. A Sezawa mode with optimal overlap between the peak of its evanescent electric field and the semiconductor charge carriers is supported. The high velocity of the heterostructure materials allows us to operate the Sezawa mode amplifier at 3.05 GHz, demonstrating a gain of 500 dB/cm (40 dB in 800 μm). Additionally, a terminal end-to-end radio frequency gain of 7.7 dB and a nonreciprocal transmission of 52.6 dB are achieved with a dissipated DC power of 2.3 mW. The power added efficiency and acoustic noise figure are also characterized.

Polarity effects on wake‐up behavior of Al0.94B0.06N ferroelectrics

AbstractWurtzite ferroelectric materials are promising candidates for energy‐efficient memory technologies, particularly for applications requiring high operating temperatures. Asymmetric wake‐up behaviors, in which the polarization reversal depends both on polarity and cycle number for the first few dozen cycles, must be better understood for reliable device operation. Here, the detailed analysis of the asymmetric wake‐up behavior of thin film Al0.94B0.06N was performed combining time‐resolved switching measurements with Rayleigh analysis, piezoelectric measurements, and etching experiments of progressively switched samples. The analysis shows that the gradual opening of the polarization hysteresis loops associated with wake‐up is driven by a gradual increase in the domain‐wall density and/or domain‐wall mobility with electric field cycle to the polarity opposite to the growth polarity. The insights of this discovery will help to guide interface and polarity design in the eventual deployment of reliable devices based on these materials.

In-Grain Ferroelectric Switching in Sub-5 nm Thin Al0.74 Sc0.26 NFilms at 1 V.

Analog switching in ferroelectric devices promises neuromorphic computing with the highest energy efficiency if limited device scalability can be overcome. To contribute to a solution, one reports on the ferroelectric switching characteristics of sub-5 nm thin Al0.74 Sc0.26 Nfilms grown on Pt/Ti/SiO2 /Siand epitaxial Pt/GaN/sapphiretemplates by sputter-deposition. In this context, the study focuses on the following major achievements compared to previously available wurtzite-type ferroelectrics: 1) Record low switching voltages down to 1V are achieved, which is in a range that can be supplied by standard on-chip voltage sources. 2) Compared to the previously investigated deposition of ultrathin Al1-x Scx Nfilms on epitaxial templates, a significantly larger coercive field (Ec ) to breakdown field ratio is observed for Al0.74 Sc0.26 Nfilms grown on silicon substrates, the technologically most relevant substrate-type. 3) The formation of true ferroelectric domains in wurtzite-type materials is for the first time demonstrated on the atomic scale by scanning transmission electron microscopy (STEM) investigations of a sub-5 nm thin partially switched film. The direct observation of inversion domain boundaries (IDB) within single nm-sized grains supports the theory of a gradual domain-wall driven switching process in wurtzite-type ferroelectrics. Ultimately, this should enable the analog switching necessary for mimicking neuromorphic concepts also in highly scaleddevices.

Selective anisotropic etching of GaN over AlGaN for very thin films

Selective etching of gallium nitride (GaN) over aluminum gallium nitride (AlxGa1-xN) with inductively coupled plasma and reactive ion etching (RIE) was examined using only chlorine and oxygen gasses. Etch selectivity was heavily influenced by the amount of oxygen present during etching and was slightly influenced by RIE power. Surface roughness was also influenced heavily by the oxygen flow and RIE power which is important for local and across-wafer uniformity. Etch rates were intentionally minimized for use for highly controlled etching of very thin GaN and Al0.25Ga0.75N epitaxial layers. Maximum tested etch rates for GaN and Al0.25Ga0.75N were 200 and 15 Å/min, respectively, and maximum selectivity between GaN and Al0.25Ga0.75N achieved was at least 68.5 to 1. Above a certain oxygen flow, the etch rate of both GaN and Al0.25Ga0.75N drop so drastically that it was impractical to obtain the etch rate and selectivity in a timely manner. Optimum selectivity was obtained with a low oxygen flow to inhibit Al0.25Ga0.75N etching while steadily etching GaN. Although Al0.25Ga0.75N acts as an etch stop with excellent selectivity, significant over-etching can still cause damage to the underlying layers through ion bombardment. This damage can be predicted through an extrapolation of collected experimental data points for a target a specific epitaxial sheet resistance. This allows sufficient over etch to maximize process margin while minimizing epitaxial damage.

Development of high performance green c-plane III-nitride light-emitting diodes.

The effect of employing an AlGaN cap layer in the active region of green c-plane light-emitting diodes (LEDs) was studied. Each quantum well (QW) and barrier in the active region consisted of an InGaN QW and a thin Al0.30Ga0.70N cap layer grown at a relatively low temperature and a GaN barrier grown at a higher temperature. A series of experiments and simulations were carried out to explore the effects of varying the Al0.30Ga0.70N cap layer thickness and GaN barrier growth temperature on LED efficiency and electrical performance. We determined that the Al0.30Ga0.70N cap layer should be around 2 nm and the growth temperature of the GaN barrier should be approximately 75° C higher than the growth temperature of the InGaN QW to maximize the LED efficiency, minimize the forward voltage, and maintain good morphology. Optimized Al0.30Ga0.70N cap growth conditions within the active region resulted in high efficiency green LEDs with a peak external quantum efficiency (EQE) of 40.7% at 3 A/cm2. At a normal operating condition of 20 A/cm2, output power, EQE, forward voltage, and emission wavelength were 13.8 mW, 29.5%, 3.5 V, and 529.3 nm, respectively.

Hole Transport Manipulation To Improve the Hole Injection for Deep Ultraviolet Light-Emitting Diodes

In this report, we propose to enhance the hole injection efficiency by adjusting the barrier height of the p-type electron blocking layer (p-EBL) for ∼273 nm deep ultraviolet light-emitting diodes (DUV LEDs). The barrier height for the p-EBL is modified by employing a p-Al0.60Ga0.40N/Al0.50Ga0.50N/p-Al0.60Ga0.40N structure, in which the very thin Al0.50Ga0.50N layer is able to achieve a high local hole concentration, which is very effective in reducing the effective barrier height of the p-EBL for holes. More importantly, besides the thermionic emission, such a p-EBL structure can also favor a strong intraband tunneling process for holes. As a result, we can obtain a more efficient hole injection into the quantum wells, leading to a remarkably improved optical power for the DUV LED with the proposed p-EBL architecture.

Performance enhancement of blue light-emitting diodes with InGaN/GaN multi-quantum wells grown on Si substrates by inserting thin AlGaN interlayers

We have grown blue light-emitting diodes (LEDs) having InGaN/GaN multi-quantum wells (MQWs) with thin AlyGa1−yN (0 < y < 0.3) interlayers on Si(111) substrates. It was found by high-resolution transmission electron microscopy observations and three-dimensional atom probe analysis that 1-nm-thick interlayers with an AlN mole fraction of less than y = 0.3 were continuously formed between GaN barriers and InGaN wells, and that the AlN mole fraction up to y = 0.15 could be consistently controlled. The external quantum efficiency of the blue LED was enhanced in the low-current-density region (≤45 A/cm2) but reduced in the high-current-density region by the insertion of the thin Al0.15Ga0.85N interlayers in the MQWs. We also found that reductions in both forward voltage and wavelength shift with current were achieved by inserting the interlayers even though the inserted AlGaN layers had potential higher than that of the GaN barriers. The obtained peak wall-plug efficiency was 83% at room temperature. We suggest that the enhanced electroluminescence (EL) performance was caused by the introduction of polarization-induced hole carriers in the InGaN wells on the side adjacent to the thin AlGaN/InGaN interface and efficient electron carrier transport through multiple wells. This model is supported by temperature-dependent EL properties and band-diagram simulations. We also found that inserting the interlayers brought about a reduction in the Shockley-Read-Hall nonradiative recombination component, corresponding to the shrinkage of V-defects. This is another conceivable reason for the observed performance enhancement.

Characterisation of Al0.52In0.48P mesa p-i-n photodiodes for X-ray photon counting spectroscopy

Results characterising the performance of thin (2 μm i-layer) Al0.52In0.48P p+-i-n+ mesa photodiodes for X-ray photon counting spectroscopy are reported at room temperature. Two 200 μm diameter and two 400 μm diameter Al0.52In0.48P p+-i-n+ mesa photodiodes were studied. Dark current results as a function of applied reverse bias are shown; dark current densities <3 nA/cm2 were observed at 30 V (150 kV/cm) for all the devices analysed. Capacitance measurements as a function of applied reverse bias are also reported. X-ray spectra were collected using 10 μs shaping time, with the device illuminated by an 55Fe radioisotope X-ray source. Experimental results showed that the best energy resolution (FWHM) achieved at 5.9 keV was 930 eV for the 200 μm Al0.52In0.48P diameter devices, when reverse biased at 15 V. System noise analysis was also carried out, and the different noise contributions were computed.

High Quantum Efficiency and Low Droop of 400-nm InGaN Near-Ultraviolet Light-Emitting Diodes Through Suppressed Leakage Current

High quantum efficiency and low efficiency droop of 400-nm InGaN near-ultraviolet (NUV) light-emitting diodes (LEDs) are achieved using Al 0.05 Ga 0.95 N quantum barriers and 3-nm thin Al 0.3 Ga 0.7 N insertion layer on last barrier before p-Al 0.15 Ga 0.85 N electron blocking layer. At 100 A/cm 2 , for the fabricated 0.1-mm 2 -size LEDs with special designed barriers, the external quantum efficiency increases from 23.8% to 40.7%, and the efficiency droop ratio decreases from 40.5% to as low as 10.3%, as compared with the conventional NUV LEDs. APSYS simulations reveal that a significant suppressed leakage current is the main reason for the performance enhancement.

Comparative Structural Characterization of Thin Al0.2Ga0.8 N/GaN and In0.17Al0.83N/GaN Heterostructures Grown on Si(111), by MBE, with Variation of Buffer Thickness

We report growth, by plasma-assisted molecular beam epitaxy, of thin Al0.2Ga0.8N/GaN and In0.17Al0.83N/GaN heterostructures on Si(111) substrate with three different buffer thickness (600, 400, and 200 nm). Successful growth by critical optimization of growth conditions was followed by comparative characterization of these heterostructures by use of high resolution x-ray diffraction (HRXRD), including reciprocal space mapping (RSM), room-temperature photoluminescence (RT-PL), and high resolution transmission electron microscopy (HRTEM). The effect of different buffer thickness on the threading dislocation (TD) density of a thin 1.5 nm Al0.2Ga0.8N/In0.17Al0.83N–1.25 nm GaN–1.5 nm Al0.2Ga0.8N/In0.17Al0.83N heterostructure, was also studied. Analysis revealed increasing tensile strain with decreasing buffer thickness for AlGaN-based samples; this was confirmed by the red-shift of the GaN RT-PL peak. Reduced strain in lattice-matched InAlN-based samples resulted in a blue-shift of the GaN RT-PL peak; this was indicative of better crystallographic quality than for the AlGaN/GaN samples, which was proved by XRD-FWHM and RSM results. A substantial reduction of TD density from approximately 1010 to 108 cm−2 with increasing buffer thickness resulted in a smooth thin active region for both thick buffer structures whereas the lattice-matched InAlN/GaN-based thick buffer resulted in less effect on TD and a smooth and prominent thin active region.

Electronic Coupling in Nanoscale InAs/GaAs Quantum Dot Pairs Separated by a Thin Ga(Al)As Spacer.

The electronic coupling in vertically aligned InAs/GaAs quantum dot (QD) pairs is investigated by photoluminescence (PL) measurements. A thin Al0.5Ga0.5As barrier greatly changes the energy transfer process and the optical performance of the QD pairs. As a result, the QD PL intensity ratio shows different dependence on the intensity and wavelength of the excitation laser. Time-resolved PL measurements give a carrier tunneling time of 380 ps from the seed layer QDs to the top layer QDs while it elongates to 780 ps after inserting the thin Al0.5Ga0.5As barrier. These results provide useful information for fabrication and investigation of artificial QD molecules for implementing quantum computation applications.

Atomic layer deposited Al2O3 on high quality p-type epitaxial-GaAs/Ge for advanced III–V/Ge based device application

Development of high quality p-type epitaxial gallium–arsenide (epi-GaAs) on germanium (Ge) with sub-nm surface roughness is much sought after for the next generation high speed transistors application. High quality zinc doped p-type epitaxial GaAs with surface roughness of ~0.87nm was grown on Ge substrates at 675°C. Thin Al0.3Ga0.7As buffer layer and un-doped GaAs of 300nm thick were introduced to suppress the Ge defects and auto-doping into epi-GaAs layer. The material and optical properties of the p-type epi-GaAs/un-doped GaAs/Al0.3Ga0.7As/Ge structures were examined through PL and Raman analysis. The metal–oxide–semiconductor capacitor (MOSC) was fabricated using p-type epi-GaAs layer and atomic-layer-deposited Al2O3 gate dielectric. The effective dielectric constant of the Au/Al2O3/p-epi-GaAs gate-stack is 5.9 and hysteresis voltage of 500mV was observed. The epi-GaAs layer is p-type in nature with doping densities of 5×1017cm−3.

Utilization of polarization-inverted AlInGaN or relatively thinner AlGaN electron blocking layer in InGaN-based blue–violet laser diodes

Polarization-induced downward band-bending at the interface between the last quantum barrier (QB) and electron blocking layer (EBL) potentially reduce the effective barrier height and thus may increase the electron leakage in InGaN-based blue–violet laser diodes (LDs). In this work, LD structures with a specially designed polarization-inverted AlInGaN EBL or with a relatively thin ternary Al0.2Ga0.8N EBL are proposed, and their influences on device characteristics are evaluated numerically by using the lastip simulation program. The results indicate that for LDs with proposed EBLs, the problem induced by electric field and the downward band-bending at the interface between the last QB and EBL is alleviated, which results in a reduction of the electron leakage and an improvement of the performances of LDs.

Effect of the Al0.3Ga0.7As interlayer thickness upon the quality of GaAs on a Ge substrate grown by metal-organic chemical vapor deposition

GaAs epilayers on Ge substrates are grown with a thin Al0.3Ga0.7As interlayer via metal-organic chemical vapor deposition with the goal of investigating the effect of the Al0.3Ga0.7As interlayer thickness upon the GaAs epilayer. The results show that as the Al0.3Ga0.7As interlayer thickness increases from 0 to 30 nm, both the crystal quality and surface morphology of the GaAs epilayer follow a trend of melioration and then deterioration. All of the Al0.3Ga0.7As interlayers investigated are seen to effectively block the diffusion of Ge atoms to the GaAs epilayers, and high crystalline quality GaAs epilayers with a smooth surface are obtained by growing a 15–23 nm-thick Al0.3Ga0.7As interlayer.

Polarization-Engineered Ga-Face GaN-Based Heterostructures for Normally-Off Heterostructure Field-Effect Transistors

Polarization-engineered Ga-face GaN-based heterostructures with a GaN cap layer and an AlGaN/p-GaN back barrier have been designed for normally-off field-effect transistors (FETs). The simulation results show that an unintentionally doped GaN cap and p-GaN layer in the buffer primarily deplete electrons in the channel and the Al0.2Ga0.8N back barrier helps to pinch off the channel. Experimentally, we have demonstrated a normally-off GaN-based field-effect transistor on the designed GaN cap/Al0.3Ga0.7N/GaN channel/Al0.2Ga0.8N/p-GaN/GaN heterostructure. A positive threshold voltage of 0.2 V and maximum transconductance of 2.6 mS/mm were achieved for 80-μm-long gate devices. The device fabrication process does not require a dry etching process for gate recessing, while highly selective etching of the GaN cap against a very thin Al0.3GaN0.7N top barrier has to be performed to create a two-dimensional electron gas for both the ohmic and access regions. A self-aligned, selective etch of the GaN cap in the access region is introduced, using the gate metal as an etch mask. The absence of gate recess etching is promising for uniform and repeatable threshold voltage control in normally-off AlGaN/GaN heterostructure FETs for power switching applications.

Formation of V-grooves on the (Al,Ga)N surface as means of tensile stress relaxation

In this paper we present a study of the relaxation mechanism of the top Al0.30Ga0.70N layer grown on GaN, as used in High Electron Mobility Transistor (HEMT) structures. We show that the initial mechanism for relaxation of strain is by means of formation of V-grooves on the surface of the Al0.30Ga0.70N. It is also demonstrated that a thin Si3N4 layer, grown in-situ, immediately after the AlxGa1−xN can “freeze-in” the surface structure. Using tapping mode Atomic Force Microscopy (AFM) it can be observed that immediately after termination of the growth of the thin Al0.30Ga0.70N layer, the steps on the surface show round shape and spiral-like features. After about 1 min of annealing time under NH3 flow the surface structures become straighter. Upon prolonged annealing a V-groove pattern is observed. These V-grooves run along the 〈−1–120〉 directions.Although some other facets can be observed, from cross-sectional Transmission Electron Microscopy (TEM) images we can infer that the side walls of the grooves are {1–101} planes and that the grooves do not penetrate till the Al0.30Ga0.70N/GaN interface. Therefore, we come to the conclusion that the initial relaxation of a thin Al0.30Ga0.70N layer does not occur via a dislocation glide mechanism leading to the formation of an array of misfit dislocations at the Al0.30Gas.70N/GaN interface. Instead, we propose that the mechanism is by surface instability leading to V-groove formation.

Emission characteristics of GaN-based blue lasers including a lattice matched Al0.83In0.17N optical blocking layer for improved optical beam quality

We demonstrate room-temperature continuous-wave operation of 425 nm InGaN-based blue laser diodes including a thin Al0.83In0.17N optical blocking layer. Structures are grown on c-plane GaN freestanding substrates with a lattice-matched AlInN layer positioned below an Al0.07Ga0.93N bottom cladding. Such devices are compared to standard InGaN based lasers looking at threshold current density, electrical characteristics, and far-field emission. Threshold current densities of 4 kA/cm2 and slope efficiencies of ∼0.6 W/A (for uncoated facets) have been achieved in AlInN containing devices. Lower mode leakage in the substrate is highlighted by a better transversal far-field pattern resulting in an improved beam quality.

Performance improvement of large area GaN MSM photodiode with thin AlGaN surface layer

PurposeThe purpose of this paper is to propose a new structure of GaN based metal‐semiconductor‐metal (MSM) photodiode, in which a thin unintentionally doped n‐type AlGaN layer is added on the conventional GaN on Si(111) device structure.Design/methodology/approachA thin Al0.50Ga0.50N cap layer of 100 nm was incorporated in GaN MSM photodiode to enhance the effective Schottky barrier height and reduce the dark current. When the incident light with photon energy higher than the band edge of GaN but lower than the bandgap of AlGaN illuminates the front face of photodiode, the light can be transparent in the top AlGaN layer and is only absorbed by the GaN layer. As a result, the photogenerated carriers in the GaN layer would be influenced by the interface states of AlGaN/GaN. It is known that the density of the interface states is normally lower than that of surface states, so the recombination of photogenerated electron‐hole pairs will be reduced. A barrier height of 0.54 eV for normal GaN MSM photodiode was increased to the effective barrier height of 0.60 eV.FindingsThe resulting MSM photodiode shows a dark current of as low as 8.0×10−4 A at 5 V bias, which is about two orders of magnitude lower than that of normal GaN (1.0×10−2 A at 5 V bias) MSM photodiode.Originality/valueThe paper reports on barrier enhanced GaN Schottky MSM photodiode using a thin AlGaN cap layer. AlGaN cap layers were found to effectively suppress the leakage current of the GaN Schottky MSM photodiode, resulting in improved device characteristics. The dark current for the Schottky contact with the AlGaN cap layer was shown to be about about two orders of magnitude smaller than that of conventional GaN Schottky MSM photodiode.

Asymmetric heterostructure for photovoltaic InAs quantum dot infrared photodetector

A photovoltaic InAs quantum dot-under-a-well photodetector is reported with a peak responsivity at 7 μm wavelength. In this structure, we implement an improved injection scheme, which allows a controlled feeding of the quantum dots through a modulation-doped InGaAs quantum well injector. A thin Al0.3Ga0.7As barrier significantly reduces the dark current and, at the same time, is responsible for the photovoltaic behavior. At 4 K and no applied bias, a responsivity of 2.5 mA/W and a detectivity of D∗=2.3×1010 cm Hz1/2/W in the dark is measured. The TBLIP of the device is 60 K and the D∗ at this temperature is 2×109 cm Hz1/2/W.