Intermetallic Compound Thickness Research Articles

Interfacial reaction on different solder composition after laser soldering

AbstractThis study used electroless nickel‐immersion gold surface finish. The lead free solder used are tin‐silver‐copper 305 and tin‐silver‐copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound′s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin‐silver‐copper 305 formed is rounded‐shaped and bar‐shaped, while tin‐silver‐copper 307 shapes are oval‐shaped and flake‐like. However, for cross‐sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite‐like and scale‐like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin‐silver‐copper 305 was increased from 0.98 μm to 8.34 μm while tin‐silver‐copper 307 was increased from 1.54 μm to 8.76 μm. The result also shows that nano‐sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin‐silver‐copper 305 and tin‐silver‐copper 307.

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 104 A/cm2 for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu6Sn5, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.

Tailoring intermetallic compound formation within laser weld brazed joints using a novel heat input approach

The challenge of intermetallic compound (IMC) embrittlement, resulting from thick IMC layers at the braze/substrate interface, and the lack of a clear strategy to manipulate IMC formation, has hindered the development of reliable laser weld brazing (LWB) processes. This study addresses these challenges by introducing a novel approach to IMC manipulation during LWB of thin-gauge Zn-coated steel with Si-bronze filler on a double-flanged lap joint. By shifting IMC formation from the interface towards the interior region of the braze, the research mitigates embrittlement by developing a new IMC category, termed surrounded interface-IMCs (SI-IMCs), distinct from traditional interface-IMCs (I-IMCs). The study proposes a Wire-adjusted heat input strategy to optimize brazing conditions, introducing a relative heat input equation (HIRelative) that correlates with various brazing defects and IMC formation. The generic scientific contribution of this work lies in identifying a critical HIRelative value of 32 J/mm for defect-free brazing, with an additional threshold of 12.44 J/mm above this level to promote a high density of SI-IMCs, occupying up to 38.2 ± 16.9 % of the braze cross-sectional area. These SI-IMCs, characterized by a shell-like Fe-Si layer and a bulky (Fe-rich)-Cu eutectic phase, enhance the mechanical performance of the brazed joints. Furthermore, this study reveals the novel role of Mn segregation in creating diffusion channels for Fe-Si IMC development, advancing the scientific understanding of IMC formation. Visualization through digital image correlation (DIC) during tensile testing showed that increasing the SI-IMC area fraction from 1.2 ± 2.4 % to 38.2 ± 16.9 % resulted in a 14 % increase in tensile peak load and a 350 % increase in ductility. This highlights the critical role of SI-IMCs in improving the strength and ductility of LWB joints, offering a new pathway for enhancing the performance of brazed structures.

Grain Microstructure in Friction-Stir-Welded Dissimilar Al/Mg Joints of Thin Sheets with/without Ultrasonic Vibration.

Electron backscattered diffraction (EBSD) characterization was conducted on the typical regions in friction-stir-welded dissimilar Al/Mg joints of 2 mm thick sheets with/without ultrasonic assistance. The effects of ultrasonic vibration (UV) on the grain size, recrystallization mechanisms, and degree of recrystallization on both sides of the Al-Mg bonding interface and the intermetallic compounds (IMCs) were investigated. It was found that on the Mg side of the weld nugget zone (WNZ), the primary dynamic recrystallization (DRX) mechanisms were discontinuous dynamic recrystallization (DDRX) and continuous dynamic recrystallization (CDRX), with geometric dynamic recrystallization (GDRX) playing a secondary role. On the Al side of the WNZ, CDRX was identified as the primary mechanism, with GDRX as a secondary contributor. While UV did not significantly alter the DRX mechanisms in either alloy within the WNZ, it promoted the aggregation and rearrangement of dislocations. This led to an increase in high-angle grain boundaries (HAGBs) and an enhanced degree of recrystallization in the welds. The average grain size in both the Al and Mg alloys of the WNZ followed a pattern of initially increasing and then decreasing along the thickness direction, reaching a maximum in the upper-middle part and a minimum at the bottom. The influence of UV on the average grain size in the WNZ was minimal, with only slight grain refinement observed, and the minimum refinement degree was only 0.9%. The Schmid factor (SF) on the WNZ and thermo-mechanically affected zone (TMAZ) boundary regions of the advancing side (AS) indicates that the application of UV increased the likelihood of basal slip and extension twinning in the crystal structure. In addition, UV reduced the thickness of IMCs and improved the strength of the Al-Mg bonding interface. These results suggest a higher probability of fracture along the TMAZ and WNZ boundary on the AS when UV was applied.

Optimization of Joining Parameters in Pulsed Tungsten Inert Gas Weld Brazing of Aluminum and Stainless Steel Based on Response Surface Methodology

Combining aluminum and steel offers a promising solution for reducing structural weight and fuel consumption across various industries. Pulse in tungsten inert gas (TIG) weld brazing effectively suppresses interfacial brittle intermetallics and enhances joint strength by influencing pool stirring and heat input during aluminum-to-steel joining. However, optimizing the pulsed TIG weld brazing process is challenging due to its numerous welding parameters. This study established statistical models for Al/steel joint strength without reinforcement using response surface methodology (RSM) based on central composite design (CCD). The models’ adequacy and significance were verified through analysis of variance (ANOVA). The four welding parameters influence weld strength in the following descending order: pulse on time > base current > pulse current > pulse frequency. Additionally, interactions between pulse current and pulse frequency, and between pulse on time and base current, were observed. Numerical optimization using RSM determined the optimal pulsed GTA weld brazing parameters for aluminum and stainless steel. With these optimized parameters, the joint strength reached 155.73 MPa, and the intermetallic compound (IMC) thickness was reduced to 3.4 μm.

Influence of FSW process on dissimilar T-joint of aluminum alloy to pure copper

ABSTRACT This work investigated the influence of friction stir welding (FSW) parameter on forming the dissimilar T-joint of aluminum alloy 6061 (AA6061) to pure copper (C1100). The experimental outcomes indicated that the hook formation trended to move toward the center of welding line at low welding and/or high rotational speeds. In all cases, the kissing bond (KB) defects were significantly observed in advancing (AS) compared to retreating sides (RS). The thickness of diffusion and intermetallic compound (IMC) layers decreased with increasing welding and/or decreasing rotational speeds. A highest joint efficiency was attained with approximately 74% at 500/125 rev/mm of the skin test and 34% at 500/100 rev/mm of the stringer tests. The fracture process under the stringer test initiated from the AS to the RS along the interface while that of the skin test cracked in the heat affected zone. Improving dissimilar T-joint of AA6061/C1100 was impacted not only by controlling the KB defect but also the IMC layer thickness.

A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface.

This paper conducted a high-temperature storage test (HTST) on bonded samples made of Pd100 (Pd-coated Cu wire with a Pd layer thickness of 100 nm) and Pd120, and studied the growth law of Cu-Ag intermetallic compounds and the inhibitory mechanism of Pd thickness on Cu-Ag intermetallic compounds. The results show that the Kirkendall effect at the bonding interface of the Pd100-bonded sample is more obvious after the HTST, the sizes of voids and cracks are larger, and the thickness of intermetallic compounds is uneven. But, the bonding interface of the Pd120-bonded sample has almost no microcracks, the Kirkendall voids are small, and the intermetallic compound size is uniform and relatively thin. The formation sequence of intermetallic compounds is as follows: Cu atoms diffuse into the Ag layer to form Ag-rich compounds such as CuAg4 or CuAg2, and then the CuAg forms with the increase in diffused Cu elements. Pd can significantly reduce the Kirkendall effect and slow down the growth of Cu-Ag intermetallic compounds. The growth rate of intermetallic compounds is too fast when the Cu bonding wire has a thin Pd layer, which results in holes and microcracks in the bonding interface and lead to the peeling of the bonding interface. Voids and cracks will hinder the continuous diffusion of Cu and Ag atoms, resulting in the growth of intermetallic compounds being inhibited.

Multiphase-field analysis of the intermetallic compounds formation & evolution in friction stir welding of dissimilar Al/Mg alloys

It is essential to understand the formation and evolution mechanism of intermetallic compounds (IMCs) in friction stir welding (FSW) of dissimilar Al/Mg alloys to mitigate the deleterious effect of hard and brittle IMCs on the performance of dissimilar joints. To this end, a multiphase-field model with input variables of both temperature and strain rate is developed to study the whole IMCs formation and growth process at the Al/Mg bonding interface in weld nugget zone. The effects of diffusion, elastic deformation, and large plastic deformation on the generation and growth of IMCs are considered. The numerical simulation results indicate that due to the influence of high dislocation density, the higher diffusion coefficient of the Mg matrix leads to the nucleation of Al12Mg17 first. When IMCs grow into layers, the higher diffusion coefficient of Al3Mg2 leads to a faster growth rate of Al3Mg2 than that of Al12Mg17. The elastic energy caused by lattice mismatch between IMCs and matrix plays an inhibitory role in the growth of IMCs. Large plastic deformation in FSW causes an increase in both the stored energy which promotes the IMCs growth and the dislocation density which intensifies the diffusion process, causing IMCs to form at the interface in a short time. With the model, the IMCs evolution from generation to growth is quantitatively analyzed. The predicted thickness of IMCs matches well with the experimental measurements.

Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

Cu pillar bump (CPB) technology as the representative advanced packaging technology possesses the characteristics of miniaturization and high density, thus playing an important role in the reliability of electronic devices. However, the brittle intermetallic compound (IMC) layer in the joints evidently affects the service performance and reliability of CPB joints. Thus, the influence of IMC layer thickness and microstructure needs to be carefully evaluated. In this study, the reliability of CPB joints with different IMC layer thickness under the condition of isothermal storage and room-temperature electromigration was tested, and the effect of initial IMC thickness of joints on the reliability was revealed. The full-IMC joints have the best isothermal storage reliability while the half-IMC joints perform the worst. Meanwhile, the thin-IMC joints own the best electromigration reliability but the full-IMC joints show the worst because that the initial voids in full-IMC joints accelerate the failure caused by electromigration.

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 solder balls were used to ensure consistency. LAB increases void fractions and coarsens the primary β-Sn phase with higher laser power, resulting in a larger eutectic network area fraction. In contrast, MR produces solder joints with minimal voids and a thicker intermetallic compound (IMC) layer. LAB-formed joints exhibit higher high-speed shear strength and lower brittle fracture rates compared to MR. The key factor in the reduced brittle fracture in LAB joints is the thinner IMC layer at the joint interface. This study highlights the potential of LAB in enhancing the mechanical reliability of solder joints in advanced electronic packaging applications.

Dissimilar linear friction welding of AZ31 magnesium alloy and AA5052-H34 aluminum alloy

The intermetallic compound (IMC) layer, tensile properties, and fracture behavior of dissimilar Mg/Al joints and their relationship during linear friction welding (LFW) are investigated to develop a strategy to obtain high-strength Mg/Al dissimilar materials. The thickness of the Mg/Al-based IMC layer decreases as the applied pressure increases and the frequency decreases. The IMC layer is mainly composed of Mg17Al12 and Mg2Al3 at the weld interface. The tensile strength of the joints fabricated at an appropriate frequency of 50 Hz and a high pressure of 200 MPa during LFW is 235 MPa, which is 94 % the tensile strength of AZ31 and is attributed to the effective suppression of the Mg2Al3 IMC layer growth. At a lower frequency, large defects and pores are formed near the weld interface edge on the Mg side owing to the low welding temperature. The joint fabricated at a higher frequency exhibits a thick and brittle Mg2Al3 IMC layer at the weld interface because of the high growth rate; thus, the dissimilar joints fractured primarily at the Mg2Al3 IMC layer. The inhibition of the Mg2Al3 IMC layer growth yields superior tensile properties in Mg/Al dissimilar materials.

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations

This study introduces a novel method for integrating aluminum flexible printed circuit boards (FPCBs) and copper FPCBs into battery management systems (BMS) using and instantaneous large area facial laser source soldering. Achieving a robust bonding strength of 65 MPa involved applying 600 W of laser power for 2 s, enhancing atom diffusion and promoting intermetallic compound (IMC) growth. Finite Element Method (FEM) simulations revealed variations in heat transfer between Al and Cu, affecting IMC thickness at interfaces. Formation of the (Cu, Ni)3Sn4 phase within solder, and variations in laser output significantly influenced solder joint orientation and Al electrode nucleation. Excessive laser power (>800 W) caused critical damage, such as delamination at the Al-PI interface, altering fracture modes and bonding strength. Furthermore, with a detailed examination of the laser soldering phenomenon through both experimental and numerical investigations, this study provides a thorough understanding of the different soldering mechanisms in conventional reflow soldering compared to instantaneous uniform large-area heat source laser soldering. These insights provide new design and material considerations to replace the conventional wiring harness with Al/Cu FPCB lap joints which optimize the circuitry and reducing BMS volume.

Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

This paper investigated the changes in microstructure, intermetallic compounds (IMC), and mechanical properties of Sn58Bi/Cu and Sn58Bi-0.6 Si3N4/Cu solder joints in the thermal aging process at 125 °C. With the increase of the thermal aging time, the Bi-phase was gradually coarsened, but the coarsening of the Bi-phase was suppressed after adding Si3N4 NPs. The thickness of the IMC increased continuously, and some areas even detached into the solder matrix, accompanied by gradual grain growth. For the samples with Si3N4 NPs, the IMC thickness significantly decreased, and the grain size was finer. Fractures mainly occur in the Bi-rich phase of the solder matrix following a brief period of thermal aging. However, as the aging time increases, the fracture location gradually shifts from the solder matrix to the IMC, resulting in intergranular and transgranular fractures. However, the shear strength of solder joints with added Si3N4 NPs was higher during the same aging period.

Reactive diffusion at the interface between Cu and Sn–Ag alloys

This study investigates the microstructural evolution and growth behavior of intermetallic compound (IMC) layers in the Cu/(Sn-yAg, y = 0.29–2.00 wt%) system during isothermal aging within the temperature range of 433–473 K. Through systematic variations in Ag content, aging temperature, and time, the fundamental mechanisms governing IMC formation and growth in Cu/(Sn–Ag) solder joints are elucidated. The results demonstrate that IMC growth kinetics follow a power-law relationship, with IMC layer thickness increasing systematically with annealing time. The addition of Ag significantly influences IMC nucleation and growth, with higher Ag content correlating with faster growth rates. Furthermore, the temperature dependence of IMC growth rates is investigated, revealing higher temperatures leading to increased growth rates, indicative of boundary diffusion-controlled growth. By calculating activation enthalpies, values of 36.4 kJ/mol for Sn-2.00Ag and 30.2 kJ/mol for Sn-0.50Ag were obtained, providing quantitative insights into the faster growth rate of intermetallic compound thickness in the Cu/(Sn-2.00Ag) diffusion couple within the experimental temperature range. These findings offer valuable insights into factors affecting the reliability and performance of solder joints in electronic packaging applications.

The effect of Sn interlayer on weld structure, intermetallic compounds, and joint properties of Al/Mg friction stir welding with ultrasonic assistance

ABSTRACT: The formation of intermetallic compounds (IMCs) is a primary factor that affects the welding joint between dissimilar materials. In this study, experiments were performed using Al/Mg friction stir welding (FSW) and ultrasonic vibration enhanced FSW (UVeFSW) with varying thicknesses of Sn interlayer. Detailed characterization and tests were conducted to explore the effect of Sn interlayer with or without ultrasonic vibration on weld surface morphology, macro-micro structure, generation of IMCs, and joint tensile strength. The study discusses the effect of ultrasonic vibration coupled with Sn interlayer and provides ideas for IMCs regulation when joining dissimilar materials. The study showed that adding a Sn interlayer cannot eliminate the generation of Al-Mg IMCs, but it can significantly reduce their thickness. Applying ultrasonic vibration with Sn interlayer can further reduce the thickness of Al-Mg IMCs and improve the interface microstructure from ‘IMC + matrix +IMC + matrix’ multilayer structures to simple IMCs structures. Furthermore, the highest joint strength was achieved when the Sn interlayer thickness was 0.1 mm during FSW. UVeFSW’s joint strength can be further improved with 0.05 mm and 0.1 mm Sn interlayer.

Phase field simulation of interface evolution behavior of copper–tin micro-solder joints under thermal–mechanical–electrical coupling

The thermal–mechanical–electrical-diffusion strongly coupled equations are established, and the phase field method is employed to investigate the dynamic simulation of intermetallic compound (IMC) evolution at the Cu/Sn/Cu micro-solder joint interface. By comparing with experimental results on IMC evolution in micro-solder joints, this study explores the evolution law of IMCs under the influence of current, temperature, and applied load coupling. Both simulation and experimental findings indicate that higher current density promotes IMC formation, with the largest average thickness observed at a current density of 5000 A/m2. When the analog current density is 5000 A/m2, the anode IMC has a rapid growth period at 62 h, and the corresponding cathode has a rapid consumption period; when the analog current density is 4000 A/m2, the anode has the same phenomenon in 95 h; when the analog current density is 3000 A/m2, this phenomenon is not evident. The observed phenomena are consistent with the evolutionary trend of IMC from the fourth to the fifth day of the experiment, considering it may be affected by ‘electronic wind stress’ which makes the cathode IMC migrate to the anode. The average thickness of IMCs with an analog ambient temperature of 323–353 K is the largest, which is most suitable for the growth of IMCs. The experimental results also indicate that IMC growth is the fastest at 353 K. The anode IMC was inhibited by tensile stress and shear stress, but the effect on cathode was not obvious.

Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints

As operating temperatures and times continue to increase for solder joints with Ni pads, large voids inevitably form at the intermetallic compound (IMC) – solder interface when the IMC thickness nears 5 μm. This leads to a significant reduction of strength, thermal conductivity, and fatigue resistance, and in small joints, also to electromigration life degradation. We have identified the voiding root cause as the breakdown and subsequent outgassing of deposition-related Ni-oxo-hydroxide impurities, impractical to avoid during Ni commercial electroplating. This work takes as the starting point a successful post-deposition voiding-mitigation treatment with 24-hour annealing at 450 °C. It then explores the possibility of rendering this routine more practical by lowering the annealing temperature down to 250 °C. While that approach shows relatively limited success, an alternative strategy, involving treatment with hydrogen evolution reaction for one hour at room temperature, alone or in combination with thermal, leads to a substantial reduction in the voiding propensity.

An insight into the interfacial structure and mechanical properties of Al/Cu laminate fabricated through cold spraying and post-treatment

The Al/Cu laminate was fabricated using cold spraying, and post-treatments of annealing and hot compression were conducted to enhance the mechanical properties of the laminate. The interfacial structure, microstructure, and mechanical properties were investigated. It was observed that cold spraying resulted in a mechanical bonding at the Al/Cu interface, and some pores, cracks, and other defects were present. During annealing treatment, intermetallic compounds (IMCs) such as CuAl2, Cu9Al4, and CuAl formed, and the thickness of IMCs increased with increasing temperature. The hot compression enhanced the density of the cold sprayed Cu layer and induced a large number of dislocations at Al and Cu layer, causing a great increase in tensile strength of the laminate. A good combination of tensile strength and elongation was achieved by performing both hot compression and annealing. Additionally, the microcracks generated by internal stress tended to form and propagate in the IMCs layer. IMCs can fill the pores at the interface, thereby increasing the interlayer bonding strength. However, when the thickness of IMCs reached a certain value, the bonding strength declined due to their brittle feature.

Achieving outstanding mechanical property after long-cycle thermal shock of reflow/ultrasonic-assisted Kovar/SnSb10 interfaces

The present study analyzed the microstructure evolution corresponding to the mechanical properties of reflow/ultrasonic-assisted Kovar/SnSb10/Fe joints after long-cycle thermal shock (TS). The results indicate that the thickness of interfacial intermetallic compounds (IMCs) at Kovar/SnSb interface with ultrasonication was less than 1 μm even after 2000 cycles, and almost no defects were detected, exhibiting superior microstructure stability. The ultimate shear strength with and without ultrasonication reached 58 MPa and 45 MPa, respectively. From TEM analysis, the nanoprecipitates inside Sn or IMC region primarily consisted of Ni3Sn4 and Ni3Sn phases. The ultimate outstanding mechanical property after long-cycle TS was attributed to dispersed strengthening and dislocation strengthening. This work provides valuable insights into the stability and reliability of the Kovar/SnSb10 system.

Effect of material position and tool offset on the microstructure and mechanical properties of friction stir welded AA7075/AZ31B with ultrasonic assistance

The primary focus of this study is to analyze how changes in material position and tool offset affect the microstructure and mechanical properties of dissimilar alloys (AA7075/AZ31B) joints. The study specifically examines these effects in normal and ultrasonic-assisted friction stir welded (UVaFSW) aluminum and magnesium-based joints. The experiment showed that the sound weld was achieved only when the AA7075 plate was placed on the advancing side (AS). The metallographic analysis showed that the use of ultrasonic vibration increased the flow of material in the nugget zone (NZ) and improved the length of interpenetration at the interface. Moreover, the intermetallic compound (IMC) layer thickness decreased throughout the interface during UVaFSW, improving joint strength. The maximum ultimate tensile strength was obtained at 1 mm tool-off condition for UVaFSW, i.e., 112.40 ± 7.24 MPa. Ultrasonic vibrations reduced the IMC thickness by up to 78 % at the middle of the joint interface. The fracture surface showed the ductile fracture mode in the case of UVaFSW compared to the FSW process. The current study establishes the framework for optimizing and controlling the welding process of dissimilar AA7075/AZ31B alloys, which possess considerable potential for use in the aviation industry.