Abstract
AbstractThis study used electroless nickel‐immersion gold surface finish. The lead free solder used are tin‐silver‐copper 305 and tin‐silver‐copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound′s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin‐silver‐copper 305 formed is rounded‐shaped and bar‐shaped, while tin‐silver‐copper 307 shapes are oval‐shaped and flake‐like. However, for cross‐sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite‐like and scale‐like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin‐silver‐copper 305 was increased from 0.98 μm to 8.34 μm while tin‐silver‐copper 307 was increased from 1.54 μm to 8.76 μm. The result also shows that nano‐sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin‐silver‐copper 305 and tin‐silver‐copper 307.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
