Dual-component epoxy resins are widely used for bonding different materials in automotive interior processing. However, due to the complexity and variability of automotive interior parts, uneven temperature distribution on curved surfaces during the thermoforming process can lead to uneven thermal stress distribution, damaging the interior components. This study focuses on addressing the damage issues caused by uneven thermal stress distribution during the thermoforming of automotive interior components. By monitoring the temperature and strain on the adhesive surface of the interior components during processing, using sensors and combining the readings with a finite element simulation, damage to the adhesive during processing was simulated. Based on this, a segmented thermoforming method for the model surface was employed, but it was found that this method did not significantly reduce the level of damage to the adhesive during application. Building upon the segmented simulation, significant results were achieved by applying temperature modulation at a certain frequency to adjust the damage of the interior components during processing. The techniques used in this study successfully reduced the unevenness of the adhesive surface temperature, improved the performance of the adhesive during application through segmented optimization and the application of ultrasound-assisted techniques, and markedly reduced the manufacturing process's energy consumption.