Phase change materials (PCMs) are a promising passive thermal management approach for electronic devices, offering the potential to extend device operational times and mitigate thermal instability by leveraging phase transition processes. However, the effectiveness of PCM-laden designs is hindered by numerous interfacial thermal resistances between the heat source and sink, particularly for high power levels and heat fluxes. Furthermore, space constraints for mobile devices make such a macroscale strategy impractical. In this work, we evaluate an alternate microscale integration strategy where we embed the PCM within the silicon die to both minimize the thermal resistance between the heat source and the PCM, and make them a viable solution for mobile devices. We fabricate thermal test vehicles (TTVs) of realistic mobile-chip form-factors with embedded metallic PCM, and experimentally evaluate them against an all-silicon counterpart. Notably, this work presents the first successful fabrication and transient thermal evaluation of a silicon device with fully-encapsulated PCM thermal energy storage. Experimental results demonstrate that embedding the PCM within the silicon die improves thermal performance, suppressing the maximum hotspot temperature rise by up to 14% and significantly reducing transient fluctuations by up to 65%. This integration strategy proves effective even under high heat flux conditions. Specifically, with an embedded square-shaped PCM reservoir, thermal stability increases by an average of 40% for a hotspot heat flux of 65 W cm-2. Additionally, an embedded-PCM TTV demonstrates stable performance for 10,000 continuous temperature cycles (total run-time of 34 h). The choices of a duty cycle time period and power level are crucial to embedded PCM effectiveness. An optimum combination of both ensures that all the embedded PCM is effectively utilized through consistent phase changes with minimal sensible heating. The substantial reduction in temperature fluctuations across multiple operational scenarios highlights the success of a PCM-based die-level thermal management approach.
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