Thermally-induced Voltage Alteration Research Articles

Preliminary Study on the Model of Thermal Laser Stimulation for Defect Localization in Integrated Circuits

Thermal Laser Stimulation (TLS) is an efficient technology for integrated circuit defect localization in Failure Analysis (FA) laboratories. It contains Optical Beam-Induced Resistance Change (OBIRCH), Thermally-Induced Voltage Alteration (TIVA), and Seebeck Effect Imaging (SEI). These techniques respectively use the principle of laser-induced resistance change and the Seebeck effect. In this paper, a comprehensive model of TLS technology is proposed. Firstly, the model presents an analytical expression of the temperature variation in Integrated Circuits (IC) after laser irradiation, which quantificationally shows the positive correlation with laser power and the negative correlation with scanning velocity. Secondly, the model describes the opposite influence of laser-induced resistance change and the Seebeck effect in the device. Finally, the relationship between the current variation measured in the experiment and other parameters, especially the voltage bias, is well explained by the model. The comprehensive model provides theoretical guidance for the efficient and accurate defect localization of TLS technology.

Diagnosis of Factors Impacting Yield in Multilayer Devices for Superconducting Electronics

The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at ambient temperature. TIVA is a commonly used, laser-based failure analysis technique developed for silicon-based microelectronics. The non-operational circuit consisted of an arithmetic logic unit (ALU) in a high-frequency test bed designed at HYPRES and fabricated by MIT Lincoln Laboratory using their SFQ5ee process. Localized TIVA signals were correlated with reflected light images at the surface, and these sites were further investigated by scanning electron microscopy imaging of focused ion-beam cross-sections. The areas investigated, where prominent TIVA signals were observed, showed seams in the Nb wiring layers at contacts to Josephson junctions or inductors and/or disrupted junction morphologies. These results suggest that the TIVA technique can be used at ambient temperature to diagnose fabrication defects that may cause low temperature circuit failure.

Characterization of electrically-active defects in ultraviolet light-emitting diodes with laser-based failure analysis techniques

Laser-based failure analysis techniques demonstrate the ability to quickly and non-intrusively screen deep ultraviolet light-emitting diodes (LEDs) for electrically-active defects. In particular, two laser-based techniques, light-induced voltage alteration and thermally-induced voltage alteration, generate applied voltage maps (AVMs) that provide information on electrically-active defect behavior including turn-on bias, density, and spatial location. Here, multiple commercial LEDs were examined and found to have dark defect signals in the AVM indicating a site of reduced resistance or leakage through the diode. The existence of the dark defect signals in the AVM correlates strongly with an increased forward-bias leakage current. This increased leakage is not present in devices without AVM signals. Transmission electron microscopy analysis of a dark defect signal site revealed a dislocation cluster through the pn junction. The cluster included an open core dislocation. Even though LEDs with few dark AVM defect signals did not correlate strongly with power loss, direct association between increased open core dislocation densities and reduced LED device performance has been presented elsewhere [M. W. Moseley et al., J. Appl. Phys. 117, 095301 (2015)].

Fault localization at high voltage devices using thermally induced voltage alteration (TIVA)

Conventional localization techniques such as photoemission microscopy (EMMI) or liquid crystal thermography (LCT) sometimes fail when applied to power semiconductor devices. Thermally induced voltage alteration (TIVA) is a good supplement to overcome difficulties which arise from high voltage (HV) in case of LCT. Missing transparency of the sample/missing photoemission are typical problems occurring during EMMI performed at power devices. In this paper case studies will be shown using a newly developed HV setup for TIVA which point out these advantages.

Optoelectronic Device Failure Analysis

Abstract This article discusses the types of defects that occur in vertical cavity surface-emitting lasers (VCSELs) and the tools typically used to detect them and identify the cause. It describes the basic design and operation of VCSELs and explains that most failures are due to dislocations in the crystal structure of the materials from which the devices are made. Of the various methods used to analyze such defects, electroluminescence (EL) is by far the most powerful as demonstrated in several EL images included in the article. The article also discusses the use of EBIC analysis, FIB cross-sectioning, and thermally induced voltage alteration (TIVA).

Thermally Induced Voltage Alteration (TIVA) applied to ESD induced failures

Thermally Induced Voltage Alteration (TIVA) applied to ESD induced failures

ABCs of IVAs

Abstract This article provides a qualitative overview of several new defect localization techniques, including charge-induced voltage alteration (CIVA), light-induced voltage alteration (LIVA), thermally-induced voltage alteration (TIVA), and Seebeck effect imaging (SEI). It explains how each method works in terms of the physics of signal generation and the types of images they produce. It also includes a summary highlighting the similarities and differences of each technique.

Techniques for Localization of IC Interconnection Defects

AbstractThe advances in integrated circuit technology has made failure site localization extremely challenging. Charge-Induced Voltage Alteration (CIVA), Low Energy CIVA (LECIVA), Light-Induced Voltage Alteration (LIVA), Seebeck Effect Imaging (SEI) and Thermally-Induced Voltage Alteration (TIVA) are five recently developed failure analysis techniques which meet the challenge by rapidly and non-destructively localizing interconnection defects on ICs. The techniques take advantage of voltage fluctuations in a constant current power supply as an electron or photon beam is scanned across an IC. CIVA and LECIVA are scanning electron microscopy (SEM) techniques that yield rapid localization of open interconnections. LIVA is a scanning optical microscopy (SOM) method that yields quick identification of damaged semiconductor junctions and determines transistor logic states. SEI and TIVA are SOM techniques that rapidly localize open interconnections and shorts respectively. LIVA, SEI, and TIVA can be performed from the backside of ICs by using the proper photon wavelength. CIVA, LECIVA, LIVA, TIVA, and SEI techniques in terms of the physics of signal generation, data acquisition system required, and imaging results displaying the utility of each technique for localizing interconnection defects. In addition to the techniques listed above, the Resistive Contrast Imaging (RCI) for localizing opens on metal test patterns will be described as a starting point for the “IVA” technologies.

Global fault localization using induced voltage alteration

Advances in integrated circuit technology have made failure site localization extremely challenging. Charge-induced voltage alteration (CIVA), low energy CIVA (LECIVA), light-induced voltage alteration (LIVA), Seebeck effect imaging (SEI) and thermally-induced voltage alteration (TIVA) are five recently developed failure analysis techniques which meet the challenge by rapidly and non-destructively localizing interconnection defects on ICs. The techniques take advantage of voltage fluctuations in a constant current power supply as an electron or photon beam is scanned across an IC. CIVA and LECIVA are scanning electron microscopy techniques that yield rapid localization of open interconnections. LIVA is a scanning optical microscopy (SOM) method that yields quick identification of damaged semiconductor junctions and determines transistor logic states. SEI and TIVA are SOM techniques that rapidly localize open interconnections and shorts respectively. LIVA, SEI, and TIVA can be performed from the backside of ICs by using the proper photon wavelength. This paper describes the CIVA, LECIVA, LIVA, TIVA, and SEI techniques in terms of the physics of signal generation, general data acquisition system required, and imaging results displaying the utility of each technique for localizing interconnection defects.

Backside Analysis: Developments in SEI and TIVA

Abstract Recent developments in two relatively new failure analysis techniques, Seebeck effect imaging (SEI) and thermally-induced voltage alteration (TIVA), have greatly improved their defect detection sensitivity and image acquisition times for localizing open and shorted interconnections. This article presents several examples demonstrating the enhanced capabilities of these two methods.

Thermal modeling of a polysilicon-metal test structure used for thermally induced voltage alteration characterization

Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by localized heating with an infrared laser. Localized laser heating is the basis of a new failure analysis technique, thermally induced voltage alteration (TIVA), that can identify shorted interconnects in integrated circuits. The modeling results show that variations in thermal profiles of the test structure measured by the TIVA technique are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are small compared to the length over which the heat spreads.

TIVA and SEI developments for enhanced front and backside interconnection failure analysis

Thermally-Induced Voltage Alteration (TIVA) and Seebeck Effect Imaging (SEI) are newly developed techniques for localizing shorted and open conductors from the front and backside of an IC. Recent improvements have greatly increased the sensitivity of the TIVA/SEI system, reduced the acquisition times by more than 20X, and localized previously unobserved defects. The system improvements, non-linear response of IC defects to heating, modeling of laser heating and examples using the improved system are presented.

Local thermal probing to detect open and shorted IC interconnections

A new failure analysis technique has been developed for backside and frontside localization of open and shorted interconnections on ICs. This scanning optical microscopy technique takes advantage of the interactions between IC defects and localized heating using a focused infrared laser ( λ=1340 nm). Images are produced by monitoring the voltage changes across a constant current supply used to power the IC as the laser beam is scanned across the sample. The method utilizes the Seebeck Effect to localize open interconnections and Thermally-Induced Voltage Alteration to detect shorts. The interaction physics describing the signal generation process and several examples demonstrating the localization of opens and shorts are described. Operational guidelines and limitations are also discussed.