Microchannel heat sinks (MCHS) have emerged as pivotal components in advanced thermal manage-ment systems due to their superior heat transfer capabilities. Fin-type heat sinks, essential for efficient thermal management in electronic devices, are evaluated through a series of experimental and numeri-cal studies. This paper reviews recent advancements in the design and performance analysis of various fin-type heat sinks, including micro pin-fins of different geometries and dimensions. By comparing the heat transfer efficiency and pressure drops among different designs and operating conditions, this re-view aims to provide insights into optimizing fin-type heat sinks for improved thermal management.