This study examined the thermal performance of Comfortboard23, a commercial gypsum board from Knauf infused with phase change material (PCM). Structural characterization using XRD and SEM confirmed the presence of microencapsulated PCM within the gypsum matrix. The study does not provide a direct comparison between Comfortboard23 and other PCM-integrated gypsum boards on the market. This is a limitation of the research. A comprehensive comparison would involve testing multiple products under identical conditions, and evaluating factors such as thermal performance, cost-effectiveness, durability, and ease of installation. Thermal characterization involved a novel low-scale thermal chamber to measure U-value, thermal conductivity, heat storage capacity, and dynamic thermal response. Results showed incorporating PCM decreased the U-value by 2% compared to standard gypsum boards. Additionally, PCM inclusion increased heat storage capacity by around 45% and improved dynamic thermal characteristics by decreasing thermal stability coefficient from 0.92 to 0.76 and increasing thermal lag from 0.27 to 0.49 h. The 45% increase in heat storage capacity of Comfortboard23 could lead to a 10–20% reduction in heating and cooling energy consumption, improved thermal comfort, and potential HVAC downsizing. Exact benefits depend on climate, building design, and occupancy patterns, necessitating further research in diverse real-world settings. The findings demonstrate Comfortboard23’s potential for enhancing thermal energy storage in buildings, contributing to energy savings, improved thermal comfort, and reduced temperature fluctuations across varying daily temperatures. Overall, the study highlights the promise of Comfortboard23 as an energy-efficient PCM-integrated building material.