Thermal Conductive Fillers Research Articles

3D printing, leakage-proof, and flexible phase change composites for thermal management application

Phase change composites (PCCs) have attracted much attention in the fields of thermal management due to their high latent heat. However, their risk of leakage and poor shape designability greatly limit their industrial applications. Therefore, there is an urgent need to develop leakage-proof and customizable PCCs to meet the emerging requirements of thermal management applications. Some scholars have proposed the concept of preparing PCCs by 3D printing technology, aiming to meet customized thermal management requirements of various electronic devices. Nevertheless, the phase change material leaking of PCCs under high temperature is still a tough problem to solve. In this study, expanded graphite (EG) is used as the carrier for paraffin wax (PW), which names as EP can tightly enveloping PW in its porous structure. Then, an innovative carbomer gel ink is prepared for 3D printing using EP and short carbon fiber (SCF) as thermal conductive fillers. Freeze-drying and polydimethylsiloxane (PDMS) infiltrating procedures are furtherly performed to ensure the flexibility of final PCCs samples. A maximum thermal conductivity of 2.89 W/(m·K) is obtained when the content of SCF/EP filler is 10 wt%. Importantly, the flexible PCCs prepared through this method effectively prevent the PW leaking during thermal management applications, thereby avoiding the consequent safety risks and enhancing the lifespan of electronic devices. This work opens up a promising pathway for the rapid fabrication of leakage-proof, customizable and flexible PCCs.

Thermal interface materials: From fundamental research to applications

AbstractThe miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in semiconductor industry. A comprehensive examination of interfacial thermal resistance has been given from physics perspective in 2022 in Review of Modern Physics. Here, we provide a detailed overview from a materials perspective, focusing on the optimization of structure and compositions of thermal interface materials (TIMs) and the interact/contact with heat source and heat sink. First, we discuss the impact of thermal conductivity, bond line thickness, and contact resistance on the thermal resistance of TIMs. Second, it is pointed out that there are two major routes to improve heat transfer through the interface. One is to reduce the TIM's thermal resistance (RTIM) of the TIMs through strategies like incorporating thermal conductive fillers, enhancing interfacial structure and treatment techniques. The other is to reduce the contact thermal resistance (Rc) by improving effective interface contact, strengthening bonding, and utilizing mass gradient TIMs to alleviate vibrational mismatch between TIM and heat source/sink. Finally, such challenges as the fundamental theories, potential developments in sustainable TIMs, and the application of AI in TIMs design are also explored.

Fabrication of boron nitride/copper oxide@multi-walled carbon nanotubes composites for enhancing heat transfer and photothermal conversion of phase change materials

To realize the efficient storage and conversion of solar energy by phase change materials (PCMs), low photothermal conversion efficiency and poor heat transfer performance remain great challenges. Herein, polyethylene glycol (PEG)-based composite PCMs with excellent photothermal conversion performance and exceptional thermal management capability were obtained by using boron nitride/copper oxide@multi-walled carbon nanotubes (BN/CuO@MWCNTs) as the thermal conductive and photothermal conversion enhancement fillers. The results indicate that owing to the bridging effect, the introduction of CuO and MWCNTs on the BN surface can construct additional heat transfer paths, resulting in a high thermal conductivity of up to 2.35 W/(m·K) for the as-prepared PEG/BN/CuO@MWCNTs composite, which is about 9-folds enhancement than pristine PEG. Simultaneously, the supercooling degree of PEG in PEG/BN/CuO@MWCNTs is effectively suppressed due to the synergistic nucleation effect of BN, CuO and MWCNTs. Additionally, the PEG/BN/CuO@MWCNTs composites not only exhibit a high latent-heat capacity of 154.5 J/g and a high photothermal conversion efficiency of 92.2 %, but also show favorable shape stability and durable reliability. This work offers a workable solution for the synergistic enhancement of photothermal conversion and thermal management, which can effectively promote the practical application in solar energy conversion and storage.

Investigation on the fabrication and mechanism of thermally conductive bismaleimide composites with low dielectric constant via a branched crosslink structure

In order to address the challenges associated with the low mechanical strength and inadequate thermal conductivity of bismaleimide resin(BMI), trifunctional maleimide (TMI) was synthesized by reacting toluene diisocyanate (TDI trimer) with maleic anhydride (MA) in this study and reacted with diallyl bisphenol A (DBA) and BMI to prepare BMI-TMI resin with a micro-branching structure. This well-designed micro-branching structure resulted in an 8.8 % decrease in the dielectric constant by increasing the free volume of BMI. Additionally, the micro-branching structure endowed BMI resin with improved mechanical properties, as evidenced by a 140 % increase in bending strength and a 149 % increase in impact strength of the cured product. Similarly, utilizing the free volume in micro-branched polymers to construct voids in molecular chain segments facilitates better dispersion of aluminium oxide (Al2O3) thermal conductive fillers, forming a continuous thermal conductive network and providing a high-speed channel for phonon transport, thereby significantly improving the thermal conductivity of the composite material.

Dual regulation of thermal conductivity and mechanical performance of nano cellulose-based composite via mimicking plant cell wall structure

Combining thermal conductive fillers and flexible polymers is an agile approach to fabricating composites with heat-conducting performance. However, the thermal conductivity of the composites is hard to reach an equal level to the functional fillers. The mainspring is that the thermally conductive pathways within the composite could not be well-constructed due to the air-induced interface thermal resistance. Herein, inspired by the plant cell wall structure, polyvinyl alcohol (PVA) with abundant hydroxyl groups was adopted as a binder for boosting the thermally conductive pathways construction between cellulose nanofiber (CNF) and alkalized hexagonal boron nitride (BN-OH), also for strengthening the mechanical performance of the composite. The results showed that the tensile strength and through-plane thermal conductivity of the composite were high up to 91.0 MPa and 2.2 W m−1 K−1 at 40 wt% PVA content, exhibiting 121 % and 450 % enhancements compared to pure CNF film (41.2 MPa and 0.4 W m−1 K−1). Moreover, the composite also presented high thermal stability (decomposition temperature of onset was 218 °C) and good hydrophobicity properties. Overall, this study innovatively proposes an idea for enhancing the thermal conductivity and improving the mechanical properties of the composite, which is indispensable for developing thermal management materials for next-generation electronics.

Surfactant hydrophilic modification of expanded graphite to fabricate water-based composite phase change material with high latent heat for cold energy storage

Glycine water-based (GW) phase change material (PCM) is considered a promising candidate for cold energy storage due to its lower cost and high latent heat. However, low thermal conductivity hinders its practical application. Adding high thermal conductive fillers can effectively enhance the thermal conductivity of PCM, but it also leads to a decrease in enthalpy. Thus, the study employed a non-covalent functionalization method to modify the thermal conductivity filler of expanded graphite (EG) using the surfactant Triton X-100 (TX-100) in this study. The hydrophilic groups in TX-100 facilitated the formation of hydrogen bonds between modified expanded graphite (MEG) and GW PCM, thereby inhibiting the enthalpy loss of GW/MEG materials. The prepared GW/MEG composites containing 2 to 8 wt% of MEG exhibited thermal conductivities ranging from 0.88 to 1.28 W/(m·K), representing an increase of 46.47 % ∼ 113.35 %. Simultaneously, the melting temperature ranged from −5.35 to −5.65 °C, with a high melting latent heat of 284.6 to 264.5 J/g. After 100 thermal cycles, only minor fluctuations in melting temperature (−1.62 % ∼ +2.20 %) and latent heat (−2.18 % ∼ −4.66 %) were observed. Furthermore, the application of GW/MEG2 in cold storage of strawberries resulted in a significant reduction in pre-cooling time by 56.60 % compared to that of ice storage. The GW/MEG2 materials allow strawberries to be refrigerated for up to 17.86 h within the temperature range of 1.54 ∼ 3.39 °C. This study provides an effective solution for short-distance transportation of perishable food within cold chain logistics system.

Study on the impact of hybridization of spherical fillers with size differences and sheet fillers on the thermal conductivity and anticorrosive performance of composite coatings

AbstractThe improvement of anti‐corrosion performance and enhancement of functionality in anti‐corrosion coatings are essential. Boron nitride (BN), as a two‐dimensional thermal conductive filler, is incorporated into composite coatings to provide corrosion resistance and thermal conductivity. The combination of BN with zero‐dimensional filler alumina (Al2O3) proves to be an effective method for enhancing the thermal conductivity of composite coatings. In this study, micro alumina (Micro‐Al2O3) and/or nano alumina (Nano‐Al2O3) were combined with BN to be integrated into waterborne epoxy resin (WER), resulting in different composite coatings (BN@Micro‐Al2O3/WER, BN@Nano‐Al2O3/WER, and BN@Micro‐Al2O3/Nano‐Al2O3/WER). The influence of different hybrid modes of two‐dimensional and zero‐dimensional thermal conductive fillers on corrosion resistance and thermal conductivity was discussed. The composite coating BN@Micro‐Al2O3/Nano‐Al2O3/WER exhibits the highest thermal conductivity at 0.789 W/mK with a filler loading of 30 wt% BN, 4 wt% Micro‐Al2O3, and 6 wt% Nano‐Al2O3. Meanwhile, the composite coating BN@Nano‐Al2O3 demonstrates superior anti‐corrosion performance at a filler loading of 20 wt% BN and 10 wt% Nano‐Al2O3. After immersion in a 28‐day period in a NaCl solution with a concentration of 3.5%, the impedance modulus remains above 109 Ω·cm2, while corrosion current density is measured at 7.3367 × 10−8 A/cm2. The hybrid mode involving two‐dimensional and zero‐dimensional thermal conductive fillers can effectively improve the composite coatings' corrosion resistance and thermal conductivity. There are variations in the optimal hybrid methods for incorporating two‐dimensional and zero‐dimensional thermal conductive fillers to enhance anti‐corrosion and heat conduction effectiveness of coatings.Highlights The properties of coating is improved by the incorporation of BN and Al2O3. The prepared coating performs good thermal conductivity. The synergy of BN and Al2O3 can improve thermal conductivity significantly. The obtained coating performs good corrosion resistance. The synergy of BN and Al2O3 can also improve anti‐corrosion effectively.

Constructing bidirectional heat flow pathways by curved alumina for enhanced thermal conductivity of epoxy composites

The polymer-based composites filled with high thermal conductive fillers have received much attention in the filed of electronic package. However, traditional Al2O3 filled polymer-based composites always hardly simultaneously achieve high thermal conductivity in both horizontal and vertical directions with a low loading. Herein, curved Al2O3 particles have been fabricated via spray assembly and high-temperature sintering and subsequently are infiltrated by epoxy (EP) to obtain Al2O3/EP composites. The formation mechanism of the curved Al2O3 is analyzed in this work. The curved Al2O3 architectures are orderly stacked in EP matrix, which achieve significantly enhanced in-plane (1.21 W/m·K) and through-plane (1.46 W/m·K) thermal conductivity with a low filler loading (19.9 vol%). Importantly, the wall structure of curved Al2O3 particle consists of continuous network structure and interconnected channels, which reduce the thermal expansion coefficient of the composites. Consequently, the design of curved Al2O3 offers a new strategy for next-generation thermal management materials.

Preparation of thermally conductive polyimide/aluminum oxide/boehmite composite separators for enhancing lithium‐ion battery safety and performance

AbstractThis study endeavors to enhance the safety of lithium‐ion batteries (LIBs) by synthesizing a polyamide acid (PAA)/Al2O3 composite spinning solution using 4,4′‐diaminodiphenyl ether (ODA) and pyromellitic anhydride (PMDA) as monomers, and nano‐Al2O3 as a thermal conductivity filler. Subsequently, the PAA/Al2O3 fiber membrane is fabricated via electrostatic spinning, followed by gradient heating imidization to produce a polyimide (PI)/Al2O3 composite membrane. This membrane is then dipped into a boron nitride (BM) slurry to ultimately yield an organic–inorganic PI/Al2O3/BM composite separator with superior flame‐retardant and thermal conductivity properties. The thermal stability, flame retardancy, electrolyte wettability, mechanical integrity, and cycle rate performance of the composite membranes are rigorously evaluated. The results demonstrate that the PI/5% Al2O3/BM composite membrane exhibits the most favorable overall performance, with no shrinkage observed at 200°C and no significant changes after sustained ignition for 10 s. The incorporation of the thermal conductivity Al2O3 filler significantly enhances the heat transfer properties of the composite separator. The room temperature ionic conductivity reaches 2.786 mS cm−1 after electrolyte absorption, and the initial discharge capacity of the assembled battery is 156.28 mAhg−1. Following 100 charge/discharge cycles at 0.2C, the capacity retention rate is 97.7%, and at a discharge rate of 5C, the capacity retention rate is 74.9%.

Experimental investigation on hydrated salt phase change material for lithium-ion battery thermal management and thermal runaway mitigation

To efficiently ensure the suitable temperature for lithium-ion batteries, battery thermal management system based on phase change material (PCM) have gained considerable attention. A shape-stabilized composite PCM was prepared using the mixture of Na2SO4·10H2O and KAl(SO4)2·12H2O hydrated salts as phase change substrate, expanded graphite as thermal conductive filler and open-cell polyurethane foam as support material. The composite PCM containing 4 wt.% expanded graphite displayed a satisfied phase change temperature of 30.8 °C and 69.8 °C, high latent heat of 226.9 J/g, and good thermal conductivity of 1.39 W/(m·K). Meanwhile, it obtained a low subcooling degree, good leakage resistance, and excellent flame retardancy properties. Under PCM cooling in sandwich structure, during 0.5C charging and 1.5C discharging cycles, the maximum temperature and maximum temperature difference of battery were 52.47 °C and 2.20 °C, decreased by 20.4 % and 59.7 % respectively compared with nature air cooling. Furthermore, the composite PCM could significantly relieve the thermal runaway propagation between lithium-ion batteries. This work provides a feasible design and application strategy of hydrated salt based PCMs for battery thermal management and thermal runaway mitigation.

Exploring the Impact of Visual Heat Conduction Paths on Thermal Conductivity of Polymer Composites and the Practical Applications.

The theory of heat conduction paths has been widely recognized and widely studied in the research about the thermal conductivity of thermal conductive polymer composites at present. Encapsulating polymer pellets with thermally conductive fillers and processing them into thermally conductive polymer composites is a simple and effective method for constructing heat conduction paths. It is meaningful to investigate the related heat conduction mechanism of this method. Otherwise, this approach can significantly preserve the performance of the polymer substrate, making it highly valuable for practical material applications. In this work, polyethylene-octene elastomer (POE) pellets were encapsulated with thermal conductive fillers by physical absorption. Subsequently, the composite films containing heat conduction paths were fabricated using the encapsulated POE pellets through a heating press. Alumina (Al2O3), boron nitride (BN), and alumina/boron nitride hybrid (Al2O3/BN) fillers were used to prepare Al2O3@POE, BN@POE, and BN/Al2O3@POE composite films to investigate the influence of filler shapes on heat conduction path construction. The influence of the constitute and density of heat conduction paths on the thermal conductivity of composite films was analyzed by infrared thermal imaging, finite element analysis, and thermal resistance theory in detail. Owing to the reserved good adhesion and flexibility of the POE substrate, the composite films could be directly used as thermal interface materials for chip cooling, which presented a good heat dissipation effect. Furthermore, a series of integrated composite materials were prepared by the combination of encapsulated pellets with various functional films (copper foil, aluminum foil, and graphite sheet) through a one-pot heating press, exhibiting a good electromagnetic shielding effect. The performance of the composites and the corresponding preparation method demonstrate the strong significance of this research for practical applications.

Thermally conductive silver adhesive enhanced by MXene@AgNPs with excellent thermal conductivity for thermal management applications

The Thermal Conductive Silver Adhesive (TCSA) efficiently transfers heat from electronic components to heat dissipation components, preventing overheating and extending device lifespan. Despite the effectiveness of commercial sintered nano TCSA, high production costs necessitate a more affordable, high-performance preparation method. This study presents a strategy for preparing ultra-high thermal conductivity (TC) TCSA using multidimensional thermal conductive fillers and low-temperature sintering of silver nanoparticles (AgNPs). MXene@AgNPs particles are synthesized via in-situ reduction of AgNPs on MXene surfaces. These particles, combined with silver microflakes (AgMFs) as primary fillers and epoxy (EP), undergo low-temperature heat treatment to form the AgMFs-MXene@AgNPs/EP composite. Characterization and computational models show that filler-filler interface thermal resistance (ITRf-f) is critical for TC. Adding MXene alone is insufficient, but using MXene@AgNPs particles as secondary fillers allows AgNPs to interconnect fillers, effectively reducing the ITRf-f. The resulting composite achieves an ultra-high TC of 65.51 Wm−1K−1 with 63 wt% total filler content (60 wt% AgMFs, 3 wt% MXene@AgNPs). This study advances the development of low-cost, high-performance TCSA for thermal management applications.

Multi‐layer graphene nanosheets bridging binary aluminium oxide for the synergistic enhancement of thermal conductivity and electrical insulation of silicone resin composite

AbstractThe flexible polymer composites usually require high intrinsic thermal conductivity fillers for the applications in thermal management, such as the well‐known graphene, which can, in turn, compromise their electrical insulation properties. Here, the authors developed the silicone resin (SR) composites filled with multi‐layer graphene nanosheets (MGN) and binary alumina (Al2O3), and the microstructure of composites exhibits the dominant skeleton of large‐sized Al2O3 filler and branching of small‐sized Al2O3 fillers features by the size matching effect of optimal binary Al2O3. The introduction of supplementary MGN fillers further increases the face‐to‐face contact probability and bridges the isolated binary Al2O3, which contributes to the high thermal conductivity of 3.0 W·m−1·K−1 under these synergistic effects. The dense and connected ‘Al2O3‐MGN‐Al2O3’ thermal conductive pathway is successfully built, as supported by the numerical simulation and Agari model fitting. Meanwhile, the electrical conductivity caused by MGN can be blocked by the surrounding insulation Al2O3 filler network, exhibiting a high volume resistivity of 1.7 × 1015 Ω · cm. Moreover, the Al2O3/MGN/SR composite films effectively transfer the heat and diminish the hot‐spot temperature by 53.5°C in cooling light emitting diode chip module application.

Wearable thermoelectric cooler encapsulated with low thermal conductivity filler and honeycomb structure for high cooling effect

Thermoelectric coolers (TEC) based on Peltier effect has been widely used in small scale cold storage because of its zero emission, and high efficiency, while wearable thermoelectric coolers (WTEC) for personal temperature management is garnered tremendous scientific attention. For out-of-plane structured WTEC using inorganic TE materials encapsuled in flexibility substrate, on the one hand, encapsulating materials are required to have low thermal conductivity, high reliability and high flexibility, and on the other hand, heat dissipation of devices is required to be lightweight, portable and efficient. For this reason, we propose a composite material synthesised from SiO2 aerogel, hollow glass beads (HGB) and polydimethylsiloxane (PDMS) as a filler, which takes advantage of the low thermal conductivity of (0.094 W/mK) to increase the temperature difference in the encapsulation layer of the device, and moreover performs the fabrication of honeycomb holes, which further reduces the thermal conductivity of the encapsulation layer and at the same time brings a certain degree of compression resistance to the device. Radiative cooling (RC) films synthesised using hexagonal boron nitride (HBN) and PDMS for lowering the temperature of the hot side in outdoor environments without additional energy consumption, providing heat dissipation at the hot side. Honeycomb wearable thermoelectric cooler (HWTEC) proposed in this work deliver high cooling temperature difference of 9.1 °C and 6.5 °C indoor and outdoor through human wear. Our work represents an important step in the development of flexible TE devices and is believed to have promising future applications in personal thermal management, e-skin and smart textiles.

Flexible, thermally conductive, electrically insulated, and high‐temperature resistant PDMS@BN composite films with high orientation degree of BN sheets prepared by facile spin‐coating

AbstractCurrently, flexible thermal interface materials (TIMs) containing hexagonal boron nitride (h‐BN) as thermal conductive fillers become a research hot spot. In this study, PDMS@BN composite films were prepared using spin‐coating technology, providing a facile and efficient method for the preparation of TIMs. The effects of spin‐coating speed and time on the thermal conductivity and the orientation degree of BN within composite films were investigated. Additionally, a theoretical model was established to calculate the thickness and thermal conductivity of PDMS@BN composite films under various spin‐coating conditions. The findings indicate that with an increase of spin‐coating speed and extension of spin‐coating time, the thickness of the composite films gradually decreases, while the in‐plane and through‐plane thermal conductivity gradually increases. When compared to a low spin‐coating speed of 500 rpm, the thermal conductivity of the films produced by a higher speed of 2500 rpm, exhibited an increase of 274%. The film achieves outstanding thermal conductivity (5.79 W m−1 K−1), extremely thin thickness (60 μm), high volume resistivity (1.22 × 1013 Ω cm) and excellent flexibility by incorporating 60 wt % h‐BN flakes. Overall, this study presents an efficiently and eco‐friendly approach for high‐performance TIMs.

Macromolecular piperazine/aluminum phosphate hybrid and its efficient intumescent flame retardant/thermal conductive polypropylene

Achieving a delicate balance between fire resistance and thermal conductivity in intumescent flame-retarded polypropylene (PP) poses a formidable challenge, primarily due to the susceptibility of intumescent barrier layers to functional fillers. To address this concern, a novel hybrid macromolecule (Al-PAP) was synthesized via polycondensation reaction, showcasing promising potential in constructing flame-retardant and thermally conductive PP. Remarkably, the inclusion of mere 14 wt% of the Al-PAP/melamine polyphosphate (Al-IFR) system raised the limiting oxygen index (LOI) of PP to 28.3 %, equivalent to that of PP containing 20 wt% of the conventional system, emphasizing the superior efficacy of the hybrid Al-PAP. Further, the PP with 20 wt% Al-IFR performed a 32.2 % of LOI, 850 °C of glow wire ignition temperature, >960 °C of glow wire flammable index and UL 94 V-0 ratings (3.2 mm & 1.6 mm), indicating the high flame retardancy. Subsequently, three thermal conductive fillers – aluminum oxide, boron nitride, and multi-walled carbon nanotubes – were evaluated based on a 20 wt% dosage of Al-IFR. Alumina emerged as the optimal candidate, enhancing flame retardancy and smoke suppression while imparting thermal conductivity to PP. Conversely, the other two fillers compromised fire-safety performance. Notably, the composite 5Al2O3/20Al-IFR/PP exhibited a 90.8 % lower peak heat release rate and an 88.2 % lower peak smoke production rate compared to PP. Additionally, its thermal diffusivity and thermal conductivity were 27.0 % and 48.9 % higher than those of PP, respectively. In short, this work combined molecular design and comprehensive screening to build the thermally conductive PP with high flame retardant efficiency, and relevant mechanisms were also investigated.

Preparation and properties of Al2O3 modified epoxy-glass fiber composites

The present study intends to use Al2O3 as thermal conductivity filler, epoxy resin as matrix, and glass fiber as reinforcement material, and prepare Al2O3 modified epoxy-glass fiber composite materials through vacuum diversion flow and hand paste molding. By changing the amount of Al2O3, performance tests and comparison are conducted. The results show that when the content of Al2O3 filler is 2 %, the comprehensive mechanical properties are the best, the thermal conductivity is increased by about 20 %, the specific heat capacity is increased by about 30 %, and the combustion time is also increased by 10 s.

Compliant composite elastomers via grafting short dangling chains for promoting thermal transport performance

AbstractThe multifunctional composite elastomers serve as thermal interface materials for heat dissipation in electronic devices when their thermal transport performance is enhanced. The common method for enhancement, continuously raising the thermal conductive filler loading only can improve thermal conductivity of composite elastomers but reduces compliance, resulting in elevated contact thermal resistance with solid surfaces, compromising thermal transport. To address this, we propose grafting short dangling chains onto the composite elastomer matrix to further promote compliance under a certain filler loading. Characterization results demonstrate that the grafted chains effectively reduce relaxation time, enabling faster deformation for the material under pressure. This approach enhances interfacial compatibility, widening the thermal transport path at contact interfaces to contact thermal resistance by 94% (from 17.8 to 1.07 mm2W/K), significantly improving overall thermal transport. Additionally, we discussed the feasibility of employing composite elastomers as thermal interface materials for efficient chip heat dissipation.Highlight The grafted dangling chains can promote the composite elastomers softness. The softness promotion can help reduce thermal contact resistance. A series of theories are employed to learn the mechanisms of the promotion. The resulting composite elastomers can be used as thermal interface materials.

Enhanced interfacial interaction of graphene nanoplatelets/cellulose nanofiber matrix driven by pyranine-based dispersant for efficient thermal managing materials

With the development of high-density electronics, polymer-based thermal conductive composites with excellent thermal and mechanical performance are receiving great attention. For the development of polymer-based thermal conductive composites with superior properties, it is essential to reduce the agglomeration of fillers and enhance the interfacial interactions between thermal conductive fillers and the polymer matrix. Among the several thermal conductive materials, graphene nanoplatelets (GNPs) and cellulose nanofiber (CNFs) are attracting attention. However, poor interfacial interaction between GNP and CNF leads to interfacial separation, which in turn, deteriorates its properties. Herein, we synthesized a pyranine-functionalized polyether dispersant (PyPE), which can significantly improve the interfacial interactions between GNPs and CNFs. The effect of PyPE on the dispersion behavior of GNPs and the thermomechanical properties of GNP-CNF composite were monitored. Furthermore, we also performed molecular dynamics (MD) simulations to investigate the impact of applying PyPE dispersant on the interfacial interactions between the GNPs and CNF matrix. The application of PyPE significantly enhanced the dispersibility of GNPs within the CNF matrix, resulting in a 15.5 % increase in-plane thermal diffusivity and a 24.5 % enhancement in tensile strength of the composite, demonstrating their potential applications in high power density electrical equipment and electronic devices.

Synergistic effect of amino and hydroxyl bifunctional modified h-BN on interfacial thermal conductivity in polydimethylsiloxane matrix: Simulations and experiments

As a widely used thermal conductive matrix material, the interface problem between polydimethylsiloxane (PDMS) and thermal conductive fillers needs to be solved urgently. The interfacial heat transfer mechanism between PDMS and hexagonal boron nitride (h-BN) modified by different groups was studied by combining density functional theory (DFT) simulation and molecular dynamics (MD) simulation. The bi-functionalization of h-BN was achieved by the environmentally friendly 6-aminocaproic acid (ACA) additive-assisted water ball milling process. The h-BN/PDMS composite thermal interface materials were prepared using a simple rolling method. The thermal conductivity of the obtained sample reached 1.256 W m−1 K−1 at a filler loading of 15 wt%. The proposed bifunctional synergistic heat transfer mechanism is expected to provide theoretical guidance for the preparation of high thermal conductivity and insulating PDMS used in electronic communications.