Test PCBs Research Articles

Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity

Ionic residues resulting from the soldering process is an important parameter in connection with humidity robustness of Printed Circuit Board Assemblies (PCBAs) due to their ability to enhance moisture absorption and surface conductivity. For reflow process, residues are trapped under the components, and the morphology of the residues can change with humidity exposure resulting in the release of ionic components. In this work, trapped residues below the components from reflow process of several commercial PCBAs were characterized before and after exposure to humidity conditions. PCBAs used for the analysis had undergone multiple reflow heating profiles by single and double reflow plus additional passes to understand heating effects. The morphology change of the trapped residues under components upon humidity exposure was observed using optical and scanning electron microscopy. The conductivity of the localized extracted solutions was measured and NaCl equivalency was determined. The solder paste materials were analysed for their water sorption property, while the effect of humidity on electrical property was assessed using electrochemical impedance spectroscopy using test PCBs. The results show that the change in morphology and level of activator release of residues were a function of the flux type, PCBA characteristics such as component standoff height and number of reflow cycles. Water layer formation upon humidity exposure and electrical properties on test PCBs are correlated with water sorption of the flux part.

Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61

This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.

A New Modular Design for Test and Application PCBs of SAW RF Filters to Ensure Precisely Predictable Filter Characteristics

This paper presents the design of an optimized test and application setup for surface acoustic wave (SAW) RF filters. These structures have been investigated, including the test devices, by simulation techniques based on full-wave methods and common SAW simulation methods. In this paper, the simulation technique will be explained in detail, focusing on the interfaces of the simulation models. Parasitic electromagnetic effects in the test and application setup will be analyzed by simulation and measurement. This paper demonstrates the possibility of accurate performance prediction of SAW RF filters using specially designed test setups in the measurement and an optimized application environment, e.g., in mobile phones. Modular parts for such test setups and the application environment are discussed.

Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs

We measured and demonstrated the great advantages of embedded film capacitors in reducing power/ground inductive impedance and the suppression of SSN at frequencies up to 3 GHz for high-performance multilayer packages and PCBs. Eight-layer test PCBs were fabricated, and their inductive power/ground network impedances were measured as a function of film thickness, via distribution, and combined use with discrete decoupling capacitors, using a two-port self-impedance measurement method. This successfully demonstrated that the power/ground inductive impedance was reduced from 270 pH to 106 pH simply by using an embedded film capacitor instead of 16 discrete decoupling capacitors.