Abstract
This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.
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