Abstract This study introduces a novel approach for investigating the fracture behavior and technical quality of adhesively bonded wood-ceramic interfaces for Mode I loading. For that, a special test arrangement originally used for quasi-brittle materials was applied. The key benefit of this innovative concept is the ability to describe postcracking behavior that is due to stable and steady recording of load-displacement diagrams. This is a big benefit over common practice techniques from both a mechanical and fracture mechanical point of view. The reason for this is that the quasi-brittle material’s nature of unstable cracking comes into place when the test setup is not stiff enough. Another reason to apply fracture mechanics over continuum mechanics is the ability to identify quantitative parameters that describe the softening process in terms of fracture energy. This is a great benefit over stress-based concepts, such as the stress intensity approach (K-concept), which is not appropriate for adhesively bonded multimaterial interfaces. To demonstrate this new approach, bonded wood-ceramic composites were investigated using four different industrial adhesives from Sika AG (Baar, Switzerland) and Murexin (Wiener Neustadt, Austria). The findings indicated interesting relationships between adhesive bonding strength and crack growth resistance when it comes to changing the material of one bonding partner from wood to ceramic. Polyurethane-based adhesives especially show the highest potential of bonding power and fracture resistance when Mode I loading is applied. Furthermore, acrylate-based adhesives are capable of high improvement gains of both mechanical and fracture mechanical parameters when adhesively bonded wood-ceramic interfaces are investigated. This is a remarkable effect and should be part of future investigations by also incorporating the economical aspects of adhesive selection in terms of benchmarking. Finally, these findings could be used for optimizing the mechanical and chemical properties of hybrid adhesives in the future.