An investigation of thermally enhanced sulfur segregation along wear tracks made on annealed oxygen-free high conductivity (OFHC) copper and on the surfaces of differently polished unannealed OFHC copper specimens was carried out. Sulfur diffusivity in the cold-worked regions of the specimens was 1–2 orders of magnitude higher than the rate of diffusion in annealed, undeformed regions. Sulfur surface segregation was rapid at low annealing temperatures because of high densities of dislocations in the plastically deformed regions. Dips in the enhanced diffusivities at several annealing temperatures were observed for almost all specimens. These dips were interpreted as being associated with various annealing stages of the cold worked samples. They were centered at approximately 330, 350 and 390 °C. The observed declines in diffusivity were attributed to the rearrangement of dislocations to lower diffusivity configurations and the reduction in dislocation density and grain boundary length as the specimens were annealed at progressively higher temperatures. Evidence of grain growth was obtained by transmission electron microscopy analysis of the polished specimens. X-ray diffraction traces indicated that annealing of samples with polished surfaces also resulted in a strong (100) preferred orientation.