Technique For Surface Profile Measurement Research Articles

Design and development of an occlusion-free surface profile measurement device

The prevalent surface profile measurement techniques in the sub-millimetre measurement scale, based on active triangulation (such as laser scanners), stereo vision and photometric stereo, may miss certain parts of the surface of the object due to occlusion. Occlusion occurs in these techniques as they rely on a top-view configuration, where the illumination rays and the surface profile lie on the same plane. In this study, a surface profile measurement device is designed and developed, which can generate occlusion-free measurements by adopting a side-view configuration. This proposed measurement technique is tested on a few surfaces, and the results are presented.

Surface profile measurement techniques for large aperture optical thin film membrane structures

Large aperture thin film optics typically have substantial shape errors which are difficult to quantify with conventional measurement methods, such as interferometry. The interferograms are normally too complex and contain too much information to discern relevant shape information pertinent to (for example) solar energy collection. This has led to the development of the laboratory-oriented, less expensive and less complex measurement procedure presented here. The method is based on well-defined geometric relationships and provides a novel approach to measuring the shape of large optics that are known to have substantial surface distortion. Once the local reflection (surface tilt) angles are determined, the overall shape can be reconstructed and further analyzed using ray tracing software to obtain aberration coefficients if desired. This technique lends itself to being easily scalable to very large membrane structures and the measurement precision is only limited by the equipment chosen.

Rapid cell-patterning and microfluidic chip fabrication by crack-free CO2 laser ablation on glass

This paper uses a widely available CO2 laser scriber (λ = 10.6 µm) to perform the direct-writing ablation of quartz, borofloat and pyrex substrates for the development of microfluidic chips and cell chips. The surface quality of the ablated microchannels and the presence of debris and distortion are examined by scanning electron microscopy, atomic force microscopy and surface profile measurement techniques. The developed laser ablation system provides a versatile and economic approach for the fabrication of glass microfluidic chips with crack-free structures. In the laser writing process, the desired microfluidic patterns are designed using commercial computer software and are then transferred to the laser scriber to ablate the trenches. This process eliminates the requirement for corrosive chemicals and photomasks, and hence the overall microchip development time is limited to less than 24 h. Additionally, since the laser writing process is not limited by the dimensions of a photomask, the microchannels can be written over a large substrate area. The machining capability and versatility of the laser writing system are demonstrated through its application to the fabrication of a borofloat microfluidic chip and the writing of a series of asymmetric trenches in a microwell array. It is shown that the minimum attainable trench width is 95 µm and that the maximum trench depth is 225 µm. The system provides an economic and powerful means of rapid glass microfluidic chip development. A rapid cell-patterning method based on this method is also demonstrated.

Microscopic phase-shifting profilometry based on digital micromirror device technology.

A microscopic three-dimensional (3-D) shape measurement system based on digital fringe projection has been developed and experimentally investigated. A Digital Micromirror Device along with its illumination optics is integrated into a stereomicroscope, which projects computer-generated fringe patterns with a sinusoidal intensity profile through the microscope objective onto the object surface being measured. The fringe patterns deformed by the object surface are recorded by a CCD camera. The microscopic 3-D shape of the object surface is measured and reconstructed by use of a phase-shifting technique. We discuss design considerations and error analysis of the system. Experimental results successfully demonstrate the capability of this technique for surface profile measurement of rough surfaces at the micrometer level.