In this paper, the conductive copper coating on the surface of silicon nitride ceramics was fabricated by high velocity arc spraying with copper wires. The results indicate that copper coating with porosity less than 2.4 % was obtained, and a metallurgical bonding between the copper coating and the ceramic substrate. The copper coating presented a high microhardness of 303HV which surpassed the copper alloy and the thin film deposited by electrodeposition. Moreover, the copper coating exhibited a superior conductivity of 27.5 MS/m. Due to the rougher surface of the copper coating compared to copper sheet, a jagged intermetallic compound (IMC) layer was promoted during soldering process. It is feasible that an excellent conductive copper coating on the surface of ceramic substrate can be fabricated by high velocity arc spraying.
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