Low-temperature glow discharges are an attractive means for engineering solid surfaces; this can occur via either chemical or physical processes. Applications are widespread and can be as diverse as the molecular rearrangement of polymers,l plasma polymerization,2 deposition of thin inorganic ~ o a t i n g , ~ and the hardening of metals by nitriding.4 A whole variety of plasma/solid interactions are believed to be present in these systems, including the interaction of radicals, atoms, and electronically excited molecules with the surface, neutralization, secondary electron emission, sputtering, ion-induced chemistry, electron-induced chemical reactions, and phot~chemistry.~ The major attribute of nonisothermal plasmas is that they are capable of generating a very reactive medium at room temperature, whereas high temperatures (typically 10 OOO's K) are necessary to achieve the same types of species via thermal ionization. Investigations related to the glow discharge treatment of metals are widespread in the l i terat~re.~?' However, there have been very few studies dedicated to nonisothermal plasma modification of binary alloy surfaces, in fact the first ever report concerning the plasma oxidation of a binary metal alloy system (Cu-A1) has only recently been published.8 In this article, a detailed account of the influence of various glow discharges (02, H2, and N2) on Cu-Ag eutectic alloy substrates is presented. Cu-Ag alloys are potential candidates for electrical switching applications, and therefore it is desirable to devise protective finis he^.^ The microstructure and chemical nature of the resulting surfaces have been evaluated by scanning electron microscopy, X-ray photoelectron spectroscopy, Ar+ ion depth profiling, and plasma emission spectroscopy.
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