Surface Mount Device Components Research Articles

Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder

Digitally printed conductive structures often need to be electrically connected to batteries, microcontrollers, or other devices. A consensus of industry and research is that such hybrid printed electronics will play a major part in the future of printed electronics. To promote the technology of hybrid printed electronics, surface mount technologies for electronic components using isotropic conductive adhesives (ICAs) and low melting tin bismuth solders on inkjet-printed silver structures on injection molded liquid crystal polymer (LCP) substrates were investigated in this publication. The special needs for inkjet-printed electronics were considered as well as the reliability of assembled surface mounted devices (SMDs) and their failure mechanisms. Connected 0603 and 1206 SMD components achieved a characteristic fatigue life of more than 3500 cycles during thermal cycling at +125 °C/−40 °C and withstood over 1000 h under a damp-heat atmosphere of +85 °C/85% RH. The coefficient of thermal expansion (CTE) of the substrate and the selection of solder have major impacts on the reliability of the assemblies.

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 Ω even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70°C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 mΩ, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150°C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

Functionalized Three-Dimensional Multilayer Ceramic Modules

Three-dimensional interconnect devices are still strongly related to plastic materials. Since the use of these materials is limited in harsh environments, there is an application gap, which could be filled by ceramic circuit carriers. Low-temperature cofired ceramics (LTCC) offer promising solutions to fill this gap. This work provides a feasibility study, including the whole technological chain of ceramic multilayer processing. Targeting a curved multilayer substrate, fully equipped with SMD (Surface-mounted device) components, the particularities of single process steps are investigated. Two shaping methods based on quartz glass molds are compared with regard to shape fidelity and technological effort. The investigation of internal conductor lines and via connections reveals that the metallization should have a minimum width of 200 µm and the via diameter is limited to 150 µm. Further considerations focus on the possible footprint of components and use of cavities to increase the footprint of components. The limits of wire bonding on curved surfaces were inspected. Finally, the work presents a demonstrator of a fully equipped four-layer ceramic circuit, including internal wiring. Hence, the transfer of the 2.5-dimensional multilayer ceramic technology into the third dimension is proven.

Enabling paper-based flexible circuits with aluminium and copper conductors

Implementing electronics systems on paper is an important area of flexible circuit technologies. One of the approaches is to print conductive inks onto paper substrates, on which silicon-based surface mount device components are mounted. However, one of the problems is that the printed conductors have unneglectable resistivity. In this paper, we present paper-based flexible circuits, using copper and aluminium conductors that are laminated onto paper substrates using a high-speed roll-to-roll method. Edge roughness inspections and repeated two-point bending tests are carried out to evaluate the manufactured flexible circuits. Three surface mount techniques are used to assemble standard surface mount device components onto the flexible circuits, including an isotropic conductive adhesive, an anisotropic conductive adhesive, and a low-temperature solder paste. Several characterizations are performed to the surface mount techniques, including contact resistance measurements, component bonding strength tests, assembled circuit bending tests, and scanning electron microscopy. The results of the characterizations suggest that flexible circuits made from Cu with paper substrate achieve satisfactory results for mechanical reliability, all surface mount techniques, and have the potential to be used on automatic component assembly lines. In order to test whether such flexible circuits and surface mount techniques can be used in implementing electronics systems, passive NFC tags with relative humidity sensing functionality are made, which are interrogated by an NFC equipped mobile phone.

DBC-Packaged Inverter Power Module for Integrated Motor-Inverter Design Used in 48 V Mild Hybrid Starter-Generator (MHSG) System

This paper presents an improved package design of an inverter power module specialized for the 48 V starter- generator used in 48 V mild hybrid vehicles. The inverter module, called the mild hybrid starter and generator (MHSG), is integrated with its motor for size/volume reduction. However, the integrated motor-inverter presents supplementary challenges, such as limited cooling capabilities, in addition to the challenges resulting from the elevated voltage of 48 V of the mild hybrid systems. The proposed MHSG power module addresses these challenges. Parallel-connected metal-oxide-semiconductor field-effect transistor (MOSFET) dies were solder-bonded onto a direct bonded copper (DBC) substrate, and three DBC substrates (providing six legs) were assembled in a custom housing mounted on a forced air cooler. Shunt resistors and surface-mount device components were also soldered onto the DBC substrates. For improved stability and balance, ribbon bonding was used instead of wire bonding, the module components were repositioned, and DBC patterns were adjusted. The aforementioned approaches minimized the parasitic inductance, unbalanced/concentrated current density, and maximum temperature of the 48 V MHSG inverter module. The proposed module was validated through multiphysics finite-element method (FEM) simulations, manufactured prototypes, and experiments, all of which confirmed that the proposed module exhibits the electrical/thermal characteristics required for 48 V integrated MHSG systems.

Effects of high current density on lead-free solder joints of chip-size passive SMD components

Purpose The purpose of this paper is to present a novel approach on investigating critical current densities in the solder joints of chip-size surface mounted device (SMD) components. The investigation involves a numerical approach and a physical validation with selected track-to-pad connections and high current loads (CXs). Design/methodology/approach During the investigations, shape of solder fillets was calculated in Surface Evolver, and then the current densities were calculated accordingly in the given geometry. For the verification, CX tests were performed on joints at elevated temperatures. The joints were qualified with X-ray microscopy, cross-section analysis and shear tests. Findings This study ascertained that the inhomogeneity in current density depends on the track-to-pad structure of the joint. Also this study found that the heavy CX decreases the mechanical strength, but the degradation does not reach the level of electromigration (EM)-induced voiding. Practical implications The heavy CX significantly affects joint reliability and the results point out to EM-induced failure-limitations on printed circuit board (PCB)-based assemblies due to the thermomechanical weakness of the FR4 material. Originality/value The experiments investigate current density from a novel aspect on more frequently used small-scale components with different track-to-pad configurations – pointing out possible failure sources.

LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

We present a very compact hybrid detection module based on an advanced liquid-cooled low temperature cofired ceramic (LTCC) substrate. The double sided hybrid combines 144 photo detectors and four specialized flip chip readout ASICs (Application specific Integrated Circuits) used for the readout of scintillation crystals with application in time-of-flight positron emission tomography (PET) combined with magnetic resonance imaging (MRI). If MRI images and PET images are combined, completely new medical diagnostic and treatment prospects are feasible because the two techniques are complementary and they will offer both anatomical and functional information. One of the biggest challenges is the development of miniaturized detector modules that are highly functional and MRI compatible. Our SiPM (Silicon Photomultiplier) module has an area of 32.8 by 32.0 mm2 and contains 12 × 12 SiPMs in a pitch of 2.5 mm2. The SiPM readout of the 144 channels is performed by four PETA6 ASICs. The LTCC substrate with a 2.1 mm thickness has been manufactured using the most advanced technologies developed at Micro Systems Engineering GmbH To guarantee the manufacturability in serial or mass production, DP951 P2 green tape has been used. For the cooling channels, special technology has been developed by MSE. The liquid cooling channels inside the LTCC substrate provide excellent cooling for the ASICs, the SiPMs, and thermal insulation between ASICs and SiPMs and allow a very compact design of the detector modules, reducing their height by 50% compared with other technical solutions. We can insert a ring of our modules in an existing MR (Magnetic Resonance) scanner. Operating the SiPMs at low temperature improves their performance, reducing the effects of dark count rate and improving image quality. There is no heatsink, heat pipe, or other cooling element attached to the back side of the ASICs. To avoid interference between the PET and MRI system, short signal length is required for minimizing pickup loops and eddy currents. The 12 SiPM arrays with 2 × 6 geometry are wire bonded only at the edges of the SiPMs to the LTCC, enabling the use of nearly the whole detector area for photon detection, which is of paramount importance for excellent image quality. At the opposite side of the substrate, four ASICs with 272 μm bump pitch are flip chip solder assembled to the LTCC substrate including underfilling, and a few SMD (Surface Mount Device) components are mounted. A scintillator crystal array on top of the SiPMs converts gamma rays (511 keV photons produced from positron-electron annihilation) into light. We assume that the LTCC substrates and all components are fully MRI compatible, which is important for the integration of PET with MRI without mutual interference. The paper elucidates the impact of the used technology on the performance of advanced PET/MRI detector modules.

Soldering surface mount components on screen-printed Ag patterns on paper and polyimide substrates for hybrid printed electronics

The development of printed electronics on flexible substrates is increasing rapidly, where the main benefits are the large area and low cost. However, the functionality and performance of printed circuits cannot compete with standard silicon based microprocessors or integrated circuits, though the functionality and performance of printed circuits are increasing. Therefore, in this work we investigate the possibilities of using Sn42/Bi57.6/Ag0.4 low-temperature solder paste together with a reflow solder oven and hot air solder iron to mount regular surface mount device (SMD) components on screen-printed silver tracks. It was found that it is possible to solder standard Si SMD packages onto screen-printed Ag ink tracks on paper substrate; however, the component bonding strength to polyimide was not satisfactory. The resistance of the solder joints was found to be no more than 240 mΩ. The bond strength was found to be higher using the manual hot air solder iron than the reflow solder oven. Bending tests show that the bonding strength is higher for the hot air soldered components. Reference samples on FR-4 based copper printed circuit board show a bond strength ∼10 times higher but we conclude that it is possible to solder regular Si SMD components onto Ag-printed conductors on paper substrate with good results. The process could be used to fabricate hybrid printed electronics in a standard solder process line.

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.

Prototype Deep Brain Stimulation System with Closed-Loop Control Feedback for Modulating Bladder Functions in Traumatic Brain Injured Animals

Traumatic brain injury (TBI) typically causes permanent brain tissue damage, which leads to permanent severe voiding dysfunction. Urinary retention is often refractory to standard therapies, and most patients require self-catheterization, which results in frequent urinary tract infections and reduces quality of life. Deep brain stimulation (DBS) might be a feasible alternative approach for treating bladder disorders in patients with TBI. In this study, we developed a DBS system with a closed-loop control strategy and determined the feasibility of this DBS system for improving bladder voiding function in a TBI animal model. A prototype of the DBS system was designed, fabricated and integrated with a closed-loop control algorithm based on the real-time external urethral sphincter-electromyogram feedback. A series of animal experiments was conducted to determine whether the feedback algorithm accurately detects the bladder status during cystometric measurements. Subsequent animal experiments were conducted to implement this DBS system and determine the performance of the closed-loop strategy for improving bladder functions in the TBI animal model. We successfully implemented a closed-loop algorithm for DBS control, and the accuracy of the bladder voiding phase detection was > 90%. Our system significantly improved the voiding efficiency in TBI rats from 22 to 74%. Although the prototype of the DBS feedback system was fabricated with surface-mounted device components and mounted on a 3D printed circuit board, the design principles and animal experience gathered from this research can serve as a basis for developing a new implantable bladder controller in the future.

Package-Level Reconfiguration of RF Matching Networks Using SMD Components

Digital power amplifiers provide an unprecedented level of flexibility in their ability to operate on different signals using simple reprogramming of the digital signal processing, but their output matching networks must be redesigned for different frequency bands. This involves a redesign of part of the back-end-of-line mask set at a great cost. We present a package-level reconfiguration technique that allows a single transmitter to be reconfigured for multiple frequency bands, or different output power levels by soldering different surface mount device (SMD) components directly to the surface of the die, saving design and fabrication cost while delivering similar performance. We demonstrate the technique on a multiphase transmitter IC, showing optimized operation at three different frequencies using soldered SMD components to reconfigure the matching network of the IC at the package level. The transmitter’s linearity and performance are validated using a 5-MHz, 64-QAM LTE signal.

3D Metamorphic Stretchable Microphone Arrays

AbstractThis article describes the realization of a metamorphic microphone array. The array morphs from a concave to a planar and then to a convex shape. The morphing array enables a better (12×) sound source localization when compared to existing static and planar arrangements. To enable the realization, a novel stretchable (elongated up to 320% of the original length) printed circuit board fabrication process is reported. The fabrication process enables high‐temperature processing, alignment, and registration. Moreover, conventional and otherwise rigid surface mount devices (SMDs) can be used. The process allows the researcher to increase the number of devices (30 SMDs) and interconnects (60 in total) to the required level. As electrical connections, a polyimide‐cladded metal track design is reported; the design sustained 11 050 stretch and release cycles. Moreover, 3D reinforcement frames are reported as an effective measure to shield the SMD components from high levels of stress. The resulting products are millimeter‐thin stretchable rubber‐embedded and electrically interconnected electronic structures with mechanical rubber‐membrane‐like properties. Morphology changes involve deflation and inflation of the membrane to bulge inward or outward. Finally, the use of 3D‐shaped chaperon is discussed to provide additional shape control.

AC–DC Disk Resistors Made of Surface Mount Components

Disk resistors are widely used in micropotentiometers up to frequencies in the radio frequency range. They offer very small AC–DC differences but the permissible power dissipation is quite small. Also, the resistance value is poorly defined due to the lack of four-terminal connections. This can be overcome by newly designed disk resistors made of surface mount device components [1]. They are also well suited as AC–DC current shunts for currents up to several amperes.

A Wide-Band Test Fixture for Analyzing Parasitic Effects of RF Passive SMD Components

A wide-band test fixture is designed for the measurement of parasitic effects of RF passive SMD (surface mounted devices) components. Two calibration methods, TRM (Thru-Reflect-Match) from 45 MHz to 2 GHz and TRL (Thru-Reflect-Line) from 2 GHz to 12 GHz, are used for error correction. The measurement standards and fixture are designed based on these two calibration methods. For experimental verification, the multilayered ceramic SMD capacitors of Johanson Technology are measured. The parasitic effects of the SMD capacitors are analyzed. The designed fixture is feasible and applicable for quick and accurate measurement of RF passive SMD components.

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Through the use of design of experiments (DOE), lead-free solder defect causes can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components. The systematic investigation will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.

Mechanical properties of SMD interconnections on flexible and rigid substrates

Purpose – The paper aims to investigate on the mechanical properties of surface-mount device (SMD) interconnections made on flexible and rigid substrates. Design/methodology/approach – The durability of joints to shear strength was measured with tensile machine. Investigations were carried out for 0402- and 0603-sized ceramic passives and integrated circuits in SOIC-8, TSSOP-8, XSON3 and XSON6 packages. Three types of flexible substrates (Kapton, Mylar and Pyralux) and two types of rigid substrates (LTCC and alumina) were used. SMD components were mounted with SAC solder or electrically conductive adhesive. Contact pads were made of Ag-based polymer paste on flexible substrates and PdAg-based cermet paste on ceramics. The shear strength was measured for as-made and long-term thermally aged test structures. The average durability and standard deviation were compared for different combination of materials. Moreover, mechanical properties of interconnections made of polymer thick-film pastes or electrically/thermally conductive adhesives between ceramic chips and flexible/ceramic substrates were investigated. Findings – The mechanical properties of joints strongly depend on configuration of applied materials. Some of them exhibit high durability to shear strength, while other should not be recommended due to very weak connections. Additionally, long-term thermal ageing showed that exploitation of such connections at elevated temperature in some cases might increase their strength. However, for some materials, it leads to accelerated degradation of joints. Originality/value – This paper provides practical information about SMD interconnections made with standard materials (lead-free solder, electrically/thermally conductive adhesives) and proposed non-standard procedures, e.g. assembling of ceramic chips with low temperature cermet or polymer thick-film conductive pastes.

Soldering Surface Mount Components Onto Inkjet Printed Conductors on Paper Substrate Using Industrial Processes

This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a substrate for printed flexible electronics is becoming more and more widespread as an alternative to the more commonly used plastic substrates, such as polyethylene and polyimide. Paper has the benefits of being environmentally friendly, recyclable, and renewable, as well as inexpensive. It is shown that it is possible to mount standard surface mount device components on paper substrates using low-temperature solder in an industrial soldering process. The contact resistances obtained are mostly low, although the yield of functioning contacts is low. The reason is cracking of the substrate coating layer that goes through the printed silver tracks. It was observed that the cracks appear mostly close to the contact pads, the most likely cause is thermal mismatch between the coating layer and solder and also thermal expansion of the photo paper resin coating. The smallest component package size, 0201, resulted in the highest yield of >80% with decreasing yield for larger package sizes.

Development of intelligent instruments with embedded HTTP servers for control and data acquisition in a cryogenic setup--The hardware, firmware, and software implementation.

The power of Ethernet for control and automation technology is being largely understood by the automation industry in recent times. Ethernet with HTTP (Hypertext Transfer Protocol) is one of the most widely accepted communication standards today. Ethernet is best known for being able to control through internet from anywhere in the globe. The Ethernet interface with built-in on-chip embedded servers ensures global connections for crate-less model of control and data acquisition systems which have several advantages over traditional crate-based control architectures for slow applications. This architecture will completely eliminate the use of any extra PLC (Programmable Logic Controller) or similar control hardware in any automation network as the control functions are firmware coded inside intelligent meters itself. Here, we describe the indigenously built project of a cryogenic control system built for linear accelerator at Inter University Accelerator Centre, known as "CADS," which stands for "Complete Automation of Distribution System." CADS deals with complete hardware, firmware, and software implementation of the automated linac cryogenic distribution system using many Ethernet based embedded cryogenic instruments developed in-house. Each instrument works as an intelligent meter called device-server which has the control functions and control loops built inside the firmware itself. Dedicated meters with built-in servers were designed out of ARM (Acorn RISC (Reduced Instruction Set Computer) Machine) and ATMEL processors and COTS (Commercially Off-the-Shelf) SMD (Surface Mount Devices) components, with analog sensor front-end and a digital back-end web server implementing remote procedure call over HTTP for digital control and readout functions. At present, 24 instruments which run 58 embedded servers inside, each specific to a particular type of sensor-actuator combination for closed loop operations, are now deployed and distributed across control LAN (Local Area Network). A group of six categories of such instruments have been identified for all cryogenic applications required for linac operation which were designed to build this medium-scale cryogenic automation setup. These devices have special features like remote rebooters, daughter boards for PIDs (Proportional Integral Derivative), etc., to operate them remotely in radiation areas and also have emergency switches by which each device can be taken to emergency mode temporarily. Finally, all the data are monitored, logged, controlled, and analyzed online at a central control room which has a user-friendly control interface developed using LabVIEW(®). This paper discusses the overall hardware, firmware, software design, and implementation for the cryogenics setup.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Photonic Flash Soldering of Thin Chips and SMD Components on Foils for Flexible Electronics

Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using a lead-free solder paste. Results are compared with oven-reflowed solder joints on PI substrates. The delicate PET foil substrates were not damaged owing to the selectivity of light absorption, leading to a limited temperature increase in the PET foil while the chip and copper tracks were heated to a temperature high enough to initiate soldering. The microstructure of the soldered joints was investigated and found to be dependent on the photonic flash intensity. Reliability of the photonically soldered joints during damp heat testing and dynamic flexing testing was comparable with the reflowed benchmark and showed increased reliability compared with anisotropic conductive adhesives bonded on PET foils.