Surface Mount Technology Components Research Articles

Weighted Smallest Deformation Similarity for NN-Based Template Matching

This article deals with the template matching problem, and a weighted smallest deformation similarity measure, which is robust to occlusions, background outliers, and complex deformations. The appearance-based nearest neighbor (NN) matching of points is constructed and the smallest location distance between each point in the template and its matching points is employed to penalize the deformation explicitly. Then, the weights are added to points in the template relied on their likelihood of belonging to the background through NN matching with the points around the target window. Experiments show that the proposed method improves the state-of-the-art performance on real-world scenario benchmarks and can be applied in rough positioning of surface mount technology components.

Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach

The article proposes a generalized high cycle fatigue evaluation methodology for solder joints based on a local stress finite element method (FEM) and compares with experimental results. A method to predict the damage initiation of surface mount technology (SMT) solder joints is accomplished in this article by making use of generic coupon level SAC387 solder specimens. High cycle fatigue (HCF) experiments conducted on generic solder specimens are followed by means of FKM guidelines, which are translated to microelectronic elements for the first time. The FEM predicted lifetime values of solder joints agree with the experimental results performed on SMT components. In addition, the overall results show that the predicted values act as a threshold damage line from which the solder joint failure regimes can be differentiated. The results also show the differences in the predicted damage line and failure line for SMT solder joints.

Low-cost, in-liquid measuring system using a novel compact oscillation circuit and quartz-crystal microbalances (QCMs) as a versatile biosensor platform

Abstract. Quartz-crystal microbalances (QCMs) are commercially available mass sensors which mainly consist of a quartz resonator that oscillates at a characteristic frequency, which shifts when mass changes due to surface binding of molecules. In addition to mass changes, the viscosity of gases or liquids in contact with the sensor also shifts the resonance but also influences the quality factor (Q-factor). Typical biosensor applications demand operation in liquid environments leading to viscous damping strongly lowering Q-factors. For obtaining reliable measurements in liquid environments, excellent resonator control and signal processing are essential but standard resonator circuits like the Pierce and Colpitts oscillator fail to establish stable resonances. Here we present a low-cost, compact and robust oscillator circuit comprising of state-of-the-art commercially available surface-mount technology components which stimulates the QCMs oscillation, while it also establishes a control loop regulating the applied voltage. Thereby an increased energy dissipation by strong viscous damping in liquid solutions can be compensated and oscillations are stabilized. The presented circuit is suitable to be used in compact biosensor systems using custom-made miniaturized QCMs in microfluidic environments. As a proof of concept we used this circuit in combination with a customized microfabricated QCM in a microfluidic environment to measure the concentration of C-reactive protein (CRP) in buffer (PBS) down to concentrations as low as 5 µg mL−1.

Nonrigid Point Set Registration by Preserving Local Connectivity.

This paper is concerned with the nonrigid point set registration problem and a probability-based registration algorithm with local connectivity preservation is proposed. A unified formulation for point set registration problem is introduced and the derived energy function is composed of three parts, distance measurement item, transformation constraint item, and correspondence constraint item. In order to preserve the local structure of point set, the definitions of -connected neighbors and connectivity matrix are given and the local connectivity constraint is constructed as a weighted least square error item. The point set registration problem is formulated in the expectation-maximization algorithm scheme and the optimal spatial transformation and correspondence matrix are estimated simultaneously. The effectiveness of the proposed method is verified by applying the method to synthetic point sets and real scenarios of hand shapes and surface-mount technology components.

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of ever-increasing demand for functionality and miniaturization. As a result, during accidental drop and impact events, there is an increased probability of internal secondary impact between a PWA and adjacent internal structures. In particular, compared to the initial impact, acceleration pulses caused by contact during secondary impacts are typically characterized by significant increase of amplitudes and frequency bandwidth. The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure, if any of them have resonant frequencies within the transmitted frequency bandwidth. This study is the first part of a two-part series, presenting qualitative parametric insights into the effect of secondary impacts in a PWA. This first part focuses on analyzing the frequency spectrum of: (i) the impulse caused by secondary impact, (ii) the energy transmitted by the dynamic “breathing” response of multilayer PWBs, and (iii) the consequential dynamic response of typical structures with high resonant frequencies that are mounted on the PWB. Examples include internal deformable structures in typical surface mount technology (SMT) components and in MEMS components. The second part of this series will further explore the effects of the breathing mode of vibration on failures of various SMT components of different frequencies.

Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework

This paper describes the results of an intensive microstructural and reliability study of pin-through-hole (PTH) and surface mount technology (SMT) components which were wave solder assembled using three groups of alloys: (1) near-eutectic Sn-Ag-Cu alloys such as SAC405 and SAC305, (2) low-Ag off-eutectic Pb-free alloys with an Ag content of about 1% and lower, and (3) eutectic Sn-Cu alloys with Ni and other additives. Both primary attach and reworked solder connections using solder fountain and hand rework were studied. The PTH connector types and SMT components were wave solder assembled on a test vehicle. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C for 6000 cycles. The difference in microstructures, intermetallic formation, Cu dissolution, grain coarsening, and crack formation is shown. The influence of the microstructure after assembly and rework on Weibull plot parameters and failure modes is described for 2512 resistors. Interconnect defects such as nonuniform phase distribution and void formation are discussed. The Sn-Cu-Ni- and Sn-Cu-Ag-Bi-based alloys tested in this study are recommended as potential suitable replacements for SAC305/405 in the wave solder process; no failure was detected up to 6000 cycles at 0°C to 100°C. Although SAC405 demonstrated better barrel fill and lower rate of crack propagation during ATC, after PTH rework, both of the alternative Pb-free alloys have a much lower Cu dissolution rate and definitely outperform SAC405 in ATC. SAC405 glue and wave resistors after primary attachment and rework demonstrate higher reliability than alternative alloys. Early failures relate to alternative alloy characteristics and should be considered for some applications.

Measurements and simulation of SMT components

Integrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal expansions lead to strains in the interconnection structures of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of SMT components is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Then, thermomechanical deformations of the package are measured quantitatively using state‐of‐the‐art laser‐based optoelectronic holography (OEH) methodology.

DC power-bus design using FDTD modeling with dispersive media and surface mount technology components

DC power-bus modeling in high-speed digital design using the finite-difference time-domain (FDTD) method is demonstrated herein. The dispersive character of the dielectric layers used in printed circuit board substrates is taken into account in this study. In particular, FR-4 is considered. The complex permittivity of the dielectric is approximated by a Debye model. A wide-band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Good agreement is achieved between the modeled and measured results for a typical dc power-bus structure with multiple surface mount technology (SMT) decoupling capacitors placed on the printed circuit board (PCB). The FDTD method is then applied to investigate some general approaches of power-bus noise decoupling.

Reliability evaluation of adhesive bonded SMT components in industrial applications

This paper compares the efficiency of two thermosetting and one thermoplastic conductive adhesives for surface mount technology (SMT) assemblies. Their reliability is evaluated during accelerated life tests through electrical and mechanical measurements. Contact metallizations are taken into account. Finite element simulations confirm the experimental results, and a parametric study permits us to define some choice criteria for the physical properties of adhesives.

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity.