Abstract
Integrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal expansions lead to strains in the interconnection structures of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of SMT components is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Then, thermomechanical deformations of the package are measured quantitatively using state‐of‐the‐art laser‐based optoelectronic holography (OEH) methodology.
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