A sub-surface deformation phenomenon was identified as a wear mechanism in the plated metallurgies of electrical contact tabs on printed circuit cards. Under vibratory sliding conditions, the plastic flow of the copper substrate produces a bending and thinning of the intermediate layer of nickel and causes an upsurgence or upward motion of the copper, nickel and noble metal surface layers. This results in a high spot on the surface which now experiences increased local wear. Ultimately, there is local exposure within the wear region of the nickel and copper to the ambient environment, providing a potential for corrosion. The resultant appearance of the surface and cross-sections through the wear scar indicate that the sub-surface layers are locally being driven through the surface layer. An additional related phenomenon was observed in the analysis of card tabs that were tested at an elevated temperature. The copper substrate, directly under the wear track, experienced recrystallization and grain growth; the normally mottled grain structure was replaced with large, well defined grains. The physical evidence for these mechanisms, along with quantitative results showing differences in wear rates when these phenomena occur and when they do not, are presented. In addition, associated friction behavior is presented.