Starting from large-grained, narrow AlSi-lines which were characterized by homogeneous bulk mass flow unde rstress conditions, electromigration tests were performed with 8 × 10 5 A/cm 2 at 200°C, using an additional SiO 2 passivation layer. The covering film drastically degraded electromigration behaviour. Premature failures were produced by contact openings, increased contact resistances and stripe interruptions. On the one hand, the covering films increased the Al drift velocity substantially. On the other hand, AlSi-compounds or Si-nodules were formed, which favoured void growth and stripe interruptions. Those interruptions even occurred if the net Al mass flow seemed to be negligible. When Si was omitted, failure times increased considerably.