Stress Of Cu Research Articles

Stress–strain behavior of Cu on the AMB‐Si3N4 substrate undergoing thermal cycles via in situ strain measurement

AbstractThe active metal brazing of a Si3N4 substrate with Cu has been evaluated for excellent reliability, demonstrating durability up to 1000 cycles in a cycling test ranging from −40°C to 250°C. While the finite element method (FEM) is commonly used for predicting thermal stress–strain in cyclic tests, experimental data on the measurement of thermal stress–strain on metallized substrates have remained limited. In this study, a digital image correlation (DIC) method was employed for the in situ measurement of thermal strain on a fully Cu‐coated Si3N4 substrate (AMB‐SN substrate) in various consecutive thermal cycles, ranging from 1–2 to 199–200. The thermal strains exhibited hysteresis curves that expanded slightly with cycles. By incorporating the coefficients of thermal expansion (CTE) of plain Cu and Si3N4, both the thermal stress and strain of Si3N4 and Cu on the AMB‐SN substrate were computed. The stress–strain curves of Cu revealed that the yield stress of Cu increased with the number of cycles, attributed to the cyclic hardening of the Cu layer. The Cu stress–strain curve calculated in this work showed a good agreement with the previous results obtained from compression/tension test of Cu at room temperature, which indicates the stress–strain curve of Cu on the composite was not sensitive to the temperature during the thermal cycle.

Hot deformation behaviour and optimization of process parameters for an as-cast Cu–20Ni–20Mn alloy

The hot deformation behaviour of an as-cast Cu–20Ni–20Mn alloy was investigated by isothermal compression tests in a TA-DIL 805 phase change thermal expansion instrument with a temperature ranging from 800 to 950 °C and a strain-rate ranging from 0.001 s−1 to 1 s−1. The results showed that Cu–20Ni–20Mn presented a stress drop at the beginning of the strain, and the flow stress decreased with increasing temperature and decreasing of strain rate. In particular, the hot deformation activation energy was determined to be 277.958 kJ/mol. The hot compression constitutive equation was established, and the processing maps of the alloy were constructed. The stress-strain values predicted by the proposed model were coincident with the experimental results, which confirmed that the deformation principal equation gives an accurate and precise estimate of the flow stress in Cu–20Ni–20Mn. The established processing maps and microstructure analysis determined the rolling process parameters in which the optimum range of temperature for the hot-working deformation of the as-cast Cu–20Ni–20Mn alloy is 810–900 °C with a strain rate of 0.001–0.002 s−1.

Copper bonding silicon nitride substrate using atmosphere plasma spray

Silicon nitride (Si3N4) is an excellent engineering ceramic with high strength, fracture toughness, wear resistance, and good chemical and thermal stability. Recently, the enhanced thermal conductivity enables Si3N4 to have potential application prospects in the electronic and orthopedic fields. Metal bonding with Si3N4 is often the key to these applications. Here we report a facile approach for the titanium-activated Cu bonding on Si3N4 substrates using an atmosphere plasma spray (APS) process. With X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM) observation, it was shown that the interaction between the pre-bonded Ti (by APS) on Si3N4 promoted the adhesion and high bonding strength of APS Cu on Si3N4. The interfacial structure and phases were characterized, and tensile strength, electrical resistivity, thermal conductivity, and residual stress of Cu bonded Si3N4 were measured accordingly. The APS deposited Cu layer is dense, has a high purity, and is joined firmly with Ti pre-bonded Si3N4 substrate. The maximum tensile strength between Cu and Si3N4 is as high as 89.4 MPa. The Si3N4 substrate bonded with highly dense Cu demonstrates a low surface resistivity of 8.72 × 10−4 Ω∙mm, and high thermal conductivity of 98.12 W/m·K, which shows potential applications in electronic devices.

The role of incoherent twin boundaries on the plasticity of Cu micropillars

The role of a ∑3{112} incoherent twin boundary (ITB) on the shear stress of Cu at the micron scale has been investigated through microcompression of bi-crystalline pillars containing ITB, as well as single-crystalline pillars, in two different compression directions. The Cu sample containing ITBs was synthesized using magnetron sputtering on a sapphire substrate. Firstly, pillars along [111] compression direction were milled on the film surface. As multiple slip systems were activated upon loading, the dislocation-ITB interaction in this direction was dominated by the dislocation–dislocation interactions. Another set of pillars was milled from the side of the film (in the thickness of the film) in a nominally [134¯] compression direction. Compression in this direction activated a single slip in each grain, which facilitated the investigation of the interaction between dislocations and ITBs. Post-mortem images showed that slip traces were not distinctly connected at the boundary unlike ideal slip transmission in pillars containing a coherent twin boundary. Moreover, bi-crystalline pillars in the single slip direction are stronger than single-crystalline pillars. The observations indicate that ITBs are not impenetrable for dislocations, but the boundary demonstrates some resistance to transmission.

Diffusion behavior determined by the new n-body potential in highly immiscible W/Cu system through molecular dynamics simulations

The excellent properties exhibited by W/Cu composites have stimulated the interest of many researchers. Molecular dynamics (MD) plays an important role in regulating the alloy ratio and exploring the microscopic mechanism. The accuracy of MD simulation depends on the reliability of the potential function. Here, we report a new W/Cu n-body potential. Compared with several existing potentials, the present potential can describe more precisely the lattice constant, cohesive energy and elastic constants (C11, C12 and C44) of W3Cu. On the basis of the new developed n-body potential, we have explored the diffusion behavior and the structure of the diffusion interface during the direct alloying occurring in the highly immiscible W/Cu system with MD simulation. The results of MD simulations show that the critical temperature of the diffusion and direct alloying between W and Cu is about 1000K. As the temperature increases, the diffusion flux of W/Cu diffusion increases while the interface structure becomes more disordered. The diffusion flux for W/Cu is greatest at the pressure of 150 MPa at pressures between 0 MPa and 300 MPa. The grain boundaries also have a great influence on the diffusion of W–Cu, with faster diffusion at the grain boundaries, and the Cu undergoes a phase change (ordered structure becomes disordered) when the interfacial stress of Cu reaches 1.7 GPa at a temperature of 662 K. In addition, the MD simulation results also show that the crystal plane orientations affect both the diffusion and heat conduction of W/Cu. The diffusion flux of W/Cu alloying is maximum when the crystal plane is W(111). The lattice thermal conductivity of the W/Cu interface is highest when the crystal plane orientation is W(100)/Cu(110).

Strategies for minimizing induced thermomechanical stress in glass–glass PV modules with half cells identified using finite element modelling

The thermomechanical stress developed through interconnection, lamination and initial thermal cycling of multi-busbar (MBB) interconnected glass-glass solar modules was investigated using finite element modelling. The simulated results showed that highly localized stress was induced in the silicon (Si) cells after interconnection. Due to the compressive effect from the glass, maximum tensile stress in Si decreased after lamination, whilst maximum von Mises stress in Cu ribbons increased. Both stresses in Si and Cu further increased during thermal cycling. Copper ribbons with a lower aspect ratio and smaller cross-sectional area induced lower stress in Si. While higher stress was developed in thinner Si cells, increases in cell length resulted in a higher stress in the Cu ribbons. By aligning the front and rear contact pads on the cells, the Si tensile stress can be effectively reduced throughout the thermal processes.

Improvement of Tomato Fruit Quality and Soil Nutrients through Foliar Spraying Fulvic Acid under Stress of Copper and Cadmium

Fulvic acid (FA), the essence and most active component in humus, is widely used as a fertilizer synergistic agent and for soil improvement. As a synergist, FA can not only highly chelate microelements, but also play a key role as a growth promoter. Due to the small molecular weight and high solubility, FA is usually used by foliar spraying in vegetable production, yet the effect on fruit quality and nutrient absorption is still unclear. Here, ‘Jinpengdashuai’ tomatoes were used to investigate the effects of spraying FA on tomato fruit quality and soil Cu and Cd availability under stress of Cu and Cd by pot experiments. The results showed that the 1000 mg·L−1 FA could significantly improve the biomass of tomato plants to some extents under different stresses of Cu and Cd. After spraying FA, the Cu and Cd content in different organs and the whole accumulation decreased; meanwhile, the transport efficiency of Cu and Cd was also reduced to some degree. The drops of FA significantly changed the chemical form of Cu and Cd in 0~10 cm soil, from the easily absorbed water soluble (or ion) form into the insoluble form, hard to absorb. The Cu content in the residual state increased by 93.8% and 172.5%, respectively, under single and compound stress, and the Cd content in the residual state increased by 16.7% and 58.6%. Foliar spraying FA could promote the absorption and transport of essential nutrients such as nitrogen, phosphorus, potassium, calcium, magnesium and zinc, and maintain the nutrient balance, which alleviates the inhibition of normal metabolism by Cu and Cd stress, to a certain extent. More distinctly, Vc, total sugar and lycopene increased by 11.4~45.9%, 19.2~48.5% and 30.9~84.5%, respectively, indicating that foliar spraying FA could improve the appearance and flavor quality of tomato fruits under stress of Cu and Cd.

Combined effects of residual stress and microstructure on degradation of Cu thin films on Si

In this paper, combined effects of residual stress and microstructure on degradation of Cu thin films on Si have been investigated. Magnetron sputtering with different processing parameters produced cracked and non-cracked Cu films with various grain sizes and residual stresses. Phase transformation and the change in electrical resistance of the Cu thin films have been analyzed for different annealing conditions. It has been revealed that non-cracked and large-grained (25.2±8.9nm) Cu films with high tensile residual stress (186 MPa) result in the most significant degradation (sheet resistance increase of 894%) upon annealing at 300°C. Specimens with smaller grains (17.3±6.4 nm) and low residual stress (41.6 MPa) or cracks showed no increase in sheet resistance after annealing at 300°C. The microstructural evaluation showed that residual stress of Cu affects the grain growth rate during annealing, which is closely related to the Cu/Si interdiffusion behavior.

Exploring the impact of intensity and duration of Cu (II) depression on aniline-degrading biosystem: Performance, sludge activity and microbial diversity

To evaluate the ecological risk of aniline wastewater biodegradation, the aniline wastewater (200 mg/L) was treated in this work under the stress of Cu (II) at 3, 6 and 10 mg/L, respectively. The slight fluctuation of aniline-degrading performance and the significant inhibition of nitrogen removal was caused by the Cu (II) stress at below 6 mg/L. Meanwhile, the tolerance of nitrifying performance to Cu (II) was higher than denitrifying. The collapse of biosystem was caused by the Cu (II) stress at 10 mg/L and the decontamination function was disabled within 8 days. The activity and stability of sludge declined under the increase of Cu (II) content. Microbial diversity results demonstrated that the genera with heavy-metal tolerance represented by Zoogloea and Azospira significantly dominated under the continuously Cu (II) stress. Whereas, the biosystem with these dominant genera did not achieve the comparable aniline and nitrogen removal performance as the control group.

Stress tuning in sputter-grown Cu and W films for Cu/W nanomultilayer design

Controlling growth stresses during thin film fabrication is of paramount importance to solve reliability issues during operation of functional thin films in harsh environments. A combination of different methods for thin-film stress determination, such as in situ wafer curvature and ex situ x-ray diffraction, is usually required to reveal and tailor growth stresses in thin film systems, as well as to extract interface stress contributions in multilayered coatings. In this article, the tuning of intrinsic growth stresses in thin films of Cu and W, as grown by magnetron sputtering, was performed by varying the Ar pressure and gun power during thin-film deposition. The average growth stress in Cu and W thin films could be tuned between tensile and compressive. Next, the thus obtained knowledge on stress engineering of Cu and W single layers was applied to investigate the corresponding intrinsic stresses in Cu/W nanomultilayer coatings, for which interface stress was found to play an important role.

Different dissolved organic matters regulate the bioavailability of heavy metals and rhizosphere microbial activity in a plant-wetland soil system

Dissolved organic matter (DOM) and hydrologic conditions significantly influences the migration and transformation of heavy metals, especially in wetland soil. However, there still remains challenge in understanding how the DOM from different sources regulates the bioavailability of heavy metals, enzyme activity and microbial activity. In this study, we investigated the effects of natural DOM (NDOM, extraction of Carex cinerascens) and artificial DOM (Humic acids, HA) on microbial community and bioavailability of Cu and Pb in wetland soils of Poyang Lake under wetted and flooded conditions. The results demonstrated that the pH increased from 5.5 to 6.4 while Eh decreased from 95.8 to 31.6 mV to maximum extent after applying HA under flooded condition. Although planting C. cinerascens improved the soil quality under the stress of Cu and Pb, the use of HA restrained this effect except for Pb under wetted condition, demonstrating the intake of exogenous DOM increased the bioavailability of metals under flooded condition. However, the activities of catalase and urease in soil were markedly enhanced due to the implication of DOM, which increased more under the wetted condition as compared to the flooded condition. Similar phenomenon was found in chlorophyll. In addition, microbial diversity and community could be promoted by the application of HA. Diethylenetriamine pentaacetic acid -Cu (DTPA-Cu), pH and flooded condition might significantly influence the bacterial composition. Therefore, this research presents valuable theoretical basis for remediation of heavy metals and effects of DOM and hydrologic condition on microorganism in plant-wetland soil system.

Research on the hot deformation behavior of Cu-20 wt%W composite under different temperatures

In this article, in order to study the hot deformation behavior of Cu-20 wt%W composite and reveal the strengthening mechanism of W particles, Cu-20 wt%W composite with a high relative density of 94.87% was prepared via spray drying technology and spark plasma sintering method. The tungsten particles have a good bond with the copper matrix because of the diffusion layer. Thus the Vickers hardness of Cu-20 wt%W composite is 120 HV, which is 110.52% higher than that of pure Cu, and the compression yield strength of Cu-20 wt%W composite at room temperature is 338 MPa, 338.96% higher than that of pure Cu. Meanwhile, the hot deformation behaviors of Cu-20 wt%W and Cu samples at 300–600 °C with a strain rate of 0.01 s-1 were studied in detail, and the critical strains of dynamic recrystallization were calculated. The tungsten particles can pin and accumulate the dislocations to result in high dislocation density and high recrystallization force, thus the critical strain values of Cu-20 wt%W composite under different temperatures are lower in comparison with the corresponding values of Cu. Furthermore, the Cu-20 wt%W composite is not as sensitive as Cu samples to elevated temperatures, and the tungsten particles can improve the high-temperature stability of Cu–W composites. When the deformation temperature is 300 °C, the peak stresses of Cu and Cu-20 wt%W composite are 198.44 MPa and 223.46 MPa respectively, and the peak stress value of Cu-20 wt%W composite is only 12.61% higher than that of Cu. However, when the deformation temperature rises to 600 °C, the peak stress percentage increment in Cu-20 wt%W composite compared with pure Cu increases to 128.37%.

The effect of the graded bilayer design on the strain depth profiles and microstructure of Cu/W nano-multilayers

The properties and thermal stability of thin films and nano-multilayers (NMLs) are generally governed by the in-depth stress (strain) gradients rather than the average stress state. The effect of strain gradient variation in Cu/W NMLs on the thermal stability between 400 and 800 °C was investigated. The strain distribution in the NML stacks was varied by combining Cu/W bilayers with different Cu and W thicknesses of either 3 or 10 nm. A recently developed method based on in-plane grazing X-ray diffraction was adopted to extract the strain depth profiles. In addition, the evolution of the average stress in the Cu/W NMLs during growth was monitored by an in-situ wafer curvature technique. The mean residual stresses in Cu and W were found to be independent of the disposition of the different Cu/W bilayer substacks. On the contrary, the strain depth profile of the W nanolayers was found to strongly depend on the disposition of Cu/W bilayer substacks in the Cu/W NML, which resulted in different Cu outflow characteristics upon annealing. Moreover, application of different Cu/W bilayer units within the NML stack also provides an innovative pathway for producing Cu/W nanocomposites with graded thermal and mechanical properties.

Work hardening behavior of dual phase copper–iron alloy at low temperature

In-situ neutron diffraction measurements were performed on a cold-rolled copper-iron (Cu–Fe) alloy during tensile tests at 293 K and 150 K. The alloy was composed of face-centered cubic Cu and body-centered cubic Fe. The roles of Cu and Fe on the deformation behavior of alloys were discussed and clarified. The strength and work-hardening rate of the alloy increased with decreasing test temperature. Furthermore, the phase stress of Fe increased considerably with decreasing test temperature; however, the response of this stress to the applied true stress exhibited no dependence on the temperature. The phase stresses of Cu changed only slightly with decreasing test temperature. However, the Cu phase stress response to the applied true stress increased with decreasing test temperature, indicating an increase in the work-hardening rate. The strengthening of Fe and the increase in the work-hardening of Cu contributed to an increase in the strength and work-hardening rate of the Cu–Fe alloy at low temperatures.

Does combined heavy metal stress enhance iron plaque formation and heavy metal bioaccumulation in Kandelia obovata?

Iron plaque (IP) has significant impact on rhizosphere environment, and affects the uptake and translocation of heavy metals in plants. However, information on IP formation and heavy metal bioaccumulation for mangrove plants under combined heavy metal stress is currently limited. Based on a 120-day pot experiment, this study explored the temporal changes of IP formation on root surface of Kandelia obovata, and heavy metal bioaccumulations under combined heavy metal stress of Cu, Pb and Zn. The results showed that IP formations on root tip, middle and basal roots were improved with combined heavy metal stress and treatment time (root tip: 0.49−0.61 mg g−1 to 2.55–4.77 mg g−1; middle root: 0.27−0.31 mg g−1 to 3.01–4.22 mg g−1; basal root: 0.16−0.23 mg g−1 to 2.24–4.10 mg g−1). IP formation was accompanied with improved depositions of Cu and Pb on root surface, regardless of root tip, middle and basal roots. IP and roots deposited large amounts of Cu (24.97–69.52 μg g-1, 9.39–154.75 μg g−1), Pb (8.35–84.53 μg g-1, 12.29–191.49 μg g-1) and Zn (85.71–139.19 μg g-1, 51.07–195.65 μg g−1), inhibiting their translocations to aboveground leaves. Based on subcellular distribution and chemical forms of heavy metals in roots, the improved depositions of phosphate-integrated Cu (6.77 %–25.13 %), oxalate-integrated Pb (34.89 %–57.88 %), as well as pectate- and protein-integrated Zn (14.22 %–35.41 %) were detected in root cell vacuoles. In conclusion, the combined heavy metal stress enhanced IP formation and heavy metals deposition (especially for Cu and Pb) on root surface, and improved their vacuolar sequestration and chelation in roots of K. obovata.

Copper stimulates the incidence of antibiotic resistance, metal resistance and potential pathogens in the gut of black soldier fly larvae

The black soldier fly larvae (BSFL) have been successfully applied to treat various organic wastes. However, the impacts of heavy metals on antibiotic resistance in the BSFL guts are poorly understood. Here, we investigated the effect of copper (exposure concentrations of 0, 100 and 800 mg/kg) on the antibiotic and metal resistance profiles in BSFL guts. A total of 83 antibiotic resistance genes (ARGs), 18 mobile genetic elements (MGEs) and 6 metal resistance genes (MRGs) were observed in larval gut samples. Exposure to Cu remarkably reduced the diversity of ARGs and MGEs, but significantly enhanced the abundances of gut-associated ARGs and MRGs. The levels of MRGs copA, czcA and pbrT were dramatically strengthened after Cu exposure as compared with CK (increased by 2.8–13.5 times). Genera Enterococcus acted as the most predominant potential host of multiple ARG, MGE and MRG subtypes. Meanwhile, high exposure to Cu aggravated the enrichment of potential pathogens in BSFL guts, especially for Escherichia, Enterococcus and Salmonella species. The mantel test and procrustes analysis revealed that the gut microbial communities could be a key determinant for antibiotic and metal resistance. However, no significant positive links were observed between MGEs and ARGs or MRGs, possibly suggesting that MGEs did not play a crucial role in shaping the ARGs or MRGs in BSFL guts under the stress of Cu. These findings extend our understanding on the impact of heavy metals on the gut-associated antibiotic and metal resistome of BSFL.

A novel spectral analysis method for distinguishing heavy metal stress of maize due to copper and lead: RDA and EMD-PSD

Monitoring heavy metal stress in crops via hyperspectral remote sensing technology is an effective way. A new approach, namely the ratio difference of autocorrelation function first derivative (RDA), is proposed to extract characteristic regions of maize leaves spectra for the initially identification on contaminated category of copper (Cu) and lead (Pb). Simultaneously, empirical mode decomposition (EMD) and power spectral density (PSD) are integrated to construct EMD-PSD to visually discrimination on Cu and Pb stress from frequency domain perspective. In our work, pot experiment contaminated by Cu and Pb were designed and carried out, and corresponding chemical data, chlorophyll and spectra of maize leaves were collected. Based on acquired spectra, RDA is used to obtain indicators and characteristic intervals of spectra, and then EMD-PSD is applied to obtain intrinsic mode functions (IMFs) from spectra and PSD maps. Through experimental analysis, the following conclusions are drawn: 1) the red edge and red shoulder region of spectra can be used as candidate on indicator to find the characteristic regions of spectra, and integrated intersection spectral intervals are considerable to distinguish Cu and Pb; 2) PSD maps extracted by EMD-PSD significantly can discriminate stress of Cu and Pb with three-dimensional visualization. This study takes the combination of spectral domain and frequency domain as the exploration point, the stress of Cu and Pb was distinguished by mutual verification based on spectra (group I and group II and 2014 experiment). In summary, the proposed method can identify the weak differences of spectra and distinguish the stress of Cu and Pb qualitatively, which provides a new perspective for the identification of heavy metal stress categories.

Statistical Approach for Understanding the Effect of Specimen Size on the Yield Stress and Its Scattering in Mechanically-Alloyed Cu and ODS-Cu Obtained by Micro-Pillar Compression Test

Oxide Dispersion Strengthening copper (ODS-Cu) alloy has high strength, high thermal conductivity and superior irradiation resistance which are needed for fusion reactor divertor components. In this study, specimen size dependence of the yield stress in Cu and ODS-Cu which were made by mechanical alloying and hot pressing was investigated by micro-pillar compression test. The distributions of yield stress values were different between the sizes, 1, 3 and 5 µm cubic micro-pillars, which can be explained by the inhomogeneous spatial distributions of both the crystallographic grain in matrix and oxide-particles.

Zero Cu valence and superconductivity in high-quality CuxBi2Se3 crystal

In this work, the role of Cu dopants in the development of superconductivity in $\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$ is investigated. A series of $\mathrm{C}{\mathrm{u}}_{x}\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$ ($x=0--0.3$) crystals is grown using the Bridgman method and electrochemical techniques. Based on the observable lattice increases along the $c$ axis, the existence of Cu atoms intercalated in the van der Waals (vdW) gaps in $\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$ is verified by x-ray diffraction, scanning electron microsopy--energy dispersive spectroscopy, and transmission electron microscopy analysis. Furthermore, the chemical state of the Cu is found to be zero valence by characterization of the x-ray photoelectron and Auger electron spectra. The absence of $\mathrm{C}{\mathrm{u}}^{1+}$ and $\mathrm{C}{\mathrm{u}}^{2+}$ in the electron energy-loss spectroscopy near-edge fine structure is confirmed as well. Meanwhile, our Raman data also show the same result: the intercalation of Cu in the vdW gap which weakens the binding of the quintuple layers in the $\mathrm{C}{\mathrm{u}}_{0.1}\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$ crystal. The electric resistance and magnetic susceptibility show a superconducting transition near 3--3.4 K in the series of Cu-doped $\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$. A sharp superconducting transition with the highest value of ${T}_{C}=3.4\phantom{\rule{0.16em}{0ex}}\mathrm{K}$ and the largest magnetic shielding fraction of 84% is observed in the optimized 10% Cu-doped $\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$. These results imply that the formation of superconducting quasiparticles is not related to the charge transfer of Cu, but is supported by the internal stress of Cu intercalated in the van der Waals gap. The superconducting transition observed in the specific heat implies that the superconductivity in $\mathrm{C}{\mathrm{u}}_{x}\mathrm{B}{\mathrm{i}}_{2}\mathrm{S}{\mathrm{e}}_{3}$ is unconventional.

Topography and residual stress analysis for Cu/Au/Co multilayered system

Residual stresses, microstructure and the surface topography of a substrate play a crucial role in the optimization of any electrodeposition process. To address this significant but often neglected problem, a detailed research focused on investigation of residual stresses in a Cu polycrystalline substrate electrochemically covered by a thin Au layer and Co coating was conducted. Additionally, the evolution of the microstructure, crystallographic texture and surface topography for the substrate and deposited layers were characterized. While the standard X-ray diffraction method showed insignificant residual stress in the Cu substrate, the multireflection X-ray diffraction methodology allowed us to determine small compressive depth-dependent residual stresses in Cu, close to the interface, when thin Co coating was deposited. Those stresses relaxed for longer deposition time, i.e. for ticker Co coating. The character of the stress distribution and microstructural investigations suggest that the stresses were generated in the Co coating due to coalescence of deposited islands.