Abstract

The properties and thermal stability of thin films and nano-multilayers (NMLs) are generally governed by the in-depth stress (strain) gradients rather than the average stress state. The effect of strain gradient variation in Cu/W NMLs on the thermal stability between 400 and 800 °C was investigated. The strain distribution in the NML stacks was varied by combining Cu/W bilayers with different Cu and W thicknesses of either 3 or 10 nm. A recently developed method based on in-plane grazing X-ray diffraction was adopted to extract the strain depth profiles. In addition, the evolution of the average stress in the Cu/W NMLs during growth was monitored by an in-situ wafer curvature technique. The mean residual stresses in Cu and W were found to be independent of the disposition of the different Cu/W bilayer substacks. On the contrary, the strain depth profile of the W nanolayers was found to strongly depend on the disposition of Cu/W bilayer substacks in the Cu/W NML, which resulted in different Cu outflow characteristics upon annealing. Moreover, application of different Cu/W bilayer units within the NML stack also provides an innovative pathway for producing Cu/W nanocomposites with graded thermal and mechanical properties.

Highlights

  • Nano-multilayers (NMLs) are functional architectures which combine nanometer size layers, whose physical properties can be tailored by smart microstructural and interfacial design [1]

  • For comparison the scanning electron microscopy (SEM) image of the surface of Sub + {10Cu/3W} NML with OTB annealed at 600 °C is presented, where it can be seen that the amount of Cu particles is sufficiently smaller

  • The strain depth profiles in NMLs were for the first time experimentally accessed by an innovative experimental-modelling approach and compared to the stress measured by the substrate curvature measured during the different nanolayer deposition steps

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Summary

Introduction

Nano-multilayers (NMLs) are functional architectures which combine nanometer size layers, whose physical properties can be tailored by smart microstructural and interfacial design [1]. These nanomaterials are of great scientific and technological interest, since their nanolaminated architecture offers very flexible design criteria to achieve a unique combination of optical [2,3], magnetic [4,5], mechanical properties [6,7,8], thermal and electronic conductivity for microelectronic devices [9] and radiation tolerance [10]. Adjusting the initial NML microstructure in order to control the stress depth distribution is one of the key challenges for achieving a stable microstructure with the desired functional properties

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