Stiction Problems Research Articles

Fabrication and electrical characterization of graphene formed chemically on nickel nano electro mechanical system (NEMS) switch.

In this work, we successfully fabricated a reliable nano-electro-mechanical system (NEMS) switch with graphene formed chemically on pre-patterned nickel (Ni) film movable beam. Its electrical characteristics were investigated in terms of current-voltage (I-V) and repetitive switching (on/off) properties. The graphene in the movable beam was selectively formed chemically only on the patterned Ni film. Graphene material may help overcome the stiction and reliability problems in nano-electro-mechanical devices. A study on graphene cantilever already has been reported by using only single or multi-layer of transferred graphene. However, the graphene selectively grown on Ni film has not been reported for NEMS switch. The graphene grown on Ni film by chemical vapor deposition method (CVD) were characterized by Raman spectroscopy. The fabricated lateral NEMS switch has w/l/t = 500 nm/20 μm/150 nm as a Ni dimension and an air-gap of -300 nm in lateral direction. The fabricated graphene movable beam formed chemically on Ni film shows reduced pull-in voltage and improved endurance (extended repetitive switching operations).

Monolithic carbon structures including suspended single nanowires and nanomeshes as a sensor platform

With the development of nanomaterial-based nanodevices, it became inevitable to develop cost-effective and simple nanofabrication technologies enabling the formation of nanomaterial assembly in a controllable manner. Herein, we present suspended monolithic carbon single nanowires and nanomeshes bridging two bulk carbon posts, fabricated in a designed manner using two successive UV exposure steps and a single pyrolysis step. The pyrolysis step is accompanied with a significant volume reduction, resulting in the shrinkage of micro-sized photoresist structures into nanoscale carbon structures. Even with the significant elongation of the suspended carbon nanowire induced by the volume reduction of the bulk carbon posts, the resultant tensional stress along the nanowire is not significant but grows along the wire thickness; this tensional stress gradient and the bent supports of the bridge-like carbon nanowire enhance structural robustness and alleviate the stiction problem that suspended nanostructures frequently experience. The feasibility of the suspended carbon nanostructures as a sensor platform was demonstrated by testing its electrochemical behavior, conductivity-temperature relationship, and hydrogen gas sensing capability.

A model for fluid stiction of quickly separating circular plates

Fluid stiction is a force which is created by the average pressure difference between a fluid-filled, narrow, quickly opening gap and the surrounding pressure. It plays a negative role in compressor valve technology and in fast switching valves, since it hinders an immediate response of the valves to a changing driving force situation. In this paper, the axisymmetric fluid stiction problem is studied by analytical mathematical models and experiments performed on a specific test rig. The study shows that the stiction force in narrow gaps is dominated by the viscous flow as described by the Reynolds equation for lubricating gaps and by cavitation which occurs in a centre region if the gap opening speed exceeds a critical value. The cavitation zone first extends and then shrinks and, finally, gives rise to complex oscillation phenomena due to the impact of the fluid when the cavitation zone collapses. It was found experimentally that fluids can create negative pressure for very short time. Measures to limit the stiction force are a large initial gap height or additional fluid supply channels from the surrounding to the gap.

Stress Analysis Using Finite Element Modeling of a Novel RF Microelectromechanical System Shunt Switch Designed on Quartz Substrate for Low-voltage Applications

This paper presents a novel shunt radio frequency microelectromechanical system switch on a quartz substrate with stiff ribs around the membrane. The buckling effects in the switch membrane and stiction problem are the primary concerns with RF MEMS switches. These effects can be reduced by the proposed design approach due to the stiffness of the ribs around the membrane. A lower mass of the beam and a reduction in the squeeze film damping is achieved due to the slots and holes in the membrane, which further aid in attaining high switching speeds. The proposed switch is optimized to operate in the k-band, which results in a high isolation of -40 dB and low insertion loss of -0.047 dB at 21 GHz, with a low actuation voltage of only 14.6 V needed for the operation the switch. The membrane does not bend with this membrane design approach. Finite element modeling is used to analyze the stress and pull-in voltage.

Polyimide as a versatile enabling material for microsystems fabrication: surface micromachining and electrodeposited nanowires integration

The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems™, involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.

Investigation of Charge Injection and Relaxation in Multilayer Dielectric Stacks for Capacitive RF MEMS Switch Application

This paper proposes a new approach to the problem of irreversible stiction of capacitive radio frequency (RF) microelectromechanical (MEMS) switch attributed to the dielectric charging. We investigate how charge accumulates in multi- and single-layer dielectric structures for a capacitive RF MEMS switch using metal-insulator-semiconductor (MIS) capacitor structure. Two multidielectric-layers are structured, which are SiO2+Si3N4 and SiO2+Si3N4+SiO2 stack films. Meanwhile, Si3N4 single-layer dielectric structure is also fabricated for comparison. In the experiments, the space charges are first injected into the dielectric layers by stressing MIS devices with a dc bias; then the injected charge kinetics are monitored by capacitance-voltage measurement before and after charge injection. We found that the polarity of charge accumulated in the dielectric is strongly influenced by the dielectric structure. When the metal electrode is positively biased, a negative charge accumulates in the single and triple-layer devices, while a positive charge accumulates in the double-layer devices. Furthermore, the experiment results also show that the lowest charge accumulation can be achieved using double-layer dielectric structure even though the fastest relaxation process takes place in triple-layer dielectric structure.

P.68: Reflective Interferometric Modulator Display with Temporal Color Modulation

AbstractE‐paper based on the interferometric principle is gaining popularity as a result of the success of Qualcomm's Mirasol technology. We report an interferometric modulator that realizes primary colors through analog modulation by actuating the movable mirrors in suspension with designated locations and orientation. Colors can be temporally modulated and stiction problems can be avoided.

Cantilever Beam Metal-Contact MEMS Switch

We present a new design of a miniature RF microelectromechanical system (MEMS) metal-contact switch and investigate various aspects associated with lowering the pull-down voltage and overcoming the stiction problem. Lowering the pull-down voltage in this design is based on reducing the spring constant by changing the cantilever beam geometry of the RF MEMS switch, and the stiction problem is overcome by a simple integrated method using two tiny posts located on the substrate at the free end of the cantilever beam.

Molybdenum disulfide dc contact MEMS shunt switch

Atomic force microscopy pulsed force mode verifies that molybdenum disulfide (MoS2) has a smaller surface adhesion energy than graphene. MEMS switches based on MoS2 may have less stiction problems. Suspended MoS2 two-end fixed beams were fabricated, and their mechanical properties including Young's modulus were characterized by atomic force microscope (AFM) indentation. MoS2 dc contact MEMS (micro-electro-mechanical systems) switches were demonstrated with a pull-in voltage of less than 10 V.

Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

This work presents an SU-8 surface micromachining process using amorphous silicon as a sacrificial material, which also incorporates two metal layers for electrical excitation. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic applications due to its mechanical properties, biocompatibility and low cost. Amorphous silicon is used as a sacrificial layer in MEMS applications because it can be deposited in large thicknesses, and can be released in a dry method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using α-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow out-of-plane electrostatic actuation for applications like MEMS switches and variable capacitors. In order to facilitate more flexibility for MEMS designers, the process can fabricate dimples that can be conductive or nonconductive. Additionally, this SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were optimized for two sets of thicknesses: thin (5–10 µm) and thick (130 µm). The process was tested fabricating MEMS switches, capacitors and thermal actuators.

Fabrication of Very-High-Aspect-Ratio Microstructures in Complex Patterns by Photoelectrochemical Etching

We have fabricated very-high-aspect-ratio (VHAR) silicon and metal microstructures in complex geometric patterns. The recently developed surfactant-added tetramethylammonium hydroxide etching allows the formation of V-grooves in any pattern, i.e., not limited by the crystal direction, on a silicon surface. As the resulting sharp pits allow very deep photoelectrochemical etching, VHAR silicon microstructures (4-μm-wide and over-300-μm -deep trenches) are successfully fabricated in complex patterns (spiral and zigzag demonstrated), overcoming the prevailing limitations of simple pores and straight trenches. Furthermore, by filling the VHAR silicon mold with nickel and removing the silicon, high-aspect-ratio metal microstructures of complex patterns are also obtained. These VHAR microstructures in complex patterns, which are structurally much stronger than the simple posts and straight plates, overcome the stiction problem even when densely populated.

Traceable assembly of microparts using optical tweezers

Assembly of components with a size in the order of tens of micrometers or less is difficult because the gravitational forces become smaller than weak forces such as capillary, electrostatic and van der Waals forces. As such, the picked-up components commonly adhere to the manipulator, making the release operation troublesome, and the repeatable supply of components cannot be guaranteed because the magazining and bunkering scheme available in conventional scale assembly cannot be extended to these small objects. Moreover, there are also no effective ways known to deliver the finalized assembly externally. In this paper, we present the manipulation and assembly of microparts using optical tweezers, which by nature do not have stiction problems. Techniques allowing bunkering and finalizing the assembly for exporting are also presented. Finally, we demonstrate an exemplary microassembly formed by assembling two microparts: a movable microring and a microrod fixed on a glass substrate. We believe this traceable microassembly to be an important step forward for micro- and nano-manufacturing.

Nonvolatile Liquid-Film-Embedded Microfluidic Valve for Microscopic Evaporation Control Without Stiction Problem at Liquid–Air Interfaces

A critical problem of quick evaporation speed of fluids in the microscopic scale can cause many unexpected results and failures. Here, we introduce evaporation speed controlling effects of a thin liquid-film-based microfluidic valve in a microfluidic droplet ejector. The thin liquid film with nonvolatility and immiscibility exhibited an excellent microfluidic valve function without any stiction problem between valve components and provided a very effective evaporation protection barrier for the microfluids in the device. We have investigated its effectiveness for evaporation control at a microfluidic port with a liquid-air interface. Successful evaporation control by the liquid-film-embedded microfluidic valve has been demonstrated. We believe that this novel approach has immense potential in many microfluidic devices requiring a high level of evaporation control.

Stiction of Flexural MEMS Structures

A variational method using the principle of virtual work (PVW) is presented to formulate the problem of the microcantilever stiction. Compared with the Rayleigh–Ritz method using the arc-shaped or S-shaped deflection, which prescribes the boundary conditions and thus the deflection shape of a stuck cantilever beam, the new method uses the matching conditions and constraint condition derived from PVW and minimization of the system free energy to describe the boundary conditions at the contact separation point. The transition of the beam deflection from an arc-shape-like one to an S-shape-like one with the increase of the beam length is shown by the new model. The (real) beam deflection given by this new model deviates more or less from either an arc-shape or an S-shape, which has significant impact on the interpretation of experimental data. The arc-shaped or S-shaped deflection assumption ignores the beam bending energy inside the contact area and the elastic energy due to the beam/substrate contact, which is inappropriate as shown by this study. Furthermore, the arc-shaped or S-shaped deflection only approximately describes the deflection shape of a stuck beam with zero external load and obviously, the external load changes the beam deflection. The Rayleigh–Ritz method using the arc-shaped or S-shaped deflection assumption in essence can only be used to tell approximately whether stiction occurs or not. Rather than assuming a certain deflection shape and by incorporating the external load, the new method offers a more general and accurate study not only on the microcantilever beam stiction but also on its de-adherence.

Repulsive Casimir force between silicon dioxide and superconductor

AbstractWe present a detailed investigation of the Casimir interaction between the superconductor Bi2Sr2CaCu2O8+δ (BSCCO) and silicon dioxide with bromobenzene present in between. We found that the dispersion force is repulsive and the magnitude of the force can be changed by varying the thickness of the object and the temperature. The repulsive force would provide a method to deal with stiction problems and provide much significant from the practical point of view. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

A precise model for the shape of an adhered microcantilever

Abstract A variational method using the principle of virtual work (PVW) is presented to formulate the problem of the microcantilever stiction. Compared with the Rayleigh–Ritz method using the arc-shaped or S-shaped deflection, which prescribes the boundary conditions and thus the deflection shape of a stuck cantilever beam, the new method uses the matching conditions and constraint condition derived from PVW and minimization of the system free energy to describe the boundary conditions at the contact separation point. The transition of the beam deflection from an arc-shape-like one to an S-shape-like one with the increase of the beam length is shown by the new model. The (real) beam deflection given by this new model deviates more or less from either an arc-shape or an S-shape, which has significant impact on the interpretation of experimental data. The arc-shaped or S-shaped deflection assumption ignores the beam bending energy inside the contact area and the elastic energy due to the beam/substrate contact, which is inappropriate as shown by this study. Furthermore, the arc-shaped or S-shaped deflection only approximately describes the deflection shape of a stuck beam with zero external load and obviously, the external load changes the beam deflection. The Rayleigh–Ritz method using the arc-shaped or S-shaped deflection assumption in essence can only be used to tell approximately whether stiction occurs or not. Rather than assuming a certain deflection shape and by incorporating the external load, the new method offers a more general and accurate study not only on the microcantilever beam stiction but also on its de-adherence.

A Tube-Shaped Buried Pirani Gauge for Low Detection Limit With Small Footprint

We present a micromachined Pirani gauge that combines low detection limit and strongly reduced footprint. It consists of a tube-shaped resistor that is buried in the silicon substrate. The choice of the tube geometry gives the resistor a very high structural rigidity. This enables the fabrication of much longer resistors, thus shifting the detection limit toward lower pressures. In addition, since the resistor is buried under the silicon surface, its footprint is kept very small. The high stiffness allowed the fabrication of a 3-mm-long and 1.8-μm-thick poly-Si tube with a 1-μm gap without buckling and/or stiction problems. It shows a detection limit of 0.1 Pa for a noise level of 50 μV, and it has a footprint of only 0.012 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . This is an improvement of at least 20 times compared with Pirani gauges with the same detection limit. Pirani tubes of 1.6- and 0.4-mm lengths have also been designed, fabricated, and tested. The 0.4-mm-long tube shows a low pressure limit of 2 Pa, whereas the tube of 1.6 mm shows a low pressure limit of 0.2 Pa. The measured transfer functions correspond very well to the 1-D analytical model.

Design and Implementation of SOI Based Capacitive Microaccelerometers Without Notching Effects

We report our efforts towards designing and fabricating capacitive microaccelerometers with flat bottom surfaces free from the notching effects of Deep Reactive Ion Etching (DRIE) based on SOI process. The substrate layer under the device structure is etched and a metal film is deposited to the backside of moving structure for protecting the bottom surfaces so that the stiction problem and notching effects are avoided. The test results demonstrate that SOI accelerometers have been released successfully. The measured sensitivity is 169.1mV/g and the linearity of output is within 0.202%.

Surface Roughness and Material Optical Properties Influence on Casimir/van der Waals and Capillary Surface Forces

Theory calculations using the Lifshitz theory and atomic force microscopy force measurements show that Casimir/van der Weals dispersive forces have a strong dependence on material optical properties and surface roughness. At separations below 100 nm the roughness effect is manifested through a strong deviation from the normal scaling of the force with separation distance. Moreover, knowledge of precise optical properties of metals is very important for accurate force predictions rather than referring to idealized defect free material models. Finally, we compare the Casimir/van der Weals forces to capillary adhesive forces in order to illustrate their significance in stiction problems, which are important for motion analysis of microelectromechanical (MEMS) systems.

Kinetic Roughening and Material Optical Properties Influence on Van der Waals/Casimir Forces

Atomic force microscopy measurements and force theory calculations using the Lifshitz theory show that van der Waals/Casimir dispersive forces have a strong dependence on surface roughness and material optical properties. It is found that at separations below 100 nm the roughness effect is manifested through a strong deviation from the normal scaling of the force with separation distance. Moreover, knowledge of precise optical properties of metals is shown to be very important for accurate force predictions rather than referring to idealized defect free material models. Finally, we compare the van der Waals/Casimir forces to capillary adhesive forces in order to illustrate their significance in stiction problems.